LEDs - Circuit Board Indicators, Arrays, Light Bars, Bar Graphs

Image Part Number Description / PDF Quantity Rfq
XEURMG2350M

XEURMG2350M

SunLED

LIGHTBAR 19.05X3.81MM R/G WH DIF

0

XEMDK21D

XEMDK21D

SunLED

3.6X6.1MM RED LIGHT BAR LED

10

XEUY2400M

XEUY2400M

SunLED

LIGHTBAR 8.89X3.81MM YLW WH DIFF

0

XVB1LUG11D

XVB1LUG11D

SunLED

LED 1POS GREEN DIFFUSED CBI

0

XVQ1LUR41D

XVQ1LUR41D

SunLED

LED 3.4MM RED DIFFUSED RA CBI

0

XPV1LUY147D

XPV1LUY147D

SunLED

LED 3MM YELLOW DIFF 1POS RA CBI

0

XEUR23D

XEUR23D

SunLED

LIGHTBAR 5X16MM RED RED DIFF

0

XVG2LUR11D

XVG2LUR11D

SunLED

LED 2POS GREEN DIFFUSED CBI

0

XEUR2600M

XEUR2600M

SunLED

LIGHTBAR 2-SEG RED WHITE DIFF

0

XVG2LUR147D

XVG2LUR147D

SunLED

LED 3MM RED DIFF BI-LEVEL CBI

0

XGUGUYX10D

XGUGUYX10D

SunLED

BAR GRAPH ARRAY 10-SEG G/Y BICLR

0

XPF2LUG11D

XPF2LUG11D

SunLED

LED IND 3MM GN DIFF BI-LEVEL CBI

0

XEMRC100M

XEMRC100M

SunLED

LIGHTBAR 8.89MM SQ RED WHT DIFF

0

XVM1LUGY59M

XVM1LUGY59M

SunLED

LED 5MM G/Y WHT DIFF BI-LEVEL RA

0

XPT1LUG41D

XPT1LUG41D

SunLED

LED 3.4MM GRN DIFF 1POS RA CBI

0

XPV1LUR11D

XPV1LUR11D

SunLED

LED 1POS RED DIFFUSED CBI

0

XEMG2550D

XEMG2550D

SunLED

LIGHTBAR 19.05X3.81MM GREEN DIFF

0

XNH1ZUR46D

XNH1ZUR46D

SunLED

LED 1POS RED DIFFUSED CBI

0

XPV1LUY11D

XPV1LUY11D

SunLED

LED 1POS YELLOW DIFFUSED CBI

0

XEUY2700M

XEUY2700M

SunLED

LIGHTBAR 2-SEG YELLOW WHT DIFF

0

LEDs - Circuit Board Indicators, Arrays, Light Bars, Bar Graphs

1. Overview

Light Emitting Diodes (LEDs) are semiconductor devices that convert electrical energy into light through electroluminescence. This product category includes indicators, arrays, light bars, and bar graphs designed for circuit board integration. LEDs serve critical roles in modern electronics for status indication, data visualization, and illumination. Their advantages include low power consumption, long lifespan, and compact form factors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
IndicatorsSingle/dual-color point-source lighting for status indicationPower switches, network routers, medical device panels
ArraysMatrix configurations for alphanumeric/symbol displaySeven-segment displays, dot matrix modules
Light BarsLinear arrangements for directional lighting/brightness zonesAudio level meters, industrial control panels
Bar GraphsSegmented columns for quantitative visual representationBattery level indicators, sensor data visualization

3. Structure and Components

Typical LED components include:

  • Die: Gallium Nitride (GaN) or Indium Gallium Aluminum Phosphide (InGaAlP) semiconductor chips
  • Substrate: FR4 or metal-core PCB for thermal management
  • Encapsulation: Epoxy resin with diffused/optical lens structures
  • Driver Circuitry: Current-limiting resistors or PWM control ICs

4. Key Technical Specifications

ParameterDescriptionImportance
Luminous Intensity0.1-100 cd/m rangeDetermines visibility in various lighting conditions
Wavelength400-700 nm (visible spectrum)Defines color output accuracy
Forward Current2-30 mA typicalImpacts brightness and longevity
Viewing Angle5-120 depending on lens designDictates light distribution pattern
MTBF50,000-100,000 hoursSystem reliability prediction

5. Application Fields

Key industries include:

  • Consumer Electronics: Smartphones, laptops, home appliances
  • Industrial Automation: PLC status indicators, HMI panels
  • Automotive: Dashboard lighting, warning indicators
  • Medical Equipment: Diagnostic status visualization

6. Leading Manufacturers and Products

ManufacturerProduct SeriesKey Features
CreeXLamp XRHigh-brightness automotive indicators
OSRAMLED LineProgrammable RGB light bars
NichiaNSPWR70CSSUltra-compact bar graph displays
EverlightDLW-5xxxWaterproof array modules

7. Selection Recommendations

Key considerations:

  • Environmental Conditions: Temperature (-40 to +85 C operational range)
  • Optical Requirements: Color consistency (CIE 1931 standard)
  • Electrical Compatibility: Driver circuit matching
  • Form Factor: 0402-5050 package size constraints
  • Cost Optimization: Trade-off between performance and budget

Industry Trend Analysis

Current trends show:

  • Micronization: Development of 0201 package formats
  • Smart Integration: Embedded ICs for addressable lighting
  • Energy Efficiency: Sub-1mA operational current devices
  • Automotive Growth: HUD and LiDAR indicator applications
  • Medical Advancements: UV/IR spectrum specialized indicators

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