| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
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Woodhead - Molex |
ROUND HEAT SINK MOLEX LED HOLDER |
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LED Thermal Products are specialized components designed to manage heat dissipation in light-emitting diode (LED) systems. These products ensure optimal thermal management by transferring heat away from LED junctions, maintaining performance efficiency, and extending operational lifespan. With LEDs generating significant thermal energy during operation, these thermal management solutions are critical in applications ranging from consumer electronics to industrial lighting systems. Effective thermal control prevents luminous efficacy degradation, color shift, and premature device failure.
| Type | Functional Features | Application Examples |
|---|---|---|
| Heat Sinks | Passive cooling with high surface-area structures (e.g., aluminum fins) | Street lighting, high-power LED modules |
| Thermoelectric Coolers (TEC) | Active cooling using Peltier effect for precise temperature control | Automotive LED headlights, medical imaging devices |
| Thermal Interface Materials (TIM) | Gap-filling pads or adhesives enhancing heat transfer between components | LED downlights, display backlighting |
| Phase Change Materials (PCM) | Store/release thermal energy during phase transitions | Smartphone LED flashes, aerospace systems |
| Heat Pipes | Two-phase heat transfer using evaporative cooling | Industrial laser diodes, stadium lighting |
Typical LED thermal products consist of: - Metal-based substrates (aluminum/copper) for heat sinks and PCBs - Thermoelectric ceramics (Bi2Te3-based) in TECs - Graphene-enhanced polymers in advanced TIMs - Capillary structures in heat pipes with water/ammonia working fluids - Phase-change alloys (paraffin wax composites) for PCM systems
| Parameter | Importance |
|---|---|
| Thermal Conductivity (W/m K) | Measures heat transfer efficiency; higher values indicate better performance |
| Operating Temperature Range ( C) | Defines material stability limits under thermal stress |
| Thermal Resistance ( C/W) | Quantifies resistance to heat flow between interfaces |
| Material Compatibility | Ensures chemical/electrical compatibility with LED components |
| Dimensional Tolerance ( m) | Impacts mechanical fit and thermal contact quality |
| Manufacturer | Representative Product |
|---|---|
| Laird Thermal Systems | HiTemp TE Series (127-stage thermoelectric coolers) |
| Fischer Elektronik | SKIN-Top series (extruded aluminum heat sinks) |
| Cool Innovations | CoolGaN (GaN-on-diamond thermal substrates) |
| Bergquist | PhaseTEC TPCM (0.25W/cm thermal storage materials) |
| Advanced Cooling Technologies | ACT800 heat pipes (1000W thermal capacity) |
Key considerations: - Match thermal conductivity ( 5W/m K for TIMs) with application power density - Ensure material compatibility with LED substrate (avoid galvanic corrosion) - Balance cost vs. performance for volume production - Consider environmental factors (humidity, vibration) - Case Study: Outdoor LED displays require IP68-rated heat sinks with 200W/m K conductivity
Emerging developments include: - Graphene-integrated TIMs reaching 20W/m K conductivity - MEMS-based micro-TECs for wearable devices - AI-optimized heat sink topologies reducing weight by 30% - Bio-based phase change materials for eco-friendly solutions - Integrated sensor-thermal systems for real-time feedback control