LEDs - Circuit Board Indicators, Arrays, Light Bars, Bar Graphs

Image Part Number Description / PDF Quantity Rfq
XEUR2600M

XEUR2600M

SunLED

LIGHTBAR 2-SEG RED WHITE DIFF

0

5961515002F

5961515002F

Dialight

596 PRISM SMD 1.6MM BILEVEL RND

0

5710122F

5710122F

Dialight

LED 2MM BI-LEVEL GRN/GRN DIFF

6877

5502304F

5502304F

Dialight

LED 5MM VERT HI EFF YELL PC MNT

1558

SSF-LXH100LID

SSF-LXH100LID

Lumex, Inc.

LED 5MM RA LOWCUR RED PC MOUNT

10011

5912001013F

5912001013F

Dialight

LED PRISM 3MM RA HIEFF RED SMT

13291

5500204F

5500204F

Dialight

LED 5MM VERTICAL GREEN PC MNT

891

HLMP2350

HLMP2350

Everlight Electronics

LED LT BAR HI EFF RED 4LED SIP

0

5306H1

5306H1

Visual Communications Company, LLC

LED RED T1-3/4 RIGHT ANGLE PCB

365

WP934MD/2ID

WP934MD/2ID

Kingbright

LED 3MM BI-LEVEL 627NM HER DIFF

0

5640700821F

5640700821F

Dialight

LED CBI 3MM 3X1 Y/G,ORN,ORN DIFF

0

5612201080F

5612201080F

Dialight

LED 5MM VERT HE DIFF GRN PC MNT

759

5912601102F

5912601102F

Dialight

LED PRISM 3MM SQ BLUE SMD

0

SSA-LXB525YD

SSA-LXB525YD

Lumex, Inc.

LED ARRAY 2X5MM 5-SEG YELLOW

0

5501105F

5501105F

Dialight

LED 5MM RT ANG LOW CUR RED PCMNT

328

WP934CB/SRD

WP934CB/SRD

Kingbright

LED IND 3MM RA 655NM RED DIFF

0

5502408F

5502408F

Dialight

LED CBI 5MM RED DIFF 20A

2400

5510209806F

5510209806F

Dialight

LED 3MM RT ANG HI EFF GRN PC MNT

27800

XVG2LUR147D

XVG2LUR147D

SunLED

LED 3MM RED DIFF BI-LEVEL CBI

0

5961616013F

5961616013F

Dialight

596 PRISM SMD 1.6MM BILEVEL RND

0

LEDs - Circuit Board Indicators, Arrays, Light Bars, Bar Graphs

1. Overview

Light Emitting Diodes (LEDs) are semiconductor devices that convert electrical energy into light through electroluminescence. This product category includes indicators, arrays, light bars, and bar graphs designed for circuit board integration. LEDs serve critical roles in modern electronics for status indication, data visualization, and illumination. Their advantages include low power consumption, long lifespan, and compact form factors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
IndicatorsSingle/dual-color point-source lighting for status indicationPower switches, network routers, medical device panels
ArraysMatrix configurations for alphanumeric/symbol displaySeven-segment displays, dot matrix modules
Light BarsLinear arrangements for directional lighting/brightness zonesAudio level meters, industrial control panels
Bar GraphsSegmented columns for quantitative visual representationBattery level indicators, sensor data visualization

3. Structure and Components

Typical LED components include:

  • Die: Gallium Nitride (GaN) or Indium Gallium Aluminum Phosphide (InGaAlP) semiconductor chips
  • Substrate: FR4 or metal-core PCB for thermal management
  • Encapsulation: Epoxy resin with diffused/optical lens structures
  • Driver Circuitry: Current-limiting resistors or PWM control ICs

4. Key Technical Specifications

ParameterDescriptionImportance
Luminous Intensity0.1-100 cd/m rangeDetermines visibility in various lighting conditions
Wavelength400-700 nm (visible spectrum)Defines color output accuracy
Forward Current2-30 mA typicalImpacts brightness and longevity
Viewing Angle5-120 depending on lens designDictates light distribution pattern
MTBF50,000-100,000 hoursSystem reliability prediction

5. Application Fields

Key industries include:

  • Consumer Electronics: Smartphones, laptops, home appliances
  • Industrial Automation: PLC status indicators, HMI panels
  • Automotive: Dashboard lighting, warning indicators
  • Medical Equipment: Diagnostic status visualization

6. Leading Manufacturers and Products

ManufacturerProduct SeriesKey Features
CreeXLamp XRHigh-brightness automotive indicators
OSRAMLED LineProgrammable RGB light bars
NichiaNSPWR70CSSUltra-compact bar graph displays
EverlightDLW-5xxxWaterproof array modules

7. Selection Recommendations

Key considerations:

  • Environmental Conditions: Temperature (-40 to +85 C operational range)
  • Optical Requirements: Color consistency (CIE 1931 standard)
  • Electrical Compatibility: Driver circuit matching
  • Form Factor: 0402-5050 package size constraints
  • Cost Optimization: Trade-off between performance and budget

Industry Trend Analysis

Current trends show:

  • Micronization: Development of 0201 package formats
  • Smart Integration: Embedded ICs for addressable lighting
  • Energy Efficiency: Sub-1mA operational current devices
  • Automotive Growth: HUD and LiDAR indicator applications
  • Medical Advancements: UV/IR spectrum specialized indicators

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