Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
767143224GP CTS Corporation	RES ARRAY 7 RES 220K OHM 14SOIC	0
YC248-FR-07215RL Yageo	RES ARRAY 8 RES 215 OHM 1606	0
YC162-FR-07430RL Yageo	RES ARRAY 2 RES 430 OHM 0606	0
4114R-2-221LF J.W. Miller / Bourns	RES ARRAY 13 RES 220 OHM 14DIP	0
4608X-AP1-202LF J.W. Miller / Bourns	RES ARRAY 7 RES 2K OHM 8SIP	0
4306R-101-221 J.W. Miller / Bourns	RES ARRAY 5 RES 220 OHM 6SIP	0
4306R-101-122LF J.W. Miller / Bourns	RES ARRAY 5 RES 1.2K OHM 6SIP	0
YC162-FR-0724R9L Yageo	RES ARRAY 2 RES 24.9 OHM 0606	0
RF062PJ753CS Samsung Electro-Mechanics	RESISTOR ARRAY FLAT TERMINAL 0	0
Y1365V0255BA9U VPG Foil	RES ARRAY 4 RES MULT OHM 8SOIC	0
TC164-FR-07174KL Yageo	RES ARRAY 4 RES 174K OHM 1206	0
742C163101JP CTS Corporation	RES ARRAY 8 RES 100 OHM 2506	18912
YC324-FK-075K76L Yageo	RES ARRAY 4 RES 5.76K OHM 2012	0
742C083103JP CTS Corporation	RES ARRAY 4 RES 10K OHM 1206	462761
EXB-38V822JV Panasonic	RES ARRAY 4 RES 8.2K OHM 1206	13317
CN34F1800CT CAL-CHIP ELECTRONICS INC.	RESARRAY0603X4 1% 180 OHM	5000
YC324-FK-0768R1L Yageo	RES ARRAY 4 RES 68.1 OHM 2012	0
4420P-T02-560 J.W. Miller / Bourns	RES ARRAY 19 RES 56 OHM 20SOIC	0
742C043471JP CTS Corporation	RES ARRAY 2 RES 470 OHM 0606	16370
EXB-28V224JX Panasonic	RES ARRAY 4 RES 220K OHM 0804	34904

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages