Adapter, Breakout Boards

Image	Part Number	Description / PDF	Quantity	Rfq
	GEN-DR127-P40 Chip Quik, Inc.	GENERIC DUAL ROW 1.27MM PITCH 40	0
	GEN-DR065-P40 Chip Quik, Inc.	GENERIC DUAL ROW 0.65MM PITCH 40	0
	DC2413T Chip Quik, Inc.	DISCRETE 2413 TO 300MIL TH ADAPT	0
	DR200D254P14F Chip Quik, Inc.	DUAL ROW 2.00MM PITCH 14-PIN FEM	0
	DR254D254P04 Chip Quik, Inc.	DUAL ROW 2.54MM PITCH 4-PIN TO D	0
	F100T200P05 Chip Quik, Inc.	PITCH CHANGER 1.00 MM TO 2.00 MM	0
	IPC0193 Chip Quik, Inc.	PLCC-68 TO DIP-68 SMT ADAPTER (1	0
	DR100DR254P22 Chip Quik, Inc.	DUAL ROW 1.00MM PITCH 22-PIN TO	0
	IPC0217 Chip Quik, Inc.	QFN-18 TO DIP-22 SMT ADAPTER (0.	0
	IPC0177 Chip Quik, Inc.	TSSOP-48 (LONG PINS) TO DIP-48 S	0
	F127T254P10 Chip Quik, Inc.	PITCH CHANGER 1.27 MM TO 2.54 MM	0
	DR200D254P80 Chip Quik, Inc.	DUAL ROW 2.00MM PITCH 80-PIN TO	0
	DC2010T Chip Quik, Inc.	DISCRETE 2010 TO 300MIL TH ADAPT	0
	DR254D254P14F Chip Quik, Inc.	DUAL ROW 2.54MM PITCH 14-PIN FEM	0
	DR127D254P06M Chip Quik, Inc.	DUAL ROW 1.27MM PITCH 6-PIN MALE	0
	DC2010J Chip Quik, Inc.	DISCRETE 2010 TO TH ADAPTER - JU	0
	DC2924T Chip Quik, Inc.	DISCRETE 2924 TO 300MIL TH ADAPT	0
	IPC0222 Chip Quik, Inc.	QFN-12 TO DIP-16 SMT ADAPTER (1.	0
	F100T100P06 Chip Quik, Inc.	PITCH CHANGER 1.00 MM TO 1.00 MM	0
	DC0805S Chip Quik, Inc.	DISCRETE 0805 TO 300MIL TH ADAPT	0

Adapter, Breakout Boards

1. Overview

Adapter and breakout boards are essential components in electronic prototyping and fabrication. Adapters enable connectivity between incompatible interfaces, while breakout boards (BOBs) simplify the use of complex integrated circuits (ICs) by breaking down their pins into user-friendly layouts. These products accelerate development cycles, reduce design complexity, and facilitate testing in modern electronics, IoT, and embedded systems.

2. Major Types and Functional Classification

Type	Functional Features	Application Examples
Level Shifter Adapters	Convert voltage levels between circuits (e.g., 3.3V 5V)	Sensor interfacing with MCUs
Protocol Converters	Bridge different communication protocols (I2C/SPI/UART)	Industrial automation systems
Power Adapters	Regulate and convert power supply voltages	Embedded device power management
Module Breakout Boards	Expose IC/module pins with onboard passive components	WiFi/Bluetooth module integration
Shield Adapters	Stackable boards for Arduino/Raspberry Pi expansion	Rapid prototyping platforms

3. Structure and Components

Typical adapter/breakout board assemblies include: - PCB Substrate: FR4 or flexible materials with copper traces - Connectors: Headers, sockets, or wireless interfaces - Active Components: Voltage regulators, level shifters, or protocol ICs - Passive Components: Resistors, capacitors, and crystal oscillators - Mounting Hardware: Standoffs, screws, or adhesive pads

4. Key Technical Specifications

Parameter	Description	Importance
Voltage Range	Operational voltage limits (e.g., 2.7V-5.5V)	Ensures component compatibility
Current Capacity	Maximum current handling (mA/mA)	Prevents thermal damage
Signal Integrity	Impedance matching and noise reduction	Guarantees reliable data transfer
Form Factor	Physical dimensions and mounting patterns	Determines system integration
Protocol Support	Supported communication standards	Defines interface compatibility

5. Application Fields

Consumer Electronics: Smart home devices, wearables
Industrial: PLCs, sensor networks
Automotive: CAN bus interfaces, ADAS prototyping
Medical: Diagnostic equipment, biosensors
Telecom: RF module integration, 5G testbeds

6. Leading Manufacturers & Products

Manufacturer	Representative Product	Key Features
Adafruit	Feather M4 Express	ARM Cortex-M4 with LiPo support
SparkFun	Thing Plus - RP2040	Raspberry Pi Pico-based breakout
STMicroelectronics	STEVAL-MKI109V3	MEMS sensor adapter board
Seeed Studio	XBee3 Breakout	Zigbee/WiFi/BLE multi-protocol
TI Instruments	BOOSTXL-PGA460	Ultrasonic sensing adapter

7. Selection Guidelines

Key considerations include: - Electrical Compatibility: Match voltage/current requirements with host system - Interface Requirements: Verify pinouts and communication protocols - Thermal Management: Check power dissipation ratings - Scalability: Assess stackability and expandability options - Cost Efficiency: Balance performance vs. budget constraints

Example: For IoT sensor networks, prioritize low-power adapters with I2C/SPI interfaces and RoHS compliance.

8. Industry Trends

Emerging trends include: - Miniaturization for wearable and mobile applications - Integration of AI/ML accelerators on breakout boards - Development of high-speed adapters ( 10 Gbps) for 5G and edge computing - Adoption of eco-friendly materials and manufacturing processes - Growth of modular "click board" ecosystems for rapid prototyping