Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
AF164-FR-0743K2L Yageo	RES ARRAY 4 RES 43.2K OHM 1206	0
77063821P CTS Corporation	RES ARRAY 3 RES 820 OHM 6SIP	0
YC324-FK-07316KL Yageo	RES ARRAY 4 RES 316K OHM 2012	0
742C0431003FP CTS Corporation	RES ARRAY 2 RES 100K OHM 0606	0
CAT25-121JALF J.W. Miller / Bourns	RES ARRAY 8 RES 120 OHM 1608	2000
VSSR1603330GTF Vishay	RES ARRAY 8 RES 33 OHM 16SSOP	0
4420P-2-221 J.W. Miller / Bourns	RES ARRAY 19 RES 220 OHM 20SOIC	0
CAY17-103JALF J.W. Miller / Bourns	RES ARRAY 8 RES 10K OHM 1206	52497
EXB-24V223JX Panasonic	RES ARRAY 2 RES 22K OHM 0404	0
TC164-JR-071ML Yageo	RES ARRAY 4 RES 1M OHM 1206	0
RF062PJ301CS Samsung Electro-Mechanics	RESISTOR ARRAY FLAT TERMINAL 0	0
4306R-104-161/241 J.W. Miller / Bourns	RES NETWORK 8 RES MULT OHM 6SIP	0
AF164-FR-073K4L Yageo	RES ARRAY 4 RES 3.4K OHM 1206	0
TC164-FR-0791RL Yageo	RES ARRAY 4 RES 91 OHM 1206	0
4116R-3-471/681 J.W. Miller / Bourns	RES NTWRK 28 RES MULT OHM 16DIP	0
767163560GP CTS Corporation	RES ARRAY 8 RES 56 OHM 16SOIC	0
MNR18ERAPJ513 ROHM Semiconductor	RES ARRAY 8 RES 51K OHM 1606	2864
YC248-FR-075K11L Yageo	RES ARRAY 8 RES 5.11K OHM 1606	0
Y4485V0569BA9R VPG Foil	RES NETWORK 2 RES MULT OHM 1610	0
YC162-FR-0780K6L Yageo	RES ARRAY 2 RES 80.6K OHM 0606	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages