AC DC Configurable Power Supply Chassis

Image Part Number Description / PDF Quantity Rfq
XCC-03

XCC-03

UltraVolt

CONFIG POWER CHASSIS

15

M15V_13A3ADV2

M15V_13A3ADV2

Vicor

M15V/13.3ADV2 CONVERTERPAC

0

XTAS01

XTAS01

UltraVolt

CONFIG POWER CHASSIS 200W 4 SLOT

5

M15V_13A3ABV2

M15V_13A3ABV2

Vicor

M15V/13.3ABV2 CONVERTERPAC

0

XMCC01

XMCC01

UltraVolt

CONFIGURABLE POWER SUPPLY

10

UX6-02

UX6-02

UltraVolt

CONFIGURABLE POWER SUPPLY

15

XCES01

XCES01

UltraVolt

CONFIGURABLE POWER SUPPLY

10

XCCC0

XCCC0

UltraVolt

CONFIGURABLE POWER SUPPLY

15

UX4S

UX4S

UltraVolt

CONFIG POWER CHASSIS 600W 4 SLOT

0

XZB-01

XZB-01

UltraVolt

CONFIG POWER CHASSIS

20

LPM409-CHAS

LPM409-CHAS

Power-One (Bel Power Solutions)

CONFIG POWER CHASSIS 900W 4 SLOT

0

UX4C04

UX4C04

UltraVolt

CONFIGURABLE POWER SUPPLY

15

XWB-04

XWB-04

UltraVolt

CONFIGURABLE POWER SUPPLY

10

M15V_13A3ATV2

M15V_13A3ATV2

Vicor

M15V/13.3ATV2 CONVERTERPAC

0

XMC-04

XMC-04

UltraVolt

CONFIGURABLE POWER SUPPLY

15

CX06M-0000-N4B

CX06M-0000-N4B

UltraVolt

CONFIG POWER CHASSIS 600W 4 SLOT

25

UX6CD2

UX6CD2

UltraVolt

CONFIG POWER CHASSIS

20

XVE-00

XVE-00

UltraVolt

CONFIG POWER CHASSIS

20

XWC-00

XWC-00

UltraVolt

CONFIG POWER CHASSIS

20

UX6SD0

UX6SD0

UltraVolt

CONFIGURABLE POWER SUPPLY

40

AC DC Configurable Power Supply Chassis

1. Overview

AC DC Configurable Power Supply Chassis refers to modular power systems that can be configured for AC-to-DC or DC-to-DC conversion, supporting both external and internal (off-board) mounting. These chassis provide critical power management solutions for complex electronic systems, enabling customization through interchangeable modules. Their importance in modern technology stems from the growing demand for adaptable, high-efficiency power systems in industrial automation, medical equipment, and data centers.

2. Main Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Modular AC-DC ChassisHot-swappable modules, scalable power outputTelecom infrastructure
Redundant Power ChassisDual-input support, fault-tolerant designMission-critical servers
High-Density DC-DC ChassisCompact form factor, >90% efficiencySemiconductor manufacturing equipment
Programmable Power ChassisDigital control via CANbus/ModbusR&D testing platforms

3. Structure & Components

Typical configurations include:

  • Metal Enclosure: Aluminum alloy chassis with EMI shielding (1.5-3.0mm thickness)
  • Power Modules: Interchangeable units supporting 100W-3kW per slot
  • Control Board: Digital signal processor (DSP) for voltage regulation
  • Cooling System: Variable-speed fans with 20-60CFM airflow capacity
  • I/O Interfaces: Universal AC input (85-264VAC), multiple DC output rails

4. Key Technical Specifications

ParameterTypical RangeImportance
Input Voltage85-264VAC / 100-400VDCGlobal compatibility
Output Power500W-20kWDetermines system capability
Efficiency85-96%Energy cost & thermal management
MTBF50,000-200,000 hoursSystem reliability
ProtectionOVP/OCP/OTP/SCPEquipment safety

5. Application Fields

Primary industries include:

  • Industrial Automation: PLC systems, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic instruments
  • Telecommunications: 5G base stations, optical networking
  • Renewable Energy: Solar inverters, energy storage systems

6. Leading Manufacturers

ManufacturerRepresentative ProductKey Feature
Delta ElectronicsDPH series1U form factor, 96% efficiency
Mean WellNDR-2K seriesIP65-rated industrial chassis
TDK-LambdaZUPS seriesActive redundancy support

7. Selection Guidelines

Key considerations:

  • Power requirements: 20% headroom above calculated needs
  • Environmental factors: Operating temperature (-40 C to +70 C)
  • Compliance: UL/CE/IEC certifications
  • Expandability: 20% module slots for future upgrades
  • Real-world case: Semiconductor AOI inspection systems require 0.5% voltage stability

8. Industry Trends

Emerging developments:

  • Adoption of GaN/SiC devices for >97% efficiency
  • Integration with IoT-enabled power management
  • Standardization of 3U/4U rack-mount form factors
  • Increased demand for liquid-cooled chassis in data centers
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