| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
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Chip Quik, Inc. |
DUAL ROW 1.00MM PITCH 18-PIN TO |
0 |
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Chip Quik, Inc. |
DUAL ROW 0.4MM PITCH 90-PIN CONN |
0 |
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Chip Quik, Inc. |
DUAL ROW 2.54MM PITCH 6-PIN TO D |
0 |
|
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Chip Quik, Inc. |
DUAL ROW 1.00MM PITCH 6-PIN MALE |
0 |
|
|
Chip Quik, Inc. |
RQFP-240 TO PGA-240 SMT ADAPTER |
0 |
|
|
Chip Quik, Inc. |
DUAL ROW 2.00MM PITCH 24-PIN FEM |
0 |
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Chip Quik, Inc. |
DFN-12 TO DIP-16 SMT ADAPTER (0. |
0 |
|
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Chip Quik, Inc. |
DFN-6/SON-6 TO DIP-6 SMT ADAPTER |
0 |
|
|
Chip Quik, Inc. |
DUAL ROW 2.00MM PITCH 20-PIN MAL |
0 |
|
|
Chip Quik, Inc. |
HTQFP-100 TO DIP-104 SMT ADAPTER |
0 |
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Chip Quik, Inc. |
DUAL ROW 2.54MM PITCH 4-PIN MALE |
0 |
|
|
Chip Quik, Inc. |
DUAL ROW 1.00MM PITCH 10-PIN MAL |
0 |
|
|
Chip Quik, Inc. |
PITCH CHANGER 1.27 MM TO 2.00 MM |
0 |
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Chip Quik, Inc. |
MODULE-40 TO DIP-40 SMT ADAPTER |
0 |
|
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Chip Quik, Inc. |
SON-6 TO DIP-10 SMT ADAPTER (0.6 |
0 |
|
|
Chip Quik, Inc. |
PITCH CHANGER 1.00 MM TO 1.27 MM |
0 |
|
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Chip Quik, Inc. |
DUAL ROW 1.00MM PITCH 20-PIN TO |
0 |
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Chip Quik, Inc. |
TQFP 486480100 PIN BREADBOARD - |
0 |
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Chip Quik, Inc. |
POWERPAD-20/POWERSOIC-20 TO DIP- |
0 |
|
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Chip Quik, Inc. |
DUAL ROW 2.00MM PITCH 18-PIN TO |
0 |
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Adapter and breakout boards are essential components in electronic prototyping and fabrication. Adapters enable connectivity between incompatible interfaces, while breakout boards (BOBs) simplify the use of complex integrated circuits (ICs) by breaking down their pins into user-friendly layouts. These products accelerate development cycles, reduce design complexity, and facilitate testing in modern electronics, IoT, and embedded systems.
| Type | Functional Features | Application Examples |
|---|---|---|
| Level Shifter Adapters | Convert voltage levels between circuits (e.g., 3.3V 5V) | Sensor interfacing with MCUs |
| Protocol Converters | Bridge different communication protocols (I2C/SPI/UART) | Industrial automation systems |
| Power Adapters | Regulate and convert power supply voltages | Embedded device power management |
| Module Breakout Boards | Expose IC/module pins with onboard passive components | WiFi/Bluetooth module integration |
| Shield Adapters | Stackable boards for Arduino/Raspberry Pi expansion | Rapid prototyping platforms |
Typical adapter/breakout board assemblies include: - PCB Substrate: FR4 or flexible materials with copper traces - Connectors: Headers, sockets, or wireless interfaces - Active Components: Voltage regulators, level shifters, or protocol ICs - Passive Components: Resistors, capacitors, and crystal oscillators - Mounting Hardware: Standoffs, screws, or adhesive pads
| Parameter | Description | Importance |
|---|---|---|
| Voltage Range | Operational voltage limits (e.g., 2.7V-5.5V) | Ensures component compatibility |
| Current Capacity | Maximum current handling (mA/mA) | Prevents thermal damage |
| Signal Integrity | Impedance matching and noise reduction | Guarantees reliable data transfer |
| Form Factor | Physical dimensions and mounting patterns | Determines system integration |
| Protocol Support | Supported communication standards | Defines interface compatibility |
| Manufacturer | Representative Product | Key Features |
|---|---|---|
| Adafruit | Feather M4 Express | ARM Cortex-M4 with LiPo support |
| SparkFun | Thing Plus - RP2040 | Raspberry Pi Pico-based breakout |
| STMicroelectronics | STEVAL-MKI109V3 | MEMS sensor adapter board |
| Seeed Studio | XBee3 Breakout | Zigbee/WiFi/BLE multi-protocol |
| TI Instruments | BOOSTXL-PGA460 | Ultrasonic sensing adapter |
Key considerations include: - Electrical Compatibility: Match voltage/current requirements with host system - Interface Requirements: Verify pinouts and communication protocols - Thermal Management: Check power dissipation ratings - Scalability: Assess stackability and expandability options - Cost Efficiency: Balance performance vs. budget constraints
Example: For IoT sensor networks, prioritize low-power adapters with I2C/SPI interfaces and RoHS compliance.
Emerging trends include: - Miniaturization for wearable and mobile applications - Integration of AI/ML accelerators on breakout boards - Development of high-speed adapters ( 10 Gbps) for 5G and edge computing - Adoption of eco-friendly materials and manufacturing processes - Growth of modular "click board" ecosystems for rapid prototyping