DC DC Converters

Image Part Number Description / PDF Quantity Rfq
Q05-5

Q05-5

XP Power

DC DC CONVERTER 500V 500MW

108

JWK1024S15

JWK1024S15

XP Power

DC DC CONVERTER 15V 10W

16

IEQ0512D12

IEQ0512D12

XP Power

DC DC CONVERTER +/-12V 5W

0

RDC20110S3V3

RDC20110S3V3

XP Power

DC DC CONVERTER 3.3V 20W

0

IF0509S

IF0509S

XP Power

DC DC CONVERTER 9V 1W

0

GP60

GP60

XP Power

DC DC CONVERTER 6000V 1W

25

HRL3024S5K0N

HRL3024S5K0N

XP Power

DC DC CONVERTER -5000V 30W

2

IP2403SA

IP2403SA

XP Power

DC DC CONVERTER 3.3V 3W

134

ITQ4805S

ITQ4805S

XP Power

DC DC CONVERTER +/-5V 6W

0

ISX0648S12

ISX0648S12

XP Power

DC DC CONVERTER 12V 6W

17

IHA0105D1509

IHA0105D1509

XP Power

DC DC CONVERTER 15V -9V 1W

19

ISH2412A

ISH2412A

XP Power

DC DC CONVERTER 12V 2W

0

IU2405SA

IU2405SA

XP Power

DC DC CONVERTER 5V 2W

212

JCA0624S05

JCA0624S05

XP Power

DC DC CONVERTER 5V 6W

0

JSM2524S3V3

JSM2524S3V3

XP Power

DC DC CONVERTER 3.3V 25W

10

IA1224S

IA1224S

XP Power

DC DC CONVERTER +/-24V 1W

871

ITU0324D05

ITU0324D05

XP Power

DC-DC 3W 4:1

30

ISB0112S05

ISB0112S05

XP Power

DC DC CONVERTER 5V 1W

280

IM2412S

IM2412S

XP Power

DC DC CONVERTER +/-12V 2W

39

ICZ0924S12

ICZ0924S12

XP Power

DC DC CONVERTER 12V 9W

13

DC DC Converters

1. Overview

Board Mount DC-DC Converters are electronic devices that convert direct current (DC) from one voltage level to another through switching technology. They enable voltage regulation and power distribution in embedded systems, providing galvanic isolation, voltage matching, and efficiency optimization. These converters are critical in modern electronics for enabling compact designs, improving energy efficiency, and ensuring stable power delivery in applications ranging from consumer devices to industrial equipment.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Non-Isolated ConvertersShared ground reference, high efficiency (85-95%), low costPoint-of-load regulation in servers
Isolated ConvertersGalvanic isolation (1-6kV), reinforced safety, wide input rangeMedical equipment power supplies
Step-Down (Buck)Converts higher input to lower output voltage12V to 3.3V for microprocessors
Step-Up (Boost)Increases input voltage to higher output levels5V to 12V for display backlighting
BidirectionalSupports power flow in both directionsEnergy storage systems in EVs

3. Structure and Components

Typical construction includes:

  • Input EMI filter (common-mode choke + capacitors)
  • Power MOSFET/IGBT switching stage
  • Planar transformer (for isolation types)
  • PWM controller IC with feedback loop
  • Synchronous rectifier (for high-efficiency designs)
  • Output LC filter (inductor + ceramic capacitors)

4. Key Technical Specifications

ParameterImportance
Input Voltage RangeDetermines compatibility with power sources
Output Voltage AccuracyEnsures stable power for sensitive circuits
Efficiency (Typ. 80-97%)Impacts thermal performance and energy costs
Power Density (W/in )Key metric for space-constrained applications
Operating TemperatureDefines performance in harsh environments
Isolation VoltageSafety compliance for medical/industrial use

5. Application Fields

Major industries include:

  • Telecommunications (5G base stations, optical networking equipment)
  • Industrial Automation (PLCs, robotics controllers)
  • Medical Devices (patient monitoring systems, imaging equipment)
  • Consumer Electronics (gaming consoles, VR headsets)
  • Renewable Energy (solar inverters, energy storage systems)

6. Leading Manufacturers and Products

ManufacturerProduct SeriesKey Features
TI (Texas Instruments)LM514565V input, 2.5A output, 95% efficiency
Monolithic PowerMPQ442045V input, 2A output, 3x3mm QFN package
VicorDCM311448V to 12V, 180W, 342W/in power density
CUI IncVX78-10001000V isolation, 10W output, medical grade

7. Selection Guidelines

Key factors to consider:

  • Input/output voltage requirements and transient response
  • Load current profile (continuous vs peak demands)
  • Thermal management capabilities
  • Form factor constraints (e.g., 1/16th brick standard)
  • Protection features (OVP, OCP, OTP)
  • Compliance certifications (CE, UL, IEC 60601-1)

8. Industry Trends

Current development directions include:

  • Adoption of GaN/SiC wide bandgap semiconductors for >97% efficiency
  • Digital control loops for dynamic voltage scaling
  • 3D packaging to achieve >500W/in power density
  • Integrated magnetics for reduced component count
  • Smart converters with PMBus interface for telemetry

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