Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
767161122GPTR13 CTS Corporation	RES ARRAY 15 RES 1.2K OHM 16SOIC	0
4114R-1-683 J.W. Miller / Bourns	RES ARRAY 7 RES 68K OHM 14DIP	0
EXB-N8V121JX Panasonic	RES ARRAY 4 RES 120 OHM 0804	15108
CAY16A-822J4LF J.W. Miller / Bourns	RESARRAYA 4X0603 8K2 5% 63MW CON	0
YC158TJR-0720KL Yageo	RES ARRAY 8 RES 20K OHM 1206	0
CAY16-512J4LF J.W. Miller / Bourns	RES ARRAY 4 RES 5.1K OHM 1206	7395
RAVF164DFT2K40 Stackpole Electronics, Inc.	RES ARRAY 4 RES 2.4K OHM 1206	0
YC164-FR-07270RL Yageo	RES ARRAY 4 RES 270 OHM 1206	0
4114R-2-563LF J.W. Miller / Bourns	RES ARRAY 13 RES 56K OHM 14DIP	0
LT5401IMSE#TRPBF Analog Devices, Inc.	MATCHED PRECISION RESISTOR NETWO	0
CRA06P08330R0JTA Vishay / Dale	RES ARRAY 4 RES 30 OHM 1206	0
AF164-FR-0769R8L Yageo	RES ARRAY 4 RES 69.8 OHM 1206	0
RF064PJ131CS Samsung Electro-Mechanics	RESISTOR ARRAY FLAT TERMINAL 0	0
4816P-T02-181 J.W. Miller / Bourns	RES ARRAY 15 RES 180 OHM 16SOIC	0
SOMC160351R0GEA Vishay / Dale	RES ARRAY 8 RES 51 OHM 16SOIC	0
4309R-101-101LF J.W. Miller / Bourns	RES ARRAY 8 RES 100 OHM 9SIP	0
RAVF102DJT33R0 Stackpole Electronics, Inc.	RES ARRAY 2 RES 33 OHM 0404	10000
YC162-FR-0723K2L Yageo	RES ARRAY 2 RES 23.2K OHM 0606	0
767143220GPTR13 CTS Corporation	RES ARRAY 7 RES 22 OHM 14SOIC	0
YC164-JR-0713RL Yageo	RES ARRAY 4 RES 13 OHM 1206	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages