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Solderless Breadboards

Image Part Number Description / PDF Quantity Rfq
TW-E41-1060

TW-E41-1060

Twin Industries

BREADBOARD ASSEM 6.9X5.7" 140PC

123
1487

1487

Pololu Corporation

170-POINT BREADBOARD (BLACK)

139
64

64

Adafruit

BREADBOARD TERM STRIP 3.40X2.20"

449
PB-105T

PB-105T

Global Specialties

TRNSPRNT PROTO-BRD 4880 TIE PNT

8
923277-I

923277-I

3M

BREADBOARD DISTI BUS 6.50X0.35"

0
923269-I

923269-I

3M

BREADBOARD TERM STRIP 3.50X1.36"

40
PRT-11317

PRT-11317

SparkFun

BREADBOARD TERM STRIP 3.29X2.15"

0
MIKROE-1141

MIKROE-1141

MikroElektronika

BREADBOARD MINI SELF-ADHESIVE BL

28
923285-I

923285-I

3M

BREADBOARD DISTI BUS 3.50X0.35"

24
319030002

319030002

Seeed

BASIC BREAD BOARD 16.5*5.5 CM

0
MIKROE-1097

MIKROE-1097

MikroElektronika

BREADBOARD TERMINAL STRIP

77
OB2-M

OB2-M

Twin Industries

MODULE SOLDERLESS 5X8

38
TW-E40-1020

TW-E40-1020

Twin Industries

BREADBOARD TERM STRIP 6.50X2.14"

1696
TW-E40-510-P

TW-E40-510-P

Twin Industries

BREADBOARD HIGH TEMP 3.30X2.14"

83
4539

4539

Adafruit

HALF-SIZE BREADBOARD WITH MOUNTI

0
BB-32650-W

BB-32650-W

Bud Industries, Inc.

BREADBRD DBL STRIP 70TIE-PTS WHT

525899
922345

922345

3M

BREADBRD ASSEMBLY 12.44X9.75"

9
BB-32655

BB-32655

Bud Industries, Inc.

BREADBOARD TERM STRIP 6.50X2.15"

242580
922354

922354

3M

BREADBRD ASSEMBLY 14.69X9.75"

11
PRT-12045

PRT-12045

SparkFun

BREADBOARD TERM STRIP 1.85X1.38"

0

Solderless Breadboards

1. Overview

Solderless breadboards are reusable electronic prototyping tools that enable rapid circuit assembly without requiring soldering. They utilize spring-loaded contacts to temporarily connect components, offering a cost-effective platform for testing and development. These boards are essential in modern electronics engineering, education, and DIY projects due to their flexibility, reusability, and ease of use.

2. Major Types & Functional Classification

TypeFunctional CharacteristicsApplication Examples
Half-Size Breadboard400-600 tie points, single power railBasic electronics education, small-scale prototyping
Full-Size Breadboard800+ tie points, dual power railsComplex circuit development, embedded system testing
Mini Breadboard170-300 tie points, compact designPortable projects, sensor integration
Modular BreadboardConnectable units with bus expansionScalable IoT device prototyping
Stackable BreadboardVertical expansion capabilityMultilayer system development

3. Structure & Composition

Typical construction features:

  • ABS plastic base with 0.1" grid spacing
  • Phosphor bronze contacts with gold plating
  • Embedded bus strips (typically 2x5 rows)
  • Component retention springs (28-32 AWG compatibility)
  • Polarized power distribution rails
  • Anti-static surface treatment

4. Key Technical Specifications

ParameterTypical ValueSignificance
Contact Resistance<1 Ensures signal integrity
Current Capacity1-5A per nodeDetermines power handling
Voltage Range0-30V DCDefines operational safety
Insertion Force50-150gFAffects component durability
Terminal Durability10,000+ insertionsDictates product lifespan
Temperature Range-20 C to +70 CEnvironmental stability

5. Application Domains

Primary industries and typical equipment:

  • Education: Student lab kits, STEM training platforms
  • Industrial R&D: Sensor network prototyping, control system development
  • Consumer Electronics: Wearable device testing, IoT gateway development
  • Robotics: Motor driver testing, sensor fusion prototyping
  • Research: Analog/digital circuit validation, failure analysis

6. Leading Manufacturers & Products

ManufacturerKey Product SeriesTechnical Highlights
ElegooEL-140088830-point full-size board with dual power rails
SparkFunDEV-12002Stackable design with 630 tie points
FritzingMB102-01Surface-mount compatible bus system
Bud Industries431 SeriesIndustrial-grade contacts with EMI shielding

7. Selection Recommendations

Key considerations:

  • Project complexity vs. node count requirement
  • Power distribution needs (single/dual rails)
  • Component compatibility (through-hole/SMD)
  • Environmental factors (temperature/humidity)
  • Expansion requirements (modular connectivity)
  • Budget constraints vs. durability specifications

8. Industry Trends Analysis

Current development directions include:

  • Miniaturization with high-density interconnects
  • Integration of built-in measurement circuits
  • Smart breadboards with IoT connectivity
  • Eco-friendly materials with RoHS compliance
  • Improved contact systems for high-frequency applications
  • Standardization of modular expansion interfaces

Market growth driven by increasing demand in educational robotics, rapid prototyping services, and decentralized development environments.

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