Accessories

Image Part Number Description / PDF Quantity Rfq
30269

30269

Vicor

HEAT SINK MINI 0.9" THRD/TRANS

45

M-FIAM7HS1

M-FIAM7HS1

Vicor

FIAM7 "H" M28 10A SPG SLOT

0

EN1CG3

EN1CG3

Vicor

AC-DC CONVERTER

0

FARM2E11

FARM2E11

Vicor

FARM2 "E" 1KW SP SLOT

0

FARM2E21

FARM2E21

Vicor

FARM2 "E" 1KW LP SLOT

0

URAM2HG1

URAM2HG1

Vicor

URAM "H" 20A LPG SLOT ROHS

0

18363

18363

Vicor

INMATE SET, 900, BIB, LL

0

MI-A66-IU

MI-A66-IU

Vicor

MI-A66-IU 270V/200W

0

URAM3CS1

URAM3CS1

Vicor

URAM "C" 30A SPG SLOT

0

FARM1CF1

FARM1CF1

Vicor

FARM1 "C" 500W SPG SLOT ROHS

0

VE-AIM-I1-01

VE-AIM-I1-01

Vicor

VE-AIM-I1-01

0

URAM3HG3

URAM3HG3

Vicor

URAM "H" 30A LPG THRU ROHS

0

URAM3MG1

URAM3MG1

Vicor

URAM "M" LPG SLOT ROHS

0

FIAM1TS1

FIAM1TS1

Vicor

FIAM "T" 48 10A SPG SLOT

0

MI-A22-IU-F2

MI-A22-IU-F2

Vicor

MI-A22-IU-F2 28V 200W IAM FIN

0

VI-HAMD-ML

VI-HAMD-ML

Vicor

HB VI-HAMD-ML

0

URAM2T22

URAM2T22

Vicor

URAM "T" 20A LP THRD

0

FARM1T12

FARM1T12

Vicor

FARM1 "T" 500W SP THRD

0

URAM2HG2

URAM2HG2

Vicor

URAM "H" 20A LPG THRD ROHS

0

URAM2C11

URAM2C11

Vicor

URAM "C" 20A SP SLOT

0

Accessories

1. Overview

Board Mount Power Supply Accessories are components designed to facilitate the integration, protection, and optimization of power supply systems on printed circuit boards (PCBs). These accessories ensure reliable electrical connections, thermal management, and electromagnetic compatibility (EMC) in electronic devices. Their importance has grown with advancements in miniaturization, energy efficiency, and high-density computing systems.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Power ConnectorsHigh-current transmission, polarization protection, vibration resistanceServers, industrial automation equipment
Heat SinksPassive cooling, thermal conduction optimization, airflow compatibilityPower amplifiers, LED lighting systems
Fuse HoldersOvercurrent protection, quick-disconnect design, resettable optionsAutomotive electronics, consumer appliances
EMI FiltersHigh-frequency noise suppression, differential/common-mode filteringMedical imaging equipment, communication infrastructure
Terminal BlocksWire-to-board connectivity, screw/clamp termination, color codingIndustrial control panels, HVAC systems

3. Structure and Composition

Typical configurations include:

  • Power Connectors: Made of phosphor bronze contacts with gold plating, thermoplastic insulation (e.g., LCP), and polarization keys
  • Heat Sinks: Extruded aluminum fins with matte black anodization, mounting clips or thermal adhesive pads
  • EMI Filters: Pi-network configuration with X/Y capacitors and common-mode chokes in polymer housing
  • Fuse Holders: Ceramic body with spring-loaded brass contacts and transparent polycarbonate covers

4. Key Technical Specifications

ParameterDescriptionImportance
Current RatingMaximum continuous operating current (1-50A range)Determines power capacity and trace sizing
Dielectric StrengthWithstand voltage (500V-5kV AC)Ensures electrical safety and insulation reliability
Operating TemperatureFunctional range (-55 C to +150 C)Affects performance in harsh environments
Thermal Resistance C/W rating for heat dissipation efficiencyDirectly impacts component lifespan
Insertion LossSignal attenuation at specific frequencies (for EMI filters)Measures noise suppression effectiveness

5. Application Fields

  • Telecommunications: 5G base stations, optical network units
  • Consumer Electronics: Gaming consoles, high-end laptops
  • Medical Devices: MRI scanners, patient monitoring systems
  • Automotive: EV charging systems, ADAS controllers
  • Industrial: CNC machines, PLC systems

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
TE ConnectivityPower Triple Lock connectors3-point contact system, 14A rating
CUI DevicesAMM series heat sinksMulti-finned aluminum design, 20-40 C temperature reduction
LittelfusePOWR-GARD fuse holdersHigh-rupture capacity, LED fault indication
SchurterFMA12 EMI filter12mm slim profile, 250VAC rating

7. Selection Recommendations

Key considerations:

  1. Electrical parameters matching system requirements (voltage/current derating)
  2. Environmental factors (operating temperature, humidity, vibration)
  3. Compliance with standards (UL/CSA/IEC certifications)
  4. PCB footprint compatibility and assembly method (SMT vs. through-hole)
  5. Total Cost of Ownership (lifetime reliability vs. initial cost)

Example: Selecting a 40A connector with 20% derating for a 32A power rail in an industrial motor drive.

8. Industry Trends

Emerging developments include:

  • Integration of smart sensors for real-time thermal monitoring
  • Adoption of advanced materials like graphene-enhanced thermal pads
  • Miniaturization driven by high-density PCB designs (0.8mm pitch connectors)
  • Increase in 48V board-level power distribution systems
  • RoHS-compliant, halogen-free polymer formulations
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