Adapter, Breakout Boards

Part Number	Description / PDF	Quantity
FPC125P030 Chip Quik, Inc.	FPC/FFC SMT CONNECTOR 1.25 MM PI	0
PA0095 Chip Quik, Inc.	QFP-48 TO DIP-48 SMT ADAPTER	0
PA0054 Chip Quik, Inc.	MLP/MLF-20 TO DIP-20 SMT ADAPTER	0
LCQT-SOT23-6 Aries Electronics, Inc.	SOCKET ADAPTER SOT-23 TO 6DIP	1251
DIP600T300P20 Chip Quik, Inc.	DIP-20 (0.6" BODY) TO DIP-20 (0.	39
PA0211 Chip Quik, Inc.	TSOP-56 I TO DIP-56 SMT ADAPTER	0
IPC0093 Chip Quik, Inc.	POWERSSOP-32 TO DIP-36 SMT ADAPT	0
33205 Capital Advanced Technologies, Inc.	PROTO BOARD ADAPTER SMT SOT-23-5	430
DC0402S-10X Chip Quik, Inc.	10PC DISCRETE 0402 TO 300MIL TH	7
PA0078 Chip Quik, Inc.	TVSOP-24 TO DIP-24 SMT ADAPTER	0
PA0172 Chip Quik, Inc.	POS-8 TO DIP-8 SMT ADAPTER	0
IPC0004 Chip Quik, Inc.	QFN-12 TO DIP-16 SMT ADAPTER	0
PA0171 Chip Quik, Inc.	MINI SOIC-10 EXP PAD TO DIP-10 S	0
IPC0013 Chip Quik, Inc.	QFN-20 TO DIP-24 SMT ADAPTER	0
PA-SOD3SM18-24 Logical Systems	SOCKET ADAPTER SOIC TO 24DIP	0
RB-LYN-1019 RobotShop	LSS POWER DISTRIBUTION HUB	4
DE0302 Dreyer Electronics LLC	SOT23-5/SOT353 TO DIP-6 ADAPTER	980
IPC0024 Chip Quik, Inc.	QFN-36 TO DIP-40 SMT ADAPTER	0
PA0241 Chip Quik, Inc.	TQFP-52 TO DIP-52 SMT ADAPTER	0
PA0050 Chip Quik, Inc.	MLP/MLF-8 TO DIP-8 SMT ADAPTER	0

Adapter, Breakout Boards

1. Overview

Adapter and breakout boards are essential components in electronic prototyping and fabrication. Adapters enable connectivity between incompatible interfaces, while breakout boards (BOBs) simplify the use of complex integrated circuits (ICs) by breaking down their pins into user-friendly layouts. These products accelerate development cycles, reduce design complexity, and facilitate testing in modern electronics, IoT, and embedded systems.

2. Major Types and Functional Classification

Type	Functional Features	Application Examples
Level Shifter Adapters	Convert voltage levels between circuits (e.g., 3.3V 5V)	Sensor interfacing with MCUs
Protocol Converters	Bridge different communication protocols (I2C/SPI/UART)	Industrial automation systems
Power Adapters	Regulate and convert power supply voltages	Embedded device power management
Module Breakout Boards	Expose IC/module pins with onboard passive components	WiFi/Bluetooth module integration
Shield Adapters	Stackable boards for Arduino/Raspberry Pi expansion	Rapid prototyping platforms

3. Structure and Components

Typical adapter/breakout board assemblies include: - PCB Substrate: FR4 or flexible materials with copper traces - Connectors: Headers, sockets, or wireless interfaces - Active Components: Voltage regulators, level shifters, or protocol ICs - Passive Components: Resistors, capacitors, and crystal oscillators - Mounting Hardware: Standoffs, screws, or adhesive pads

4. Key Technical Specifications

Parameter	Description	Importance
Voltage Range	Operational voltage limits (e.g., 2.7V-5.5V)	Ensures component compatibility
Current Capacity	Maximum current handling (mA/mA)	Prevents thermal damage
Signal Integrity	Impedance matching and noise reduction	Guarantees reliable data transfer
Form Factor	Physical dimensions and mounting patterns	Determines system integration
Protocol Support	Supported communication standards	Defines interface compatibility

5. Application Fields

Consumer Electronics: Smart home devices, wearables
Industrial: PLCs, sensor networks
Automotive: CAN bus interfaces, ADAS prototyping
Medical: Diagnostic equipment, biosensors
Telecom: RF module integration, 5G testbeds

6. Leading Manufacturers & Products

Manufacturer	Representative Product	Key Features
Adafruit	Feather M4 Express	ARM Cortex-M4 with LiPo support
SparkFun	Thing Plus - RP2040	Raspberry Pi Pico-based breakout
STMicroelectronics	STEVAL-MKI109V3	MEMS sensor adapter board
Seeed Studio	XBee3 Breakout	Zigbee/WiFi/BLE multi-protocol
TI Instruments	BOOSTXL-PGA460	Ultrasonic sensing adapter

7. Selection Guidelines

Key considerations include: - Electrical Compatibility: Match voltage/current requirements with host system - Interface Requirements: Verify pinouts and communication protocols - Thermal Management: Check power dissipation ratings - Scalability: Assess stackability and expandability options - Cost Efficiency: Balance performance vs. budget constraints

Example: For IoT sensor networks, prioritize low-power adapters with I2C/SPI interfaces and RoHS compliance.

8. Industry Trends

Emerging trends include: - Miniaturization for wearable and mobile applications - Integration of AI/ML accelerators on breakout boards - Development of high-speed adapters ( 10 Gbps) for 5G and edge computing - Adoption of eco-friendly materials and manufacturing processes - Growth of modular "click board" ecosystems for rapid prototyping