Etching and fabrication equipment refers to industrial systems that remove material layers or shape components through chemical, plasma, or laser processes. These tools enable precise pattern transfer and material modification at micro/nano scales, serving as critical infrastructure for semiconductor manufacturing, printed circuit boards (PCB), MEMS devices, and advanced display production. Their development directly impacts miniaturization trends in electronics and photonics industries.
| Type | Functional Features | Application Examples |
|---|---|---|
| Wet Etching Systems | Chemical bath processing with isotropic etching characteristics | Through-silicon via (TSV) formation in 3D ICs |
| Plasma Etching Tools | Dry etching using reactive ion species with directional control | Advanced node transistor gate patterning |
| Laser Micromachining Systems | Non-contact ablation with sub-micron precision | Flexible PCB contour cutting for mobile devices |
| Photoresist Coaters | Uniform photo-sensitive material deposition | CMOS image sensor fabrication |
Typical systems integrate multiple subsystems: reaction chambers with environmental control (pressure/temperature), precision motion stages ( 1 m accuracy), delivery systems for process gases/liquids, and computerized process control units. Advanced models incorporate AI-driven process optimization algorithms and real-time monitoring sensors for nanoscale uniformity maintenance.
| Parameter | Significance |
|---|---|
| Etch Rate ( /min) | Determines throughput and production efficiency |
| Critical Dimension Control (nm) | Defines achievable feature size precision |
| Aspect Ratio Capability | Enables high-density structure fabrication |
| Material Selectivity | Prevents unwanted layer removal |
| Process Uniformity (%) | Ensures wafer-scale manufacturing consistency |
| Manufacturer | Country | Product Example |
|---|---|---|
| Applied Materials | USA | Centura Prime Etch System |
| Lam Research | USA | KLAton 2900 Plasma Etcher |
| ASML | Netherlands | HMI eScan 1000 Mask Writer |
| Disco Corporation | Japan | D-FINE1000 Laser Processing System |
Key considerations:
- Process compatibility with target materials (e.g., silicon vs. compound semiconductors)
- Scaling requirements: R&D tools (4-6" wafers) vs. mass production systems (12")
- Operating cost analysis: Chemical consumption vs. laser source longevity
- Industry case: Apple's iPhone 14 Pro display manufacturing employs Advantech's MLD-III etching system for 15 m line width control
Market evolution shows three directions: atomic layer etching (ALE) for sub-3nm nodes, hybrid systems combining laser and plasma processes, and green manufacturing solutions reducing chemical waste by 40%. The global market is projected to grow at 7.2% CAGR through 2030, driven by 5G infrastructure and EV semiconductor demands.
