LEDs - Circuit Board Indicators, Arrays, Light Bars, Bar Graphs

Image Part Number Description / PDF Quantity Rfq
DF3SURKD

DF3SURKD

Kingbright

LIGHT BAR 630NM RED 6.8X19.9MM

0

WP1503EB/2YD

WP1503EB/2YD

Kingbright

5MM BI-LEVEL Y/Y PCB LED

0

WP934PJ/3ID

WP934PJ/3ID

Kingbright

LED 3MM TRI-LEVEL 627NM HER DIFF

0

KB2620EW

KB2620EW

Kingbright

LIGHT BAR 627NM RED 8.89X3.81MM

0

WP934GO/2ID

WP934GO/2ID

Kingbright

LED 3MM BI-LEVEL 627NM HER DIFF

0

KB2835SGD

KB2835SGD

Kingbright

LIGHT BAR 565NM GRN 8.89X3.81MM

0

WP934CA/2SRD-90

WP934CA/2SRD-90

Kingbright

LED 3MM BI-LEVEL 655NM RED DIFF

0

WP115WUM/EGW

WP115WUM/EGW

Kingbright

LED IND RED/GRN 3MM RA

0

KB2885SGW

KB2885SGW

Kingbright

LED LIGHT BAR 8.89X19.05MM GREEN

0

KB2785SYKW

KB2785SYKW

Kingbright

LIGHT BAR 590NM YLW 8.89X19.05MM

0

KB2400SYKW

KB2400SYKW

Kingbright

LIGHT BAR 590NM YLW 8.89X3.81MM

0

WP59CB/GYW

WP59CB/GYW

Kingbright

LED 5MM 565/590NM GRN/YW WH DIFF

0

WP934GE/2YD

WP934GE/2YD

Kingbright

LED RA 3MM BI-LEVEL YLW DIFF

0

DE4SGD

DE4SGD

Kingbright

LIGHT BAR 590NM YELLOW 15X15MM

0

WP73JB/SRDA

WP73JB/SRDA

Kingbright

LED 4.8MM RA 660NM RED RED DIFF

0

WP73EB/2IDA

WP73EB/2IDA

Kingbright

LED 4.8MM BI-LEVEL HER DIFF

0

WP934PJ/3GD

WP934PJ/3GD

Kingbright

LED 3MM TRI-LEVEL 565NM GRN DIFF

0

WP934GE/2ID

WP934GE/2ID

Kingbright

LED RA 3MM BI-LEVEL HER DIFF

0

WP934RS/SRD

WP934RS/SRD

Kingbright

LED 3MM RA 655NM RED RED DIFF

0

WP42WUM/GYW

WP42WUM/GYW

Kingbright

LED 3MM RA GRN/YLW WHT DIFF TH

0

LEDs - Circuit Board Indicators, Arrays, Light Bars, Bar Graphs

1. Overview

Light Emitting Diodes (LEDs) are semiconductor devices that convert electrical energy into light through electroluminescence. This product category includes indicators, arrays, light bars, and bar graphs designed for circuit board integration. LEDs serve critical roles in modern electronics for status indication, data visualization, and illumination. Their advantages include low power consumption, long lifespan, and compact form factors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
IndicatorsSingle/dual-color point-source lighting for status indicationPower switches, network routers, medical device panels
ArraysMatrix configurations for alphanumeric/symbol displaySeven-segment displays, dot matrix modules
Light BarsLinear arrangements for directional lighting/brightness zonesAudio level meters, industrial control panels
Bar GraphsSegmented columns for quantitative visual representationBattery level indicators, sensor data visualization

3. Structure and Components

Typical LED components include:

  • Die: Gallium Nitride (GaN) or Indium Gallium Aluminum Phosphide (InGaAlP) semiconductor chips
  • Substrate: FR4 or metal-core PCB for thermal management
  • Encapsulation: Epoxy resin with diffused/optical lens structures
  • Driver Circuitry: Current-limiting resistors or PWM control ICs

4. Key Technical Specifications

ParameterDescriptionImportance
Luminous Intensity0.1-100 cd/m rangeDetermines visibility in various lighting conditions
Wavelength400-700 nm (visible spectrum)Defines color output accuracy
Forward Current2-30 mA typicalImpacts brightness and longevity
Viewing Angle5-120 depending on lens designDictates light distribution pattern
MTBF50,000-100,000 hoursSystem reliability prediction

5. Application Fields

Key industries include:

  • Consumer Electronics: Smartphones, laptops, home appliances
  • Industrial Automation: PLC status indicators, HMI panels
  • Automotive: Dashboard lighting, warning indicators
  • Medical Equipment: Diagnostic status visualization

6. Leading Manufacturers and Products

ManufacturerProduct SeriesKey Features
CreeXLamp XRHigh-brightness automotive indicators
OSRAMLED LineProgrammable RGB light bars
NichiaNSPWR70CSSUltra-compact bar graph displays
EverlightDLW-5xxxWaterproof array modules

7. Selection Recommendations

Key considerations:

  • Environmental Conditions: Temperature (-40 to +85 C operational range)
  • Optical Requirements: Color consistency (CIE 1931 standard)
  • Electrical Compatibility: Driver circuit matching
  • Form Factor: 0402-5050 package size constraints
  • Cost Optimization: Trade-off between performance and budget

Industry Trend Analysis

Current trends show:

  • Micronization: Development of 0201 package formats
  • Smart Integration: Embedded ICs for addressable lighting
  • Energy Efficiency: Sub-1mA operational current devices
  • Automotive Growth: HUD and LiDAR indicator applications
  • Medical Advancements: UV/IR spectrum specialized indicators

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