LEDs - Circuit Board Indicators, Arrays, Light Bars, Bar Graphs

Image Part Number Description / PDF Quantity Rfq
5530744F

5530744F

Dialight

LED 2HI 3MM YEL/GRN BICLR PC MNT

4398

5503004F

5503004F

Dialight

LED 5MM VERT RED/GRN DIFF PCMNT

477

5553403F

5553403F

Dialight

LED 2MM 5V VERTICAL YELLOW PC MN

720

5912201007F

5912201007F

Dialight

LED PRISM 3MM RND HI INT GRN SMD

975

5680103122F

5680103122F

Dialight

LED 3MM QUAD LEVEL CBI Y,R,G,G

0

5611101100F

5611101100F

Dialight

LED 5MM VERT LOW CUR RED PC MNT

721

5962429002F

5962429002F

Dialight

596 PRISM SMD 1.6MM BILEVEL RND

0

5922727302F

5922727302F

Dialight

LED CBI PRISM BLVL YW/YW SIL

0

5912701846F

5912701846F

Dialight

LED SMD PRISM 3MM 590NM YLW

0

5503505F

5503505F

Dialight

LED 5MM RED/GRN BICLR 3LEAD

388

5515911F

5515911F

Dialight

LED CBI 3MM GRN 532NM W/PIN RA

0

5530122F

5530122F

Dialight

LED 2HI 3MM GREEN PC MNT

12072

5913001107F

5913001107F

Dialight

LED PRISM 3MM SQ RED,GRN SMD

0

5530203200F

5530203200F

Dialight

LED CBI 3MM BI-LVL BLANK/YELLOW

0

5505304F

5505304F

Dialight

LED 5MM VERT SUP DIFF YEL PC MNT

0

5510407F

5510407F

Dialight

LED 3MM HIGH EFF RED

6872

5912401102F

5912401102F

Dialight

LED PRISM 3MM SQ YELLOW SMD

0

5912201102F

5912201102F

Dialight

LED PRISM 3MM SQ HI INT GRN SMD

0

5913101113SF

5913101113SF

Dialight

LED PRISM 3MM SQ YW,GN SILIC SMD

0

5530004810F

5530004810F

Dialight

LED CBI 3MM MULTI-LEVEL

0

LEDs - Circuit Board Indicators, Arrays, Light Bars, Bar Graphs

1. Overview

Light Emitting Diodes (LEDs) are semiconductor devices that convert electrical energy into light through electroluminescence. This product category includes indicators, arrays, light bars, and bar graphs designed for circuit board integration. LEDs serve critical roles in modern electronics for status indication, data visualization, and illumination. Their advantages include low power consumption, long lifespan, and compact form factors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
IndicatorsSingle/dual-color point-source lighting for status indicationPower switches, network routers, medical device panels
ArraysMatrix configurations for alphanumeric/symbol displaySeven-segment displays, dot matrix modules
Light BarsLinear arrangements for directional lighting/brightness zonesAudio level meters, industrial control panels
Bar GraphsSegmented columns for quantitative visual representationBattery level indicators, sensor data visualization

3. Structure and Components

Typical LED components include:

  • Die: Gallium Nitride (GaN) or Indium Gallium Aluminum Phosphide (InGaAlP) semiconductor chips
  • Substrate: FR4 or metal-core PCB for thermal management
  • Encapsulation: Epoxy resin with diffused/optical lens structures
  • Driver Circuitry: Current-limiting resistors or PWM control ICs

4. Key Technical Specifications

ParameterDescriptionImportance
Luminous Intensity0.1-100 cd/m rangeDetermines visibility in various lighting conditions
Wavelength400-700 nm (visible spectrum)Defines color output accuracy
Forward Current2-30 mA typicalImpacts brightness and longevity
Viewing Angle5-120 depending on lens designDictates light distribution pattern
MTBF50,000-100,000 hoursSystem reliability prediction

5. Application Fields

Key industries include:

  • Consumer Electronics: Smartphones, laptops, home appliances
  • Industrial Automation: PLC status indicators, HMI panels
  • Automotive: Dashboard lighting, warning indicators
  • Medical Equipment: Diagnostic status visualization

6. Leading Manufacturers and Products

ManufacturerProduct SeriesKey Features
CreeXLamp XRHigh-brightness automotive indicators
OSRAMLED LineProgrammable RGB light bars
NichiaNSPWR70CSSUltra-compact bar graph displays
EverlightDLW-5xxxWaterproof array modules

7. Selection Recommendations

Key considerations:

  • Environmental Conditions: Temperature (-40 to +85 C operational range)
  • Optical Requirements: Color consistency (CIE 1931 standard)
  • Electrical Compatibility: Driver circuit matching
  • Form Factor: 0402-5050 package size constraints
  • Cost Optimization: Trade-off between performance and budget

Industry Trend Analysis

Current trends show:

  • Micronization: Development of 0201 package formats
  • Smart Integration: Embedded ICs for addressable lighting
  • Energy Efficiency: Sub-1mA operational current devices
  • Automotive Growth: HUD and LiDAR indicator applications
  • Medical Advancements: UV/IR spectrum specialized indicators

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