Adapter, Breakout Boards

Image Part Number Description / PDF Quantity Rfq
6007

6007

Capital Advanced Technologies, Inc.

PROTO-BRD 7PIN DISCRETE SMT SIP

0

33213

33213

Capital Advanced Technologies, Inc.

PROTO BOARD ADAPTER SMT TO-263AB

0

US-3014

US-3014

Capital Advanced Technologies, Inc.

PROTO BOARD 14PIN THRU-HOLE SIP

9

33115

33115

Capital Advanced Technologies, Inc.

PROTO BOARD ADAPTER SMT 5-PIN D2

250

33117

33117

Capital Advanced Technologies, Inc.

PROTO BOARD ADAPTER SMT 7-PIN D2

0

US-2012

US-2012

Capital Advanced Technologies, Inc.

PROTO BOARD 12PIN THRU-HOLE SIP

23

US-4016

US-4016

Capital Advanced Technologies, Inc.

PROTO BOARD 16PIN THRU-HOLE SIP

0

6309

6309

Capital Advanced Technologies, Inc.

PROTO BOARD 9PIN SOT-89 SMT SIP

0

33223

33223

Capital Advanced Technologies, Inc.

PROTO BOARD ADAPTER SMT SOT-223

0

33505

33505

Capital Advanced Technologies, Inc.

PROTOBOARD SMT FOR .65MM ON SEMI

0

33608

33608

Capital Advanced Technologies, Inc.

PROTOBOARD SMT FOR .65MM ON SEMI

0

US-5008

US-5008

Capital Advanced Technologies, Inc.

PROTO BOARD 8PIN THRU-HOLE SIP

22

6816

6816

Capital Advanced Technologies, Inc.

PROTO-BRD 16PIN DISCRETE SMT SIP

4

6808

6808

Capital Advanced Technologies, Inc.

PROTO-BRD 8PIN DISCRETE SMT SIP

0

33305

33305

Capital Advanced Technologies, Inc.

PROTOBOARD SMT FOR SOT-953

3

6004

6004

Capital Advanced Technologies, Inc.

PROTO-BRD 4PIN DISCRETE SMT SIP

0

33008

33008

Capital Advanced Technologies, Inc.

PROTO BOARD ADAPT SMT SUPERSOT-8

22

US-1008

US-1008

Capital Advanced Technologies, Inc.

PROTO BOARD 8PIN THRU-HOLE SIP

36

US-2010

US-2010

Capital Advanced Technologies, Inc.

PROTO BOARD 10PIN THRU-HOLE SIP

0

33508

33508

Capital Advanced Technologies, Inc.

PROTOBOARD SMT FOR SC-70-8/SC-8

0

Adapter, Breakout Boards

1. Overview

Adapter and breakout boards are essential components in electronic prototyping and fabrication. Adapters enable connectivity between incompatible interfaces, while breakout boards (BOBs) simplify the use of complex integrated circuits (ICs) by breaking down their pins into user-friendly layouts. These products accelerate development cycles, reduce design complexity, and facilitate testing in modern electronics, IoT, and embedded systems.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Level Shifter AdaptersConvert voltage levels between circuits (e.g., 3.3V 5V)Sensor interfacing with MCUs
Protocol ConvertersBridge different communication protocols (I2C/SPI/UART)Industrial automation systems
Power AdaptersRegulate and convert power supply voltagesEmbedded device power management
Module Breakout BoardsExpose IC/module pins with onboard passive componentsWiFi/Bluetooth module integration
Shield AdaptersStackable boards for Arduino/Raspberry Pi expansionRapid prototyping platforms

3. Structure and Components

Typical adapter/breakout board assemblies include: - PCB Substrate: FR4 or flexible materials with copper traces - Connectors: Headers, sockets, or wireless interfaces - Active Components: Voltage regulators, level shifters, or protocol ICs - Passive Components: Resistors, capacitors, and crystal oscillators - Mounting Hardware: Standoffs, screws, or adhesive pads

4. Key Technical Specifications

ParameterDescriptionImportance
Voltage RangeOperational voltage limits (e.g., 2.7V-5.5V)Ensures component compatibility
Current CapacityMaximum current handling (mA/mA)Prevents thermal damage
Signal IntegrityImpedance matching and noise reductionGuarantees reliable data transfer
Form FactorPhysical dimensions and mounting patternsDetermines system integration
Protocol SupportSupported communication standardsDefines interface compatibility

5. Application Fields

  • Consumer Electronics: Smart home devices, wearables
  • Industrial: PLCs, sensor networks
  • Automotive: CAN bus interfaces, ADAS prototyping
  • Medical: Diagnostic equipment, biosensors
  • Telecom: RF module integration, 5G testbeds

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Features
AdafruitFeather M4 ExpressARM Cortex-M4 with LiPo support
SparkFunThing Plus - RP2040Raspberry Pi Pico-based breakout
STMicroelectronicsSTEVAL-MKI109V3MEMS sensor adapter board
Seeed StudioXBee3 BreakoutZigbee/WiFi/BLE multi-protocol
TI InstrumentsBOOSTXL-PGA460Ultrasonic sensing adapter

7. Selection Guidelines

Key considerations include: - Electrical Compatibility: Match voltage/current requirements with host system - Interface Requirements: Verify pinouts and communication protocols - Thermal Management: Check power dissipation ratings - Scalability: Assess stackability and expandability options - Cost Efficiency: Balance performance vs. budget constraints

Example: For IoT sensor networks, prioritize low-power adapters with I2C/SPI interfaces and RoHS compliance.

8. Industry Trends

Emerging trends include: - Miniaturization for wearable and mobile applications - Integration of AI/ML accelerators on breakout boards - Development of high-speed adapters ( 10 Gbps) for 5G and edge computing - Adoption of eco-friendly materials and manufacturing processes - Growth of modular "click board" ecosystems for rapid prototyping

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