Adapter, Breakout Boards

Image	Part Number	Description / PDF	Quantity	Rfq
	PA-TQFP-BB005-1 Chip Quik, Inc.	TQFP 486480100 PIN BREADBOARD -	0
	DR100DR254P18 Chip Quik, Inc.	DUAL ROW 1.00MM PITCH 18-PIN TO	0
	F127T127P20 Chip Quik, Inc.	PITCH CHANGER 1.27 MM TO 1.27 MM	0
	F127T200P05 Chip Quik, Inc.	PITCH CHANGER 1.27 MM TO 2.00 MM	0
	IPC0188 Chip Quik, Inc.	QFN-28 TO DIP-28 SMT ADAPTER (0.	0
	DR200D254P06 Chip Quik, Inc.	DUAL ROW 2.00MM PITCH 6-PIN TO D	0
	DR200D254P20 Chip Quik, Inc.	DUAL ROW 2.00MM PITCH 20-PIN TO	0
	DR127DR254P16 Chip Quik, Inc.	DUAL ROW 1.27MM PITCH 16-PIN TO	0
	IPC0185 Chip Quik, Inc.	POWERPAD-28/POWERSOIC-28 TO DIP-	0
	DR050D254P010 Chip Quik, Inc.	DUAL ROW 0.5MM PITCH 10-PIN CONN	0
	DR200D254P18M Chip Quik, Inc.	DUAL ROW 2.00MM PITCH 18-PIN MAL	0
	CN0017 Chip Quik, Inc.	JACK 1.7MM ID 4MM OD (EIAJ-2) AD	0
	914-0018-01 SchmartBoard	10 PACK OF 204-0018-01	0
	F127T200P06 Chip Quik, Inc.	PITCH CHANGER 1.27 MM TO 2.00 MM	0
	LS0006 Chip Quik, Inc.	EX-OR GATE TO DIP-6 SMT ADAPTER	0
	DR127DR254P20 Chip Quik, Inc.	DUAL ROW 1.27MM PITCH 20-PIN TO	0
	IPC0195 Chip Quik, Inc.	DFN-6 TO DIP-6 SMT ADAPTER (0.5	0
	DR200D254P08 Chip Quik, Inc.	DUAL ROW 2.00MM PITCH 8-PIN TO D	0
	DR254D254P12M Chip Quik, Inc.	DUAL ROW 2.54MM PITCH 12-PIN MAL	0
	DC1210S Chip Quik, Inc.	DISCRETE 1210 TO 300MIL TH ADAPT	0

Adapter, Breakout Boards

1. Overview

Adapter and breakout boards are essential components in electronic prototyping and fabrication. Adapters enable connectivity between incompatible interfaces, while breakout boards (BOBs) simplify the use of complex integrated circuits (ICs) by breaking down their pins into user-friendly layouts. These products accelerate development cycles, reduce design complexity, and facilitate testing in modern electronics, IoT, and embedded systems.

2. Major Types and Functional Classification

Type	Functional Features	Application Examples
Level Shifter Adapters	Convert voltage levels between circuits (e.g., 3.3V 5V)	Sensor interfacing with MCUs
Protocol Converters	Bridge different communication protocols (I2C/SPI/UART)	Industrial automation systems
Power Adapters	Regulate and convert power supply voltages	Embedded device power management
Module Breakout Boards	Expose IC/module pins with onboard passive components	WiFi/Bluetooth module integration
Shield Adapters	Stackable boards for Arduino/Raspberry Pi expansion	Rapid prototyping platforms

3. Structure and Components

Typical adapter/breakout board assemblies include: - PCB Substrate: FR4 or flexible materials with copper traces - Connectors: Headers, sockets, or wireless interfaces - Active Components: Voltage regulators, level shifters, or protocol ICs - Passive Components: Resistors, capacitors, and crystal oscillators - Mounting Hardware: Standoffs, screws, or adhesive pads

4. Key Technical Specifications

Parameter	Description	Importance
Voltage Range	Operational voltage limits (e.g., 2.7V-5.5V)	Ensures component compatibility
Current Capacity	Maximum current handling (mA/mA)	Prevents thermal damage
Signal Integrity	Impedance matching and noise reduction	Guarantees reliable data transfer
Form Factor	Physical dimensions and mounting patterns	Determines system integration
Protocol Support	Supported communication standards	Defines interface compatibility

5. Application Fields

Consumer Electronics: Smart home devices, wearables
Industrial: PLCs, sensor networks
Automotive: CAN bus interfaces, ADAS prototyping
Medical: Diagnostic equipment, biosensors
Telecom: RF module integration, 5G testbeds

6. Leading Manufacturers & Products

Manufacturer	Representative Product	Key Features
Adafruit	Feather M4 Express	ARM Cortex-M4 with LiPo support
SparkFun	Thing Plus - RP2040	Raspberry Pi Pico-based breakout
STMicroelectronics	STEVAL-MKI109V3	MEMS sensor adapter board
Seeed Studio	XBee3 Breakout	Zigbee/WiFi/BLE multi-protocol
TI Instruments	BOOSTXL-PGA460	Ultrasonic sensing adapter

7. Selection Guidelines

Key considerations include: - Electrical Compatibility: Match voltage/current requirements with host system - Interface Requirements: Verify pinouts and communication protocols - Thermal Management: Check power dissipation ratings - Scalability: Assess stackability and expandability options - Cost Efficiency: Balance performance vs. budget constraints

Example: For IoT sensor networks, prioritize low-power adapters with I2C/SPI interfaces and RoHS compliance.

8. Industry Trends

Emerging trends include: - Miniaturization for wearable and mobile applications - Integration of AI/ML accelerators on breakout boards - Development of high-speed adapters ( 10 Gbps) for 5G and edge computing - Adoption of eco-friendly materials and manufacturing processes - Growth of modular "click board" ecosystems for rapid prototyping