Adapter, Breakout Boards

Part Number	Description / PDF	Quantity
IPC0003 Chip Quik, Inc.	QFN-12 TO DIP-16 SMT ADAPTER	0
1230 Adafruit	SMT ADAPTERS 13 PACK	446
US-5014 Capital Advanced Technologies, Inc.	PROTO BOARD 14PIN THRU-HOLE SIP	4
LCQT-SOIC32 Aries Electronics, Inc.	SOCKET ADAPTER SOIC TO 32DIP	45
BOB-12941 SparkFun	SPARKFUN SD/MMC CARD BREAKOUT	96
IPC0101 Chip Quik, Inc.	QFN-56 TO DIP-60 SMT ADAPTER	0
9210 Capital Advanced Technologies, Inc.	PROTOBOARD 20 W SOIC SMT SIP	9
8100-SMT8-LF Twin Industries	ADAPTER BOARD SMT SOIC MED/TINY	4
FPC040P070 Chip Quik, Inc.	FPC/FFC SMT CONNECTOR 0.4 MM	0
PA0140 Chip Quik, Inc.	LLP-24 TO DIP-24 SMT ADAPTER	0
DIP300T600P14 Chip Quik, Inc.	DIP-14 (0.3" BODY) TO DIP-14 (0.	17
5109 Kitronik	MICRO USB TO 5V BREAKOUT	190
PA0228 Chip Quik, Inc.	TSOP-32I TO DIP-32 SMT ADAPTER	0
IPC0019 Chip Quik, Inc.	QFN-32 TO DIP-36 SMT ADAPTER	0
DE02018 Dreyer Electronics LLC	SOP-18/SSOP-18/SOIC-18 TO DIP-18	0
IPC0118 Chip Quik, Inc.	QFN-100 TO DIP-104 SMT ADAPTER	0
LCQT-SSOP20 Aries Electronics, Inc.	SOCKET ADAPTER SSOP TO 20DIP	57
PA0141 Chip Quik, Inc.	LLP-28 TO DIP-28 SMT ADAPTER	0
28-650000-11-RC Aries Electronics, Inc.	SOCKET ADAPTER SOIC TO 28DIP 0.6	190
DR050D254P040 Chip Quik, Inc.	DUAL ROW 0.5MM PITCH 40-PIN CONN	1

Adapter, Breakout Boards

1. Overview

Adapter and breakout boards are essential components in electronic prototyping and fabrication. Adapters enable connectivity between incompatible interfaces, while breakout boards (BOBs) simplify the use of complex integrated circuits (ICs) by breaking down their pins into user-friendly layouts. These products accelerate development cycles, reduce design complexity, and facilitate testing in modern electronics, IoT, and embedded systems.

2. Major Types and Functional Classification

Type	Functional Features	Application Examples
Level Shifter Adapters	Convert voltage levels between circuits (e.g., 3.3V 5V)	Sensor interfacing with MCUs
Protocol Converters	Bridge different communication protocols (I2C/SPI/UART)	Industrial automation systems
Power Adapters	Regulate and convert power supply voltages	Embedded device power management
Module Breakout Boards	Expose IC/module pins with onboard passive components	WiFi/Bluetooth module integration
Shield Adapters	Stackable boards for Arduino/Raspberry Pi expansion	Rapid prototyping platforms

3. Structure and Components

Typical adapter/breakout board assemblies include: - PCB Substrate: FR4 or flexible materials with copper traces - Connectors: Headers, sockets, or wireless interfaces - Active Components: Voltage regulators, level shifters, or protocol ICs - Passive Components: Resistors, capacitors, and crystal oscillators - Mounting Hardware: Standoffs, screws, or adhesive pads

4. Key Technical Specifications

Parameter	Description	Importance
Voltage Range	Operational voltage limits (e.g., 2.7V-5.5V)	Ensures component compatibility
Current Capacity	Maximum current handling (mA/mA)	Prevents thermal damage
Signal Integrity	Impedance matching and noise reduction	Guarantees reliable data transfer
Form Factor	Physical dimensions and mounting patterns	Determines system integration
Protocol Support	Supported communication standards	Defines interface compatibility

5. Application Fields

Consumer Electronics: Smart home devices, wearables
Industrial: PLCs, sensor networks
Automotive: CAN bus interfaces, ADAS prototyping
Medical: Diagnostic equipment, biosensors
Telecom: RF module integration, 5G testbeds

6. Leading Manufacturers & Products

Manufacturer	Representative Product	Key Features
Adafruit	Feather M4 Express	ARM Cortex-M4 with LiPo support
SparkFun	Thing Plus - RP2040	Raspberry Pi Pico-based breakout
STMicroelectronics	STEVAL-MKI109V3	MEMS sensor adapter board
Seeed Studio	XBee3 Breakout	Zigbee/WiFi/BLE multi-protocol
TI Instruments	BOOSTXL-PGA460	Ultrasonic sensing adapter

7. Selection Guidelines

Key considerations include: - Electrical Compatibility: Match voltage/current requirements with host system - Interface Requirements: Verify pinouts and communication protocols - Thermal Management: Check power dissipation ratings - Scalability: Assess stackability and expandability options - Cost Efficiency: Balance performance vs. budget constraints

Example: For IoT sensor networks, prioritize low-power adapters with I2C/SPI interfaces and RoHS compliance.

8. Industry Trends

Emerging trends include: - Miniaturization for wearable and mobile applications - Integration of AI/ML accelerators on breakout boards - Development of high-speed adapters ( 10 Gbps) for 5G and edge computing - Adoption of eco-friendly materials and manufacturing processes - Growth of modular "click board" ecosystems for rapid prototyping