| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Chip Quik, Inc. |
MICROSMD-5 BGA-5 0.5 MM PITCH |
0 |
|
 |
Chip Quik, Inc. |
SSOP-36 TO DIP-36 SMT ADAPTER |
0 |
|
 |
Chip Quik, Inc. |
QFN-8 TO DIP-12 SMT ADAPTER |
0 |
|
 |
Chip Quik, Inc. |
DISCRETE 0805 TO TH ADAPTER 10PK |
48 |
|
 |
Chip Quik, Inc. |
NARROW DUAL ROW 0.5MM PITCH 60-P |
30 |
|
 |
Chip Quik, Inc. |
TQFP-128 TO DIP-128 SMT ADAPTER |
0 |
|
 |
Chip Quik, Inc. |
QFN-56 TO DIP-60 SMT ADAPTER |
0 |
|
 |
Chip Quik, Inc. |
MICROSMD-14 BGA-14 0.5 MM PITCH |
0 |
|
 |
Chip Quik, Inc. |
PLCC-20/LCC-20/JLCC-20 TO DIP-20 |
0 |
|
 |
Chip Quik, Inc. |
QFN-40 TO DIP-44 SMT ADAPTER |
0 |
|
 |
Chip Quik, Inc. |
DFN-12 TO DIP-16 SMT ADAPTER |
0 |
|
 |
Chip Quik, Inc. |
LLP-10 TO DIP-10 SMT ADAPTER |
0 |
|
 |
Chip Quik, Inc. |
SOIC-8 TO DIP-8 SMT ADAPTER (1.2 |
92 |
|
 |
Chip Quik, Inc. |
QFN-12 TO DIP-16 SMT ADAPTER |
0 |
|
 |
Chip Quik, Inc. |
QFN-56 TO DIP-60 SMT ADAPTER |
0 |
|
 |
Chip Quik, Inc. |
FPC/FFC SMT CONNECTOR 0.4 MM |
0 |
|
 |
Chip Quik, Inc. |
LLP-24 TO DIP-24 SMT ADAPTER |
0 |
|
 |
Chip Quik, Inc. |
DIP-14 (0.3" BODY) TO DIP-14 (0. |
17 |
|
 |
Chip Quik, Inc. |
TSOP-32I TO DIP-32 SMT ADAPTER |
0 |
|
 |
Chip Quik, Inc. |
QFN-32 TO DIP-36 SMT ADAPTER |
0 |
|
Adapter and breakout boards are essential components in electronic prototyping and fabrication. Adapters enable connectivity between incompatible interfaces, while breakout boards (BOBs) simplify the use of complex integrated circuits (ICs) by breaking down their pins into user-friendly layouts. These products accelerate development cycles, reduce design complexity, and facilitate testing in modern electronics, IoT, and embedded systems.
| Type | Functional Features | Application Examples |
|---|---|---|
| Level Shifter Adapters | Convert voltage levels between circuits (e.g., 3.3V 5V) | Sensor interfacing with MCUs |
| Protocol Converters | Bridge different communication protocols (I2C/SPI/UART) | Industrial automation systems |
| Power Adapters | Regulate and convert power supply voltages | Embedded device power management |
| Module Breakout Boards | Expose IC/module pins with onboard passive components | WiFi/Bluetooth module integration |
| Shield Adapters | Stackable boards for Arduino/Raspberry Pi expansion | Rapid prototyping platforms |
Typical adapter/breakout board assemblies include: - PCB Substrate: FR4 or flexible materials with copper traces - Connectors: Headers, sockets, or wireless interfaces - Active Components: Voltage regulators, level shifters, or protocol ICs - Passive Components: Resistors, capacitors, and crystal oscillators - Mounting Hardware: Standoffs, screws, or adhesive pads
| Parameter | Description | Importance |
|---|---|---|
| Voltage Range | Operational voltage limits (e.g., 2.7V-5.5V) | Ensures component compatibility |
| Current Capacity | Maximum current handling (mA/mA) | Prevents thermal damage |
| Signal Integrity | Impedance matching and noise reduction | Guarantees reliable data transfer |
| Form Factor | Physical dimensions and mounting patterns | Determines system integration |
| Protocol Support | Supported communication standards | Defines interface compatibility |
| Manufacturer | Representative Product | Key Features |
|---|---|---|
| Adafruit | Feather M4 Express | ARM Cortex-M4 with LiPo support |
| SparkFun | Thing Plus - RP2040 | Raspberry Pi Pico-based breakout |
| STMicroelectronics | STEVAL-MKI109V3 | MEMS sensor adapter board |
| Seeed Studio | XBee3 Breakout | Zigbee/WiFi/BLE multi-protocol |
| TI Instruments | BOOSTXL-PGA460 | Ultrasonic sensing adapter |
Key considerations include: - Electrical Compatibility: Match voltage/current requirements with host system - Interface Requirements: Verify pinouts and communication protocols - Thermal Management: Check power dissipation ratings - Scalability: Assess stackability and expandability options - Cost Efficiency: Balance performance vs. budget constraints
Example: For IoT sensor networks, prioritize low-power adapters with I2C/SPI interfaces and RoHS compliance.
Emerging trends include: - Miniaturization for wearable and mobile applications - Integration of AI/ML accelerators on breakout boards - Development of high-speed adapters ( 10 Gbps) for 5G and edge computing - Adoption of eco-friendly materials and manufacturing processes - Growth of modular "click board" ecosystems for rapid prototyping