Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
M8340106K1002GCD03 Vishay / Dale	RES ARRAY 9 RES 10K OHM 10SIP	113
ORNTA1003DT1 Vishay	RES ARRAY 4 RES 100K OHM 8SOIC	0
CAY16-1100F4LF J.W. Miller / Bourns	RES ARRAY 4 RES 110 OHM 1206	0
AF164-FR-0782KL Yageo	RES ARRAY 4 RES 82K OHM 1206	0
RM064PJ152CS Samsung Electro-Mechanics	RESISTOR ARRAY INVERTED 0201X4	0
ORNV20022502T1 Vishay	RES NETWORK 5 RES MULT OHM 8SOIC	0
4310R-101-394LF J.W. Miller / Bourns	RES ARRAY 9 RES 390K OHM 10SIP	0
4608X-102-220LF J.W. Miller / Bourns	RES ARRAY 4 RES 22 OHM 8SIP	1803
767143101GP CTS Corporation	RES ARRAY 7 RES 100 OHM 14SOIC	0
4607X-101-560LF J.W. Miller / Bourns	RES ARRAY 6 RES 56 OHM 7SIP	0
EXB-28V120JX Panasonic	RES ARRAY 4 RES 12 OHM 0804	0
EXB-D10C151J Panasonic	RES ARRAY 8 RES 150 OHM 1206	8427
YC162-JR-075K6L Yageo	RES ARRAY 2 RES 5.6K OHM 0606	0
EXB-28V220JX Panasonic	RES ARRAY 4 RES 22 OHM 0804	630168
RAVF164DFT3K90 Stackpole Electronics, Inc.	RES ARRAY 4 RES 3.9K OHM 1206	0
EXB-34V5R1JV Panasonic	RES ARRAY 2 RES 5.1 OHM 0606	0
4308R-102-124 J.W. Miller / Bourns	RES ARRAY 4 RES 120K OHM 8SIP	0
4308R-101-510 J.W. Miller / Bourns	RES ARRAY 7 RES 51 OHM 8SIP	0
AF164-FR-07249RL Yageo	RES ARRAY 4 RES 249 OHM 1206	0
AF164-FR-0722RL Yageo	RES ARRAY 4 RES 22 OHM 1206	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages