Etching and Fabrication Equipment

Part Number	Description / PDF	Quantity
CM1 ITW Chemtronics (Chemtronics)	SOLDER MASK	0
CWF8 ITW Chemtronics (Chemtronics)	SOLDER MASK	0
CHV8 ITW Chemtronics (Chemtronics)	SOLDER MASK	0
CNA8 ITW Chemtronics (Chemtronics)	SOLDER MASK	0
CLF8 ITW Chemtronics (Chemtronics)	SOLDER MASK	0
CM8 ITW Chemtronics (Chemtronics)	CHEMASK PEELABLE	280
CW8 ITW Chemtronics (Chemtronics)	SOLDER MASK	0
CMHT8 ITW Chemtronics (Chemtronics)	SOLDER MASK	0
CMAQ8 ITW Chemtronics (Chemtronics)	SOLDER MASK	0
CMAQ1 ITW Chemtronics (Chemtronics)	SOLDER MASK	0
CMHT1 ITW Chemtronics (Chemtronics)	SOLDER MASK	0

Etching and Fabrication Equipment

1. Overview

Etching and fabrication equipment refers to industrial systems that remove material layers or shape components through chemical, plasma, or laser processes. These tools enable precise pattern transfer and material modification at micro/nano scales, serving as critical infrastructure for semiconductor manufacturing, printed circuit boards (PCB), MEMS devices, and advanced display production. Their development directly impacts miniaturization trends in electronics and photonics industries.

2. Major Types and Functional Classification

Type	Functional Features	Application Examples
Wet Etching Systems	Chemical bath processing with isotropic etching characteristics	Through-silicon via (TSV) formation in 3D ICs
Plasma Etching Tools	Dry etching using reactive ion species with directional control	Advanced node transistor gate patterning
Laser Micromachining Systems	Non-contact ablation with sub-micron precision	Flexible PCB contour cutting for mobile devices
Photoresist Coaters	Uniform photo-sensitive material deposition	CMOS image sensor fabrication

3. Structural and Technical Composition

Typical systems integrate multiple subsystems: reaction chambers with environmental control (pressure/temperature), precision motion stages ( 1 m accuracy), delivery systems for process gases/liquids, and computerized process control units. Advanced models incorporate AI-driven process optimization algorithms and real-time monitoring sensors for nanoscale uniformity maintenance.

4. Key Technical Specifications

Parameter	Significance
Etch Rate ( /min)	Determines throughput and production efficiency
Critical Dimension Control (nm)	Defines achievable feature size precision
Aspect Ratio Capability	Enables high-density structure fabrication
Material Selectivity	Prevents unwanted layer removal
Process Uniformity (%)	Ensures wafer-scale manufacturing consistency

5. Application Fields

Semiconductor: 5nm node FinFET gate etching
Display: OLED panel fine metal mask patterning
Medical: MEMS-based biosensor fabrication
Automotive: Power device trench etching for EVs

6. Leading Manufacturers and Representative Products

Manufacturer	Country	Product Example
Applied Materials	USA	Centura Prime Etch System
Lam Research	USA	KLAton 2900 Plasma Etcher
ASML	Netherlands	HMI eScan 1000 Mask Writer
Disco Corporation	Japan	D-FINE1000 Laser Processing System

7. Selection Recommendations

Key considerations:
- Process compatibility with target materials (e.g., silicon vs. compound semiconductors)
- Scaling requirements: R&D tools (4-6" wafers) vs. mass production systems (12")
- Operating cost analysis: Chemical consumption vs. laser source longevity
- Industry case: Apple's iPhone 14 Pro display manufacturing employs Advantech's MLD-III etching system for 15 m line width control

8. Industry Trend Analysis

Market evolution shows three directions: atomic layer etching (ALE) for sub-3nm nodes, hybrid systems combining laser and plasma processes, and green manufacturing solutions reducing chemical waste by 40%. The global market is projected to grow at 7.2% CAGR through 2030, driven by 5G infrastructure and EV semiconductor demands.