LEDs - Circuit Board Indicators, Arrays, Light Bars, Bar Graphs

Image Part Number Description / PDF Quantity Rfq
RL12005YD

RL12005YD

Califia Lighting (Bivar)

LED ASSEMBLY

0

H278CUUYC

H278CUUYC

Califia Lighting (Bivar)

LED ASSEMBLY

0

ELM210MM3SGD

ELM210MM3SGD

Califia Lighting (Bivar)

LED ASSEMBLY

0

H480CHD5V

H480CHD5V

Califia Lighting (Bivar)

LED ASSEMBLY

0

H200CGHD5V

H200CGHD5V

Califia Lighting (Bivar)

LED ASSEMBLY

0

SLM8305HD5V

SLM8305HD5V

Califia Lighting (Bivar)

LED ASSY 0.83" 5MM HER DIFF WHT

0

H278CGYT

H278CGYT

Califia Lighting (Bivar)

LED ASSEMBLY

0

ELM55203BWD

ELM55203BWD

Califia Lighting (Bivar)

LED ASSEMBLY VERTICAL

0

H301CSBC-YG-180

H301CSBC-YG-180

Califia Lighting (Bivar)

LED ASSEMBLY

0

H310CGYYD

H310CGYYD

Califia Lighting (Bivar)

LED ASSEMBLY

0

ELM12205SRDLT

ELM12205SRDLT

Califia Lighting (Bivar)

LED ASSY 0.220" 5MM RED DIFF 2LD

0

H130CGD5V-120

H130CGD5V-120

Califia Lighting (Bivar)

LED ASSEMBLY

0

LTM4005HD

LTM4005HD

Califia Lighting (Bivar)

LED ASSEMBLY VERTICAL

0

H178CBC-Y/G

H178CBC-Y/G

Califia Lighting (Bivar)

LED ASSY RA 5MM YLGRN WHT DIFF

0

H278CSRSGD

H278CSRSGD

Califia Lighting (Bivar)

LED ASSEMBLY

0

H310CGRYD

H310CGRYD

Califia Lighting (Bivar)

LED ASSEMBLY

0

H301CBC-A/G-100

H301CBC-A/G-100

Califia Lighting (Bivar)

LED ASSEMBLY

0

H278DGYD

H278DGYD

Califia Lighting (Bivar)

LED ASSEMBLY VERTICAL

0

RL11604BWD

RL11604BWD

Califia Lighting (Bivar)

LED ASSEMBLY

0

H310CGYXD

H310CGYXD

Califia Lighting (Bivar)

LED ASSEMBLY

0

LEDs - Circuit Board Indicators, Arrays, Light Bars, Bar Graphs

1. Overview

Light Emitting Diodes (LEDs) are semiconductor devices that convert electrical energy into light through electroluminescence. This product category includes indicators, arrays, light bars, and bar graphs designed for circuit board integration. LEDs serve critical roles in modern electronics for status indication, data visualization, and illumination. Their advantages include low power consumption, long lifespan, and compact form factors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
IndicatorsSingle/dual-color point-source lighting for status indicationPower switches, network routers, medical device panels
ArraysMatrix configurations for alphanumeric/symbol displaySeven-segment displays, dot matrix modules
Light BarsLinear arrangements for directional lighting/brightness zonesAudio level meters, industrial control panels
Bar GraphsSegmented columns for quantitative visual representationBattery level indicators, sensor data visualization

3. Structure and Components

Typical LED components include:

  • Die: Gallium Nitride (GaN) or Indium Gallium Aluminum Phosphide (InGaAlP) semiconductor chips
  • Substrate: FR4 or metal-core PCB for thermal management
  • Encapsulation: Epoxy resin with diffused/optical lens structures
  • Driver Circuitry: Current-limiting resistors or PWM control ICs

4. Key Technical Specifications

ParameterDescriptionImportance
Luminous Intensity0.1-100 cd/m rangeDetermines visibility in various lighting conditions
Wavelength400-700 nm (visible spectrum)Defines color output accuracy
Forward Current2-30 mA typicalImpacts brightness and longevity
Viewing Angle5-120 depending on lens designDictates light distribution pattern
MTBF50,000-100,000 hoursSystem reliability prediction

5. Application Fields

Key industries include:

  • Consumer Electronics: Smartphones, laptops, home appliances
  • Industrial Automation: PLC status indicators, HMI panels
  • Automotive: Dashboard lighting, warning indicators
  • Medical Equipment: Diagnostic status visualization

6. Leading Manufacturers and Products

ManufacturerProduct SeriesKey Features
CreeXLamp XRHigh-brightness automotive indicators
OSRAMLED LineProgrammable RGB light bars
NichiaNSPWR70CSSUltra-compact bar graph displays
EverlightDLW-5xxxWaterproof array modules

7. Selection Recommendations

Key considerations:

  • Environmental Conditions: Temperature (-40 to +85 C operational range)
  • Optical Requirements: Color consistency (CIE 1931 standard)
  • Electrical Compatibility: Driver circuit matching
  • Form Factor: 0402-5050 package size constraints
  • Cost Optimization: Trade-off between performance and budget

Industry Trend Analysis

Current trends show:

  • Micronization: Development of 0201 package formats
  • Smart Integration: Embedded ICs for addressable lighting
  • Energy Efficiency: Sub-1mA operational current devices
  • Automotive Growth: HUD and LiDAR indicator applications
  • Medical Advancements: UV/IR spectrum specialized indicators

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