Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
4308R-104-121/131 J.W. Miller / Bourns	RES NETWORK 12 RES MULT OHM 8SIP	0
741X163270JP CTS Corporation	RES ARRAY 8 RES 27 OHM 1506	0
SOMC1401110RGEA Vishay / Dale	RES ARRAY 13 RES 110 OHM 14SOIC	0
766161151GPTR13 CTS Corporation	RES ARRAY 15 RES 150 OHM 16SOIC	0
RAVF324DJT47K0 Stackpole Electronics, Inc.	RES ARRAY 4 RES 47K OHM 2012	0
4604X-102-825LF J.W. Miller / Bourns	RES ARRAY 2 RES 8.2M OHM 4SIP	0
RM064PJ151CS Samsung Electro-Mechanics	RESISTOR ARRAY INVERTED 0201X4	0
742C083513JP CTS Corporation	RES ARRAY 4 RES 51K OHM 1206	26015
767161331GP CTS Corporation	RES ARRAY 15 RES 330 OHM 16SOIC	1003
TC164-FR-07205KL Yageo	RES ARRAY 4 RES 205K OHM 1206	0
4308H-101-751LF J.W. Miller / Bourns	RES ARRAY 7 RES 750 OHM 8SIP	0
741C083514JP CTS Corporation	RES ARRAY 4 RES 510K OHM 0804	0
742C163390JP CTS Corporation	RES ARRAY 8 RES 39 OHM 2506	0
TC124-FR-072K21L Yageo	RES ARRAY 4 RES 2.21K OHM 0804	0
RMKMS408-5KBB Vishay / Sfernice	SFERNICE THIN FILMS	0
766143684GPTR7 CTS Corporation	RES ARRAY 7 RES 680K OHM 14SOIC	0
YC164-FR-0782RL Yageo	RES ARRAY 4 RES 82 OHM 1206	0
Y4485V0004QT9W VPG Foil	RES NETWORK 2 RES 1K OHM 1610	0
TC124-FR-0791RL Yageo	RES ARRAY 4 RES 91 OHM 0804	0
4606X-102-274LF J.W. Miller / Bourns	RES ARRAY 3 RES 270K OHM 6SIP	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages