DC DC Converters

Image Part Number Description / PDF Quantity Rfq
SPDC400FC12M0.35

SPDC400FC12M0.35

STMicroelectronics

DC DC CONVERTER -12V

0

SPDC12L00010

SPDC12L00010

STMicroelectronics

DC DC CONVERTER 0.6-5V

0

GS-R24FS0001.8

GS-R24FS0001.8

STMicroelectronics

DC DC CONVERTER 1.235-5.5V

0

GS-R415

GS-R415

STMicroelectronics

DC DC CONVERTER 15V

0

GS-R12FV0001.9

GS-R12FV0001.9

STMicroelectronics

DC DC CONVERTER 1.235-5.5V

0

GS-R24F0002.0

GS-R24F0002.0

STMicroelectronics

DC DC CONVERTER 1.235-5.5V

0

GS-R24FV0001.8

GS-R24FV0001.8

STMicroelectronics

DC DC CONVERTER 1.235-5.5V

0

GS-R12F0002.0

GS-R12F0002.0

STMicroelectronics

DC DC CONVERTER 1.235-5.5V

0

SPDCPOE03

SPDCPOE03

STMicroelectronics

DC DC CONVERTER 3.3V 10W

0

SPDCPOE05

SPDCPOE05

STMicroelectronics

DC DC CONVERTER 5V 10W

0

SPDCPOE12

SPDCPOE12

STMicroelectronics

DC DC CONVERTER 12V 10W

0

GS-R424

GS-R424

STMicroelectronics

DC DC CONVERTER 24V

0

GS-R400V

GS-R400V

STMicroelectronics

DC DC CONVERTER 5.1-40V

0

GS-R12FS0001.9

GS-R12FS0001.9

STMicroelectronics

DC DC CONVERTER 1.235-5.5V

0

GS-R405S

GS-R405S

STMicroelectronics

DC DC CONVERTER 5.1V

0

DC DC Converters

1. Overview

Board Mount DC-DC Converters are electronic devices that convert direct current (DC) from one voltage level to another through switching technology. They enable voltage regulation and power distribution in embedded systems, providing galvanic isolation, voltage matching, and efficiency optimization. These converters are critical in modern electronics for enabling compact designs, improving energy efficiency, and ensuring stable power delivery in applications ranging from consumer devices to industrial equipment.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Non-Isolated ConvertersShared ground reference, high efficiency (85-95%), low costPoint-of-load regulation in servers
Isolated ConvertersGalvanic isolation (1-6kV), reinforced safety, wide input rangeMedical equipment power supplies
Step-Down (Buck)Converts higher input to lower output voltage12V to 3.3V for microprocessors
Step-Up (Boost)Increases input voltage to higher output levels5V to 12V for display backlighting
BidirectionalSupports power flow in both directionsEnergy storage systems in EVs

3. Structure and Components

Typical construction includes:

  • Input EMI filter (common-mode choke + capacitors)
  • Power MOSFET/IGBT switching stage
  • Planar transformer (for isolation types)
  • PWM controller IC with feedback loop
  • Synchronous rectifier (for high-efficiency designs)
  • Output LC filter (inductor + ceramic capacitors)

4. Key Technical Specifications

ParameterImportance
Input Voltage RangeDetermines compatibility with power sources
Output Voltage AccuracyEnsures stable power for sensitive circuits
Efficiency (Typ. 80-97%)Impacts thermal performance and energy costs
Power Density (W/in )Key metric for space-constrained applications
Operating TemperatureDefines performance in harsh environments
Isolation VoltageSafety compliance for medical/industrial use

5. Application Fields

Major industries include:

  • Telecommunications (5G base stations, optical networking equipment)
  • Industrial Automation (PLCs, robotics controllers)
  • Medical Devices (patient monitoring systems, imaging equipment)
  • Consumer Electronics (gaming consoles, VR headsets)
  • Renewable Energy (solar inverters, energy storage systems)

6. Leading Manufacturers and Products

ManufacturerProduct SeriesKey Features
TI (Texas Instruments)LM514565V input, 2.5A output, 95% efficiency
Monolithic PowerMPQ442045V input, 2A output, 3x3mm QFN package
VicorDCM311448V to 12V, 180W, 342W/in power density
CUI IncVX78-10001000V isolation, 10W output, medical grade

7. Selection Guidelines

Key factors to consider:

  • Input/output voltage requirements and transient response
  • Load current profile (continuous vs peak demands)
  • Thermal management capabilities
  • Form factor constraints (e.g., 1/16th brick standard)
  • Protection features (OVP, OCP, OTP)
  • Compliance certifications (CE, UL, IEC 60601-1)

8. Industry Trends

Current development directions include:

  • Adoption of GaN/SiC wide bandgap semiconductors for >97% efficiency
  • Digital control loops for dynamic voltage scaling
  • 3D packaging to achieve >500W/in power density
  • Integrated magnetics for reduced component count
  • Smart converters with PMBus interface for telemetry

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