Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
YC122-JR-07470RL Yageo	RES ARRAY 2 RES 470 OHM 0404	0
YC122-JR-0782KL Yageo	RES ARRAY 2 RES 82K OHM 0404	0
CSC05A01680RGPA Vishay / Dale	RES ARRAY 4 RES 680 OHM 5SIP	0
CSC10A03270KGPA Vishay / Dale	RES ARRAY 5 RES 270K OHM 10SIP	0
EXB-38V512JV Panasonic	RES ARRAY 4 RES 5.1K OHM 1206	0
768163202GPTR13 CTS Corporation	RES ARRAY 8 RES 2K OHM 16SOIC	0
YC162-JR-0730KL Yageo	RES ARRAY 2 RES 30K OHM 0606	0
CAT16-4991F4LF J.W. Miller / Bourns	RES ARRAY 4 RES 4.99K OHM 1206	0
766143512GPTR13 CTS Corporation	RES ARRAY 7 RES 5.1K OHM 14SOIC	0
746X101223JP CTS Corporation	RES ARRAY 8 RES 22K OHM 1206	1
741C083123JP CTS Corporation	RES ARRAY 4 RES 12K OHM 0804	0
ORNV25025001TS Vishay	RES NETWORK 5 RES MULT OHM 8SOIC	0
EXB-V8V183JV Panasonic	RES ARRAY 4 RES 18K OHM 1206	9987
YC162-FR-07422RL Yageo	RES ARRAY 2 RES 422 OHM 0606	0
4816P-T02-222LF J.W. Miller / Bourns	RES ARRAY 15 RES 2.2K OHM 16SOIC	1266
RAVF104DFT62K0 Stackpole Electronics, Inc.	RES ARRAY 4 RES 62K OHM 0804	0
4416P-T02-473 J.W. Miller / Bourns	RES ARRAY 15 RES 47K OHM 16SOIC	0
YC122-FR-071K82L Yageo	RES ARRAY 2 RES 1.82K OHM 0404	0
4605X-AP1-103LF J.W. Miller / Bourns	RES ARRAY 4 RES 10K OHM 5SIP	0
4310M-101-473LF J.W. Miller / Bourns	RES ARRAY 9 RES 47K OHM 10SIP	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages