Solderless Breadboards

Part Number	Description / PDF	Quantity
923297-I 3M	BREADBRD TRM STRP 0.63X0.2" 20PC	0
922327 3M	BREADBOARD ASSEMBLY 8.00X9.25"	0
923749-I 3M	BREADBOARD TERM STRIP 4.90X2.25"	0
923299-I 3M	BREADBOARD TERMINAL STRIP 20PC	0
923292-I 3M	BREADBOARD TERM STRIP 6.50X0.63"	5
922336 3M	BREADBRD ASSEMBLY 10.25X9.25"	18
923273-I 3M	BREADBOARD TERM STRIP 1.80X1.36"	7
922309 3M	BREADBOARD ASSEMBLY 7.00X4.00"	84
922318 3M	BREADBOARD ASSEMBLY 7.75X6.25"	37
923281-I 3M	BREADBOARD DISTI BUS 4.90X0.35"	0
923265-I 3M	BREADBOARD TERM STRIP 4.90X1.36"	0
922306 3M	BREADBOARD ASSEMBLY 5.40X4.00"	26
923277-I 3M	BREADBOARD DISTI BUS 6.50X0.35"	0
923269-I 3M	BREADBOARD TERM STRIP 3.50X1.36"	40
923285-I 3M	BREADBOARD DISTI BUS 3.50X0.35"	24
922345 3M	BREADBRD ASSEMBLY 12.44X9.75"	9
922354 3M	BREADBRD ASSEMBLY 14.69X9.75"	11
923253-I 3M	BREADBOARD TERM STRIP 4.90X2.25"	42
923252-I 3M	BREADBOARD TERM STRIP 6.50X2.25"	28
923261-I 3M	BREADBOARD TERM STRIP 6.50X1.36"	0

Solderless Breadboards

1. Overview

Solderless breadboards are reusable electronic prototyping tools that enable rapid circuit assembly without requiring soldering. They utilize spring-loaded contacts to temporarily connect components, offering a cost-effective platform for testing and development. These boards are essential in modern electronics engineering, education, and DIY projects due to their flexibility, reusability, and ease of use.

2. Major Types & Functional Classification

Type	Functional Characteristics	Application Examples
Half-Size Breadboard	400-600 tie points, single power rail	Basic electronics education, small-scale prototyping
Full-Size Breadboard	800+ tie points, dual power rails	Complex circuit development, embedded system testing
Mini Breadboard	170-300 tie points, compact design	Portable projects, sensor integration
Modular Breadboard	Connectable units with bus expansion	Scalable IoT device prototyping
Stackable Breadboard	Vertical expansion capability	Multilayer system development

3. Structure & Composition

Typical construction features:

ABS plastic base with 0.1" grid spacing
Phosphor bronze contacts with gold plating
Embedded bus strips (typically 2x5 rows)
Component retention springs (28-32 AWG compatibility)
Polarized power distribution rails
Anti-static surface treatment

4. Key Technical Specifications

Parameter	Typical Value	Significance
Contact Resistance	<1	Ensures signal integrity
Current Capacity	1-5A per node	Determines power handling
Voltage Range	0-30V DC	Defines operational safety
Insertion Force	50-150gF	Affects component durability
Terminal Durability	10,000+ insertions	Dictates product lifespan
Temperature Range	-20 C to +70 C	Environmental stability

5. Application Domains

Primary industries and typical equipment:

Education: Student lab kits, STEM training platforms
Industrial R&D: Sensor network prototyping, control system development
Consumer Electronics: Wearable device testing, IoT gateway development
Robotics: Motor driver testing, sensor fusion prototyping
Research: Analog/digital circuit validation, failure analysis

6. Leading Manufacturers & Products

Manufacturer	Key Product Series	Technical Highlights
Elegoo	EL-140088	830-point full-size board with dual power rails
SparkFun	DEV-12002	Stackable design with 630 tie points
Fritzing	MB102-01	Surface-mount compatible bus system
Bud Industries	431 Series	Industrial-grade contacts with EMI shielding

7. Selection Recommendations

Key considerations:

Project complexity vs. node count requirement
Power distribution needs (single/dual rails)
Component compatibility (through-hole/SMD)
Environmental factors (temperature/humidity)
Expansion requirements (modular connectivity)
Budget constraints vs. durability specifications

8. Industry Trends Analysis

Current development directions include:

Miniaturization with high-density interconnects
Integration of built-in measurement circuits
Smart breadboards with IoT connectivity
Eco-friendly materials with RoHS compliance
Improved contact systems for high-frequency applications
Standardization of modular expansion interfaces

Market growth driven by increasing demand in educational robotics, rapid prototyping services, and decentralized development environments.