I/O Relay Modules

Part Number	Description / PDF	Quantity
DRODC24 Sensata Technologies – Crydom	DC OUTPUT MODULE 3A	0
IDC5 Sensata Technologies – Crydom	DC INPUT MODULE 24V	10
OAC5AH Sensata Technologies – Crydom	AC OUTPUT MODULE 5A	34
IAC5 Sensata Technologies – Crydom	AC INPUT MODULE 120V	25
C4ODC Sensata Technologies – Crydom	DC OUTPUT MODULE 3A	68
M-ODC5M-L Sensata Technologies – Crydom	DC OUTPUT MODULE 1A	0
6131 Sensata Technologies – Crydom	DC INPUT MODULE 24V	0
MODC5F Sensata Technologies – Crydom	DC OUTPUT MODULE 3A	0
84110210 Sensata Technologies – Crydom	DC INPUT MODULE 24V	0
84110410 Sensata Technologies – Crydom	AC OUTPUT MODULE 3.5A	0
OAC24RN Sensata Technologies – Crydom	AC OUTPUT MODULE 3.5A	0
ODC5A Sensata Technologies – Crydom	DC OUTPUT MODULE 1A	0
DMP6301A Sensata Technologies – Crydom	DC OUTPUT MODULE 3A	0
IAC5AQ Sensata Technologies – Crydom	AC INPUT MODULE 240V	0
6401A Sensata Technologies – Crydom	AC OUTPUT MODULE 3A	0
ODC5Q Sensata Technologies – Crydom	DC OUTPUT MODULE 3A	0
IDC5Q Sensata Technologies – Crydom	DC INPUT MODULE 12-60V	0
OAC24A Sensata Technologies – Crydom	AC OUTPUT MODULE 3.5A	0
M-ODC24A Sensata Technologies – Crydom	DC OUTPUT MODULE 1A	0
SM-IDC15D Sensata Technologies – Crydom	DC INPUT MODULE 24V	0

I/O Relay Modules

1. Overview

I/O Relay Modules (Input/Output Relay Modules) are electronic devices that enable signal conversion and electrical isolation between control systems and external equipment. They act as intermediaries to control high-power circuits using low-power signals, playing a critical role in automation systems, industrial machinery, and smart infrastructure. These modules ensure safe and reliable switching operations in applications ranging from factory automation to renewable energy systems.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Electromagnetic Relays	Mechanical switching via electromagnetic coils, high current capacity	Industrial motor control, HVAC systems
Solid-State Relays (SSR)	No moving parts, fast switching, low EMI	Temperature control systems, semiconductor equipment
Hybrid Relays	Combines electromagnetic and solid-state advantages	Precision manufacturing, aerospace systems
Programmable Relays	User-configurable logic functions	Custom automation systems, R&D equipment
Smart Relays	Integrated sensors, IoT connectivity, self-diagnosis	Smart grids, predictive maintenance systems

3. Structure and Components

A typical I/O Relay Module consists of:

Housing: Flame-retardant polymer casing (UL 94 V-0 rated)
Contact System: Silver alloy for low resistance (AgSnO typical)
Coil Assembly: Copper winding with thermal class F insulation
Drive Circuitry: Transistor-based drivers for DC types or zero-crossing detection for AC
Isolation Layer: Reinforced insulation barrier (2500 Vrms basic insulation)

4. Key Technical Specifications

Parameter	Significance	Typical Range
Rated Voltage	Determines application circuit compatibility	5VDC-250VAC
Current Rating	Affects power handling capability	1A-100A
Switching Speed	Critical for real-time control systems	0.5ms-20ms
Electrical Life	Directly impacts maintenance intervals	10 - 10 operations
Insulation Resistance	Ensures safety isolation	>100M @ 500VDC

5. Application Areas

Industrial Automation: PLC systems, assembly line robots
Energy Systems: Smart grid controllers, solar inverters
Transportation: Railway signaling, EV charging stations
Medical Equipment: Diagnostic imaging systems, infusion pumps

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
Omron	MY2N-J	30A rating, LED status indicator
Siemens	SIMATIC ET 200	PROFINET interface, hot-swappable
Schneider Electric	Zelio SR2	Programmable, LCD display
ABB	AF250-30L	Energy-efficient coil, 125kHz switching
Phoenix Contact	PSR-SCP-24DC-CT	Safe separation, configurable delay

7. Selection Recommendations

Key considerations include:

Match voltage/current ratings with load requirements (125% safety margin recommended)
Environmental factors: operating temperature (-40 C to +85 C typical)
Mounting type: PCB, DIN rail, or panel mount
Communication protocol compatibility (Modbus, EtherCAT, etc.)
Failure Mode Analysis: Choose failsafe configuration per application needs

8. Industry Trends

Emerging developments include:

Integration with IIoT protocols (OPC UA, MQTT)
Miniaturization: 30% size reduction in 2023 models
Energy efficiency improvements: >85% coil power reduction
AI-enabled predictive maintenance features
Increased adoption of wide bandgap semiconductors in SSRs

Application Case Study

A automotive manufacturing plant implemented Omron MY4NJ relays in robotic welding systems, achieving:

40% reduction in switching-related downtime
25% energy savings through optimized coil drive
Integration with existing PROFINET network