AC DC Configurable Power Supply Chassis

Image Part Number Description / PDF Quantity Rfq
GM5V_10ADV2

GM5V_10ADV2

Vicor

GM5V/10ADV2 CONVERTERPAC

0

GM15V_13A3AV2

GM15V_13A3AV2

Vicor

GM15V/13.3AV2 CONVERTERPAC

0

M5V_10ADFV2

M5V_10ADFV2

Vicor

M5V/10ADFV2 CONVERTERPAC

0

M15V_13A3ADTV2

M15V_13A3ADTV2

Vicor

15V 13.3A CONVERTERPAC

0

M15V_10ADV2

M15V_10ADV2

Vicor

M15V/10ADV2 CONVERTERPAC

0

GM15V_13A3AIV2

GM15V_13A3AIV2

Vicor

GM15V/13.3AIV2 CONVERTERPAC

0

GM15V_13A3ATV2

GM15V_13A3ATV2

Vicor

GM15V/13.3ATV2 CONVERTERPAC

0

M15V_3A3AV2

M15V_3A3AV2

Vicor

M15V/3.3AV2 CONVERTERPAC

0

M5V_10ADTV2

M5V_10ADTV2

Vicor

CONVERTERPAC

0

GM15V_13A3ADV2

GM15V_13A3ADV2

Vicor

GM15V/13.3ADV2 CONVERTERPAC

0

M15V_13A3ADV2

M15V_13A3ADV2

Vicor

M15V/13.3ADV2 CONVERTERPAC

0

M15V_13A3ABV2

M15V_13A3ABV2

Vicor

M15V/13.3ABV2 CONVERTERPAC

0

M15V_13A3ATV2

M15V_13A3ATV2

Vicor

M15V/13.3ATV2 CONVERTERPAC

0

M15V_13A3AIV2

M15V_13A3AIV2

Vicor

M15V/13.3AIV2 CONVERTERPAC

0

GM15V_13A3ABV2

GM15V_13A3ABV2

Vicor

GM15V/13.3ABV2 CONVERTERPAC

0

M5V_10AIDV2

M5V_10AIDV2

Vicor

M5V/10AIDV2 CONVERTERPAC

0

SE1602

SE1602

Vicor

CHASSIS ASSY SIEMENS SE1602

0

SE1600

SE1600

Vicor

CHASSIS ASSY SIEMENS SE1600

0

SE1601

SE1601

Vicor

CHASSIS ASSY SIEMENS SE1601

0

SE1500

SE1500

Vicor

CHASSIS ASSY SIEMENS SE1500

0

AC DC Configurable Power Supply Chassis

1. Overview

AC DC Configurable Power Supply Chassis refers to modular power systems that can be configured for AC-to-DC or DC-to-DC conversion, supporting both external and internal (off-board) mounting. These chassis provide critical power management solutions for complex electronic systems, enabling customization through interchangeable modules. Their importance in modern technology stems from the growing demand for adaptable, high-efficiency power systems in industrial automation, medical equipment, and data centers.

2. Main Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Modular AC-DC ChassisHot-swappable modules, scalable power outputTelecom infrastructure
Redundant Power ChassisDual-input support, fault-tolerant designMission-critical servers
High-Density DC-DC ChassisCompact form factor, >90% efficiencySemiconductor manufacturing equipment
Programmable Power ChassisDigital control via CANbus/ModbusR&D testing platforms

3. Structure & Components

Typical configurations include:

  • Metal Enclosure: Aluminum alloy chassis with EMI shielding (1.5-3.0mm thickness)
  • Power Modules: Interchangeable units supporting 100W-3kW per slot
  • Control Board: Digital signal processor (DSP) for voltage regulation
  • Cooling System: Variable-speed fans with 20-60CFM airflow capacity
  • I/O Interfaces: Universal AC input (85-264VAC), multiple DC output rails

4. Key Technical Specifications

ParameterTypical RangeImportance
Input Voltage85-264VAC / 100-400VDCGlobal compatibility
Output Power500W-20kWDetermines system capability
Efficiency85-96%Energy cost & thermal management
MTBF50,000-200,000 hoursSystem reliability
ProtectionOVP/OCP/OTP/SCPEquipment safety

5. Application Fields

Primary industries include:

  • Industrial Automation: PLC systems, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic instruments
  • Telecommunications: 5G base stations, optical networking
  • Renewable Energy: Solar inverters, energy storage systems

6. Leading Manufacturers

ManufacturerRepresentative ProductKey Feature
Delta ElectronicsDPH series1U form factor, 96% efficiency
Mean WellNDR-2K seriesIP65-rated industrial chassis
TDK-LambdaZUPS seriesActive redundancy support

7. Selection Guidelines

Key considerations:

  • Power requirements: 20% headroom above calculated needs
  • Environmental factors: Operating temperature (-40 C to +70 C)
  • Compliance: UL/CE/IEC certifications
  • Expandability: 20% module slots for future upgrades
  • Real-world case: Semiconductor AOI inspection systems require 0.5% voltage stability

8. Industry Trends

Emerging developments:

  • Adoption of GaN/SiC devices for >97% efficiency
  • Integration with IoT-enabled power management
  • Standardization of 3U/4U rack-mount form factors
  • Increased demand for liquid-cooled chassis in data centers
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