LEDs - Circuit Board Indicators, Arrays, Light Bars, Bar Graphs

Image Part Number Description / PDF Quantity Rfq
XEMG2820D

XEMG2820D

SunLED

LIGHTBAR 8.89X3.81MM GREEN DIFF

0

XPZ3LUR147D

XPZ3LUR147D

SunLED

LED 3MM RED DIFF TRI-LEVEL CBI

0

XEUY29DX

XEUY29DX

SunLED

LIGHTBAR 15MM SQ YELLOW YLW DIFF

0

XWA4LUG147D

XWA4LUG147D

SunLED

LED 3MM QUAD LVL GRN GN DIFF CBI

0

XNF4ZUY46D

XNF4ZUY46D

SunLED

LED 4POS YELLOW DIFFUSED CBI

0

XEUY2735M

XEUY2735M

SunLED

LIGHTBAR 2-SEG YELLOW WHT DIFF

0

XVC2LUY48D

XVC2LUY48D

SunLED

LED 4.8MM YLW DIFF BI-LEVEL CBI

0

XEURMG2885M

XEURMG2885M

SunLED

LIGHTBAR 8.89X19.05MM R/G WH DIF

0

XGUYX20D

XGUYX20D

SunLED

BAR GRAPH ARRAY 20-SEG YELLOW

0

XQL2LUG11D

XQL2LUG11D

SunLED

LED 3MM GREEN DIFF BI-LEVEL CBI

0

XQT2LUY11D

XQT2LUY11D

SunLED

LED 3MM YELLOW DIFF BI-LEVEL CBI

0

XEMG2835D

XEMG2835D

SunLED

LIGHTBAR 3.81X19.05MM GREEN DIFF

0

XWP1SUGY93M

XWP1SUGY93M

SunLED

LED 3MM GN/YW WHT DIFF BI-COLOR

0

XEUR2685M

XEUR2685M

SunLED

LIGHTBAR 8.89X19.05MM RD WH DIFF

0

XVC2LUR48D

XVC2LUR48D

SunLED

LED 4.8MM RED DIFF BI-LEVEL CBI

0

XVX4SUG91D

XVX4SUG91D

SunLED

LED 2X3 QUAD LVL GRN GN DIFF CBI

0

XPZ3LUG147D

XPZ3LUG147D

SunLED

LED 3MM GREEN DIFF TRI-LEVEL CBI

0

XVT1LUY48D

XVT1LUY48D

SunLED

LED 4.8MM YELLOW DIFFUSED RA CBI

0

XEUR2620M

XEUR2620M

SunLED

LIGHTBAR 4-SEG RED WHITE DIFF

0

XYH1LUG11D

XYH1LUG11D

SunLED

LED 3MM GREEN GRN DIFF BI-COLOR

0

LEDs - Circuit Board Indicators, Arrays, Light Bars, Bar Graphs

1. Overview

Light Emitting Diodes (LEDs) are semiconductor devices that convert electrical energy into light through electroluminescence. This product category includes indicators, arrays, light bars, and bar graphs designed for circuit board integration. LEDs serve critical roles in modern electronics for status indication, data visualization, and illumination. Their advantages include low power consumption, long lifespan, and compact form factors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
IndicatorsSingle/dual-color point-source lighting for status indicationPower switches, network routers, medical device panels
ArraysMatrix configurations for alphanumeric/symbol displaySeven-segment displays, dot matrix modules
Light BarsLinear arrangements for directional lighting/brightness zonesAudio level meters, industrial control panels
Bar GraphsSegmented columns for quantitative visual representationBattery level indicators, sensor data visualization

3. Structure and Components

Typical LED components include:

  • Die: Gallium Nitride (GaN) or Indium Gallium Aluminum Phosphide (InGaAlP) semiconductor chips
  • Substrate: FR4 or metal-core PCB for thermal management
  • Encapsulation: Epoxy resin with diffused/optical lens structures
  • Driver Circuitry: Current-limiting resistors or PWM control ICs

4. Key Technical Specifications

ParameterDescriptionImportance
Luminous Intensity0.1-100 cd/m rangeDetermines visibility in various lighting conditions
Wavelength400-700 nm (visible spectrum)Defines color output accuracy
Forward Current2-30 mA typicalImpacts brightness and longevity
Viewing Angle5-120 depending on lens designDictates light distribution pattern
MTBF50,000-100,000 hoursSystem reliability prediction

5. Application Fields

Key industries include:

  • Consumer Electronics: Smartphones, laptops, home appliances
  • Industrial Automation: PLC status indicators, HMI panels
  • Automotive: Dashboard lighting, warning indicators
  • Medical Equipment: Diagnostic status visualization

6. Leading Manufacturers and Products

ManufacturerProduct SeriesKey Features
CreeXLamp XRHigh-brightness automotive indicators
OSRAMLED LineProgrammable RGB light bars
NichiaNSPWR70CSSUltra-compact bar graph displays
EverlightDLW-5xxxWaterproof array modules

7. Selection Recommendations

Key considerations:

  • Environmental Conditions: Temperature (-40 to +85 C operational range)
  • Optical Requirements: Color consistency (CIE 1931 standard)
  • Electrical Compatibility: Driver circuit matching
  • Form Factor: 0402-5050 package size constraints
  • Cost Optimization: Trade-off between performance and budget

Industry Trend Analysis

Current trends show:

  • Micronization: Development of 0201 package formats
  • Smart Integration: Embedded ICs for addressable lighting
  • Energy Efficiency: Sub-1mA operational current devices
  • Automotive Growth: HUD and LiDAR indicator applications
  • Medical Advancements: UV/IR spectrum specialized indicators

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