I/O Relay Modules

Image Part Number Description / PDF Quantity Rfq
SLO24CRA4

SLO24CRA4

Weidmuller

DC OUTPUT MODULE 4A

0

EXI250CH

EXI250CH

Weidmuller

DELCON IN PI RELAY 250VDC

0

EXO24CH

EXO24CH

Weidmuller

DELCON 24VDCIN/0-60VDC 3A OUT

4

EXO12CHXSN

EXO12CHXSN

Weidmuller

DELCON 12VDCIN/0-24VDC 10A OUT

0

EXI24CHL

EXI24CHL

Weidmuller

DELCON 24VDCIN/28VDC 0.05A OUT

0

EXI48CH

EXI48CH

Weidmuller

DELCON 48VDC INPUT PLUG IN RLY

0

SLI120CRP

SLI120CRP

Weidmuller

AC INPUT MODULE 120V

8

SLO120CRA

SLO120CRA

Weidmuller

DC OUTPUT MODULE 1.8A

0

EXO24TH

EXO24TH

Weidmuller

DELCON 24VDCIN/0-240VAC 3A SN

0

SLO24CRA

SLO24CRA

Weidmuller

DC OUTPUT MODULE 1.8A

0

EXI25CH

EXI25CH

Weidmuller

DELCON 24VAC INPUT PLUG IN RLY

0

EXO48CHA

EXO48CHA

Weidmuller

DELCON PL RL 48VDC 250VDC 1.8A

0

EXI120CHI

EXI120CHI

Weidmuller

DELCON 120VAC INPUT PLUG IN RL

0

SLO24CRX

SLO24CRX

Weidmuller

DC OUTPUT MODULE 10A

0

SLI250CH

SLI250CH

Weidmuller

DC INPUT MODULE 250V

0

SLI250CR

SLI250CR

Weidmuller

DC INPUT MODULE 250V

6

EXO12CHA

EXO12CHA

Weidmuller

DELCON 12VDCIN/0-250VDC 1.8A

0

EXO12TH

EXO12TH

Weidmuller

DELCON 12VDCIN/0-240VAC 3A OUT

0

EXO48CHXSN

EXO48CHXSN

Weidmuller

DELCON DN RL 48VDC 24VDC 10A

0

SLO24CRSN

SLO24CRSN

Weidmuller

DC OUTPUT MODULE 3A

0

I/O Relay Modules

1. Overview

I/O Relay Modules (Input/Output Relay Modules) are electronic devices that enable signal conversion and electrical isolation between control systems and external equipment. They act as intermediaries to control high-power circuits using low-power signals, playing a critical role in automation systems, industrial machinery, and smart infrastructure. These modules ensure safe and reliable switching operations in applications ranging from factory automation to renewable energy systems.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Electromagnetic RelaysMechanical switching via electromagnetic coils, high current capacityIndustrial motor control, HVAC systems
Solid-State Relays (SSR)No moving parts, fast switching, low EMITemperature control systems, semiconductor equipment
Hybrid RelaysCombines electromagnetic and solid-state advantagesPrecision manufacturing, aerospace systems
Programmable RelaysUser-configurable logic functionsCustom automation systems, R&D equipment
Smart RelaysIntegrated sensors, IoT connectivity, self-diagnosisSmart grids, predictive maintenance systems

3. Structure and Components

A typical I/O Relay Module consists of:

  • Housing: Flame-retardant polymer casing (UL 94 V-0 rated)
  • Contact System: Silver alloy for low resistance (AgSnO typical)
  • Coil Assembly: Copper winding with thermal class F insulation
  • Drive Circuitry: Transistor-based drivers for DC types or zero-crossing detection for AC
  • Isolation Layer: Reinforced insulation barrier (2500 Vrms basic insulation)

4. Key Technical Specifications

ParameterSignificanceTypical Range
Rated VoltageDetermines application circuit compatibility5VDC-250VAC
Current RatingAffects power handling capability1A-100A
Switching SpeedCritical for real-time control systems0.5ms-20ms
Electrical LifeDirectly impacts maintenance intervals10 - 10 operations
Insulation ResistanceEnsures safety isolation>100M @ 500VDC

5. Application Areas

  • Industrial Automation: PLC systems, assembly line robots
  • Energy Systems: Smart grid controllers, solar inverters
  • Transportation: Railway signaling, EV charging stations
  • Medical Equipment: Diagnostic imaging systems, infusion pumps

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
OmronMY2N-J30A rating, LED status indicator
SiemensSIMATIC ET 200PROFINET interface, hot-swappable
Schneider ElectricZelio SR2Programmable, LCD display
ABBAF250-30LEnergy-efficient coil, 125kHz switching
Phoenix ContactPSR-SCP-24DC-CTSafe separation, configurable delay

7. Selection Recommendations

Key considerations include:

  • Match voltage/current ratings with load requirements (125% safety margin recommended)
  • Environmental factors: operating temperature (-40 C to +85 C typical)
  • Mounting type: PCB, DIN rail, or panel mount
  • Communication protocol compatibility (Modbus, EtherCAT, etc.)
  • Failure Mode Analysis: Choose failsafe configuration per application needs

8. Industry Trends

Emerging developments include:

  • Integration with IIoT protocols (OPC UA, MQTT)
  • Miniaturization: 30% size reduction in 2023 models
  • Energy efficiency improvements: >85% coil power reduction
  • AI-enabled predictive maintenance features
  • Increased adoption of wide bandgap semiconductors in SSRs

Application Case Study

A automotive manufacturing plant implemented Omron MY4NJ relays in robotic welding systems, achieving:

  • 40% reduction in switching-related downtime
  • 25% energy savings through optimized coil drive
  • Integration with existing PROFINET network
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