LEDs - Circuit Board Indicators, Arrays, Light Bars, Bar Graphs

Image Part Number Description / PDF Quantity Rfq
5530233300F

5530233300F

Dialight

LED 2HI 3MM LOW CUR YELLOW PC MN

1663

5530312F

5530312F

Dialight

LED CBI 3MM BI-LVL RED/GRN DIFF

4

5962424002F

5962424002F

Dialight

596 PRISM SMD 1.6MM BILEVEL RND

0

5520811F

5520811F

Dialight

LED 2HI 5MM SUP BRIGHT RED PCMNT

0

5552303F

5552303F

Dialight

LED 2MM 5V RT ANGLE GREEN PC MNT

0

5530188F

5530188F

Dialight

LED 3MM BI-LEVEL BLUE DIFF

1054

5922828313F

5922828313F

Dialight

LED CBI PRISM BLVL WH/WH TR SIL

9900

5680704114F

5680704114F

Dialight

LED CBI 3MM QUAD LEVEL

0

5922525302F

5922525302F

Dialight

LED CBI PRISM BLVL OR/OR SIL

0

5552403F

5552403F

Dialight

LED 2MM 5V RT ANGLE YELLOW PCMNT

0

5530233400F

5530233400F

Dialight

LED CBI 3MM BI-LVL YLW/YLW DIFF

0

5912101102F

5912101102F

Dialight

LED PRISM 3MM SQ ALGAAS RED SMD

0

5532222100F

5532222100F

Dialight

LED CBI 3MM BI-LVL GRN/GRN TINT

0

5952301802F

5952301802F

Dialight

LED PRISM 2MM SQ GREEN 560NM SMD

0

5952101013SF

5952101013SF

Dialight

LED PRISM 2MM SQ RED 660NM SMD

0

5700100132F

5700100132F

Dialight

LED 3HI 2MM RED/YEL/GRN

10102

5913101825F

5913101825F

Dialight

LED PRISM 3MM SQ YLW,GRN SMD

0

5530202400F

5530202400F

Dialight

LED CBI 3MM BI-LVL BLANK/GREEN

0

5923131313F

5923131313F

Dialight

BI-LEVEL Y/G-Y/G SIL 13" REEL SI

483

5500707004F

5500707004F

Dialight

LED 5MM QUAD 5V GREEN PC MNT

0

LEDs - Circuit Board Indicators, Arrays, Light Bars, Bar Graphs

1. Overview

Light Emitting Diodes (LEDs) are semiconductor devices that convert electrical energy into light through electroluminescence. This product category includes indicators, arrays, light bars, and bar graphs designed for circuit board integration. LEDs serve critical roles in modern electronics for status indication, data visualization, and illumination. Their advantages include low power consumption, long lifespan, and compact form factors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
IndicatorsSingle/dual-color point-source lighting for status indicationPower switches, network routers, medical device panels
ArraysMatrix configurations for alphanumeric/symbol displaySeven-segment displays, dot matrix modules
Light BarsLinear arrangements for directional lighting/brightness zonesAudio level meters, industrial control panels
Bar GraphsSegmented columns for quantitative visual representationBattery level indicators, sensor data visualization

3. Structure and Components

Typical LED components include:

  • Die: Gallium Nitride (GaN) or Indium Gallium Aluminum Phosphide (InGaAlP) semiconductor chips
  • Substrate: FR4 or metal-core PCB for thermal management
  • Encapsulation: Epoxy resin with diffused/optical lens structures
  • Driver Circuitry: Current-limiting resistors or PWM control ICs

4. Key Technical Specifications

ParameterDescriptionImportance
Luminous Intensity0.1-100 cd/m rangeDetermines visibility in various lighting conditions
Wavelength400-700 nm (visible spectrum)Defines color output accuracy
Forward Current2-30 mA typicalImpacts brightness and longevity
Viewing Angle5-120 depending on lens designDictates light distribution pattern
MTBF50,000-100,000 hoursSystem reliability prediction

5. Application Fields

Key industries include:

  • Consumer Electronics: Smartphones, laptops, home appliances
  • Industrial Automation: PLC status indicators, HMI panels
  • Automotive: Dashboard lighting, warning indicators
  • Medical Equipment: Diagnostic status visualization

6. Leading Manufacturers and Products

ManufacturerProduct SeriesKey Features
CreeXLamp XRHigh-brightness automotive indicators
OSRAMLED LineProgrammable RGB light bars
NichiaNSPWR70CSSUltra-compact bar graph displays
EverlightDLW-5xxxWaterproof array modules

7. Selection Recommendations

Key considerations:

  • Environmental Conditions: Temperature (-40 to +85 C operational range)
  • Optical Requirements: Color consistency (CIE 1931 standard)
  • Electrical Compatibility: Driver circuit matching
  • Form Factor: 0402-5050 package size constraints
  • Cost Optimization: Trade-off between performance and budget

Industry Trend Analysis

Current trends show:

  • Micronization: Development of 0201 package formats
  • Smart Integration: Embedded ICs for addressable lighting
  • Energy Efficiency: Sub-1mA operational current devices
  • Automotive Growth: HUD and LiDAR indicator applications
  • Medical Advancements: UV/IR spectrum specialized indicators

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