DC DC Converters

Image Part Number Description / PDF Quantity Rfq
EP5352QI

EP5352QI

Intel

DC DC CONVERTER 0.6-5.05V

2236

EN6360QA

EN6360QA

Intel

DC DC CONVERTER 0.6-5.8V 46W

128

EM2130L01QI

EM2130L01QI

Intel

DC DC CONVERTER 0.7-1.325V

176

EP5358HUI

EP5358HUI

Intel

DC DC CONVERTER 1.8-3.3V 2W

0

EN23F0QI

EN23F0QI

Intel

DC DC CONVERTER 0.75-3.3V

0

EP53A8HQA

EP53A8HQA

Intel

DC DC CONVERTER 1.8-3.3V 3W

1149

EN5366QI

EN5366QI

Intel

DC DC CONVERTER 0.75-3.3V

314

EP5382QI

EP5382QI

Intel

DC DC CONVERTER 0.6-5.05V

4

EN5367QI

EN5367QI

Intel

DC DC CONVERTER 0.6-4.9V 29W

871

EP5358LUA

EP5358LUA

Intel

DC DC CONVERTER 0.6-5.2V 3W

2235

EN23F2QI

EN23F2QI

Intel

DC DC CONVERTER 0.75-3.3V

0

EN6363QI

EN6363QI

Intel

DC DC CONVERTER 0.75-6.12V

6219

EP5368QI

EP5368QI

Intel

DC DC CONVERTER 0.603-5.1V

0

EN6360QI

EN6360QI

Intel

DC DC CONVERTER 0.6-5.8V 46W

2513

EN6382QI

EN6382QI

Intel

DC DC CONVERTER 0.6-5.9V

2720

EP5362QI

EP5362QI

Intel

DC DC CONVERTER 0.6-5.05V

0

EN63A0QA

EN63A0QA

Intel

DC DC CONVERTER 0.6-5.4V

456

EC2650QI

EC2650QI

Intel

DC DC CONVERTER 4-6.5V 39W

1254

EP5358HUA

EP5358HUA

Intel

DC DC CONVERTER 1.8-3.3V 2W

4817

EN6337QI

EN6337QI

Intel

DC DC CONVERTER 0.6-6.285V

9865

DC DC Converters

1. Overview

Board Mount DC-DC Converters are electronic devices that convert direct current (DC) from one voltage level to another through switching technology. They enable voltage regulation and power distribution in embedded systems, providing galvanic isolation, voltage matching, and efficiency optimization. These converters are critical in modern electronics for enabling compact designs, improving energy efficiency, and ensuring stable power delivery in applications ranging from consumer devices to industrial equipment.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Non-Isolated ConvertersShared ground reference, high efficiency (85-95%), low costPoint-of-load regulation in servers
Isolated ConvertersGalvanic isolation (1-6kV), reinforced safety, wide input rangeMedical equipment power supplies
Step-Down (Buck)Converts higher input to lower output voltage12V to 3.3V for microprocessors
Step-Up (Boost)Increases input voltage to higher output levels5V to 12V for display backlighting
BidirectionalSupports power flow in both directionsEnergy storage systems in EVs

3. Structure and Components

Typical construction includes:

  • Input EMI filter (common-mode choke + capacitors)
  • Power MOSFET/IGBT switching stage
  • Planar transformer (for isolation types)
  • PWM controller IC with feedback loop
  • Synchronous rectifier (for high-efficiency designs)
  • Output LC filter (inductor + ceramic capacitors)

4. Key Technical Specifications

ParameterImportance
Input Voltage RangeDetermines compatibility with power sources
Output Voltage AccuracyEnsures stable power for sensitive circuits
Efficiency (Typ. 80-97%)Impacts thermal performance and energy costs
Power Density (W/in )Key metric for space-constrained applications
Operating TemperatureDefines performance in harsh environments
Isolation VoltageSafety compliance for medical/industrial use

5. Application Fields

Major industries include:

  • Telecommunications (5G base stations, optical networking equipment)
  • Industrial Automation (PLCs, robotics controllers)
  • Medical Devices (patient monitoring systems, imaging equipment)
  • Consumer Electronics (gaming consoles, VR headsets)
  • Renewable Energy (solar inverters, energy storage systems)

6. Leading Manufacturers and Products

ManufacturerProduct SeriesKey Features
TI (Texas Instruments)LM514565V input, 2.5A output, 95% efficiency
Monolithic PowerMPQ442045V input, 2A output, 3x3mm QFN package
VicorDCM311448V to 12V, 180W, 342W/in power density
CUI IncVX78-10001000V isolation, 10W output, medical grade

7. Selection Guidelines

Key factors to consider:

  • Input/output voltage requirements and transient response
  • Load current profile (continuous vs peak demands)
  • Thermal management capabilities
  • Form factor constraints (e.g., 1/16th brick standard)
  • Protection features (OVP, OCP, OTP)
  • Compliance certifications (CE, UL, IEC 60601-1)

8. Industry Trends

Current development directions include:

  • Adoption of GaN/SiC wide bandgap semiconductors for >97% efficiency
  • Digital control loops for dynamic voltage scaling
  • 3D packaging to achieve >500W/in power density
  • Integrated magnetics for reduced component count
  • Smart converters with PMBus interface for telemetry

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