1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

3. Structure and Composition

Typical construction features:

• Ceramic substrate (Al O or AlN) for thermal stability
• Thin-film or thick-film resistive elements (NiCr, TaN)
• Termination pads with Ag/Pd or Sn/Pb metallization
• Molded epoxy encapsulation (for discrete packages)
• Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

5. Application Fields

• Consumer Electronics: Smartphones (LCD biasing), IoT devices
• Automotive: ECU sensor interfaces, LED lighting control
• Industrial: PLC signal conditioning, precision instrumentation
• Telecommunications: Transmission line termination, RF circuits
• Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

7. Selection Guidelines

1. Calculate required resistance values and tolerances
2. Determine power dissipation requirements per element
3. Assess temperature coefficient needs based on operating environment
4. Select package type compatible with PCB layout and assembly process
5. Consider EMI filtering requirements for high-frequency applications
6. Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

• Miniaturization: 01005-inch footprint arrays for mobile devices
• Increased integration: Embedded passives in SiP modules
• Extended reliability: AEC-Q100 qualified parts for EV systems
• High-precision manufacturing: Laser-trimmed thin-film technology
• Environmental compliance: Halogen-free and RoHS-compliant packages