LED Thermal Products

Part Number	Description / PDF	Quantity
1887214 Henkel / Bergquist	SQUARE THERMAL PAD BRIDGELUX	0
803111 Henkel / Bergquist	SQU THERM CLAD BRD AVAGO MOONSTN	4620
803125 Henkel / Bergquist	STAR THERMAL CLAD BOARD LUXEON I	3481
803115 Henkel / Bergquist	SQUARE THERMAL CLAD BOARD LUXEON	9247
803128 Henkel / Bergquist	STAR THERM CLAD BD GOLDEN DRAGON	764
803267 Henkel / Bergquist	STAR THERM CLAD BRD LUXEON REBEL	0
803266 Henkel / Bergquist	STAR THERM CLAD BOARD LUXEON K2	10
803122 Henkel / Bergquist	STAR THERMAL CLAD BOARD CREE XRE	3356
803808 Henkel / Bergquist	STAR THERM CLAD BRD OSRAM OSTAR	813
803124 Henkel / Bergquist	STAR THERM CLAD BRD LUMEX SML-LX	9708
803114 Henkel / Bergquist	SQU THERM CLAD BRD LUMEX SML-LX	9591
803262 Henkel / Bergquist	STAR THERMAL CLAD BOARD CREE XRE	12
803482 Henkel / Bergquist	SQUARE THERM CLAD BRD SEOUL SEMI	0
803265 Henkel / Bergquist	STAR THERMAL CLAD BOARD LUXEON I	0
803268 Henkel / Bergquist	STAR THERM CLAD BD GOLDEN DRAGON	825
803123 Henkel / Bergquist	STAR THERM CLAD BRD LITE-ON LOPL	9679
803261 Henkel / Bergquist	STAR THERM CLAD BRD AVAGO MNSTON	11
803807 Henkel / Bergquist	SQU THERM CLAD BRD OSRAM OSTAR	0
803127 Henkel / Bergquist	STAR THERM CLAD BRD LUXEON REBEL	0
803117 Henkel / Bergquist	SQUARE THERM CLAD BRD LUXEON REB	3147

LED Thermal Products

1. Overview

LED Thermal Products are specialized components designed to manage heat dissipation in light-emitting diode (LED) systems. These products ensure optimal thermal management by transferring heat away from LED junctions, maintaining performance efficiency, and extending operational lifespan. With LEDs generating significant thermal energy during operation, these thermal management solutions are critical in applications ranging from consumer electronics to industrial lighting systems. Effective thermal control prevents luminous efficacy degradation, color shift, and premature device failure.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Heat Sinks	Passive cooling with high surface-area structures (e.g., aluminum fins)	Street lighting, high-power LED modules
Thermoelectric Coolers (TEC)	Active cooling using Peltier effect for precise temperature control	Automotive LED headlights, medical imaging devices
Thermal Interface Materials (TIM)	Gap-filling pads or adhesives enhancing heat transfer between components	LED downlights, display backlighting
Phase Change Materials (PCM)	Store/release thermal energy during phase transitions	Smartphone LED flashes, aerospace systems
Heat Pipes	Two-phase heat transfer using evaporative cooling	Industrial laser diodes, stadium lighting

3. Structure and Composition

Typical LED thermal products consist of: - Metal-based substrates (aluminum/copper) for heat sinks and PCBs - Thermoelectric ceramics (Bi₂Te₃-based) in TECs - Graphene-enhanced polymers in advanced TIMs - Capillary structures in heat pipes with water/ammonia working fluids - Phase-change alloys (paraffin wax composites) for PCM systems

4. Key Technical Specifications

Parameter	Importance
Thermal Conductivity (W/m K)	Measures heat transfer efficiency; higher values indicate better performance
Operating Temperature Range ( C)	Defines material stability limits under thermal stress
Thermal Resistance ( C/W)	Quantifies resistance to heat flow between interfaces
Material Compatibility	Ensures chemical/electrical compatibility with LED components
Dimensional Tolerance ( m)	Impacts mechanical fit and thermal contact quality

5. Application Fields

General Lighting: Commercial LED fixtures, tunnel lighting
Consumer Electronics: Smartphone camera flashes, TV backlight units
Automotive: Adaptive driving beam (ADB) systems, LiDAR sensors
Industrial: UV curing systems, machine vision equipment
Medical: Endoscopic illumination, phototherapy devices

6. Leading Manufacturers and Products

Manufacturer	Representative Product
Laird Thermal Systems	HiTemp TE Series (127-stage thermoelectric coolers)
Fischer Elektronik	SKIN-Top series (extruded aluminum heat sinks)
Cool Innovations	CoolGaN (GaN-on-diamond thermal substrates)
Bergquist	PhaseTEC TPCM (0.25W/cm thermal storage materials)
Advanced Cooling Technologies	ACT800 heat pipes (1000W thermal capacity)

7. Selection Guidelines

Key considerations: - Match thermal conductivity ( 5W/m K for TIMs) with application power density - Ensure material compatibility with LED substrate (avoid galvanic corrosion) - Balance cost vs. performance for volume production - Consider environmental factors (humidity, vibration) - Case Study: Outdoor LED displays require IP68-rated heat sinks with 200W/m K conductivity

8. Industry Trends

Emerging developments include: - Graphene-integrated TIMs reaching 20W/m K conductivity - MEMS-based micro-TECs for wearable devices - AI-optimized heat sink topologies reducing weight by 30% - Bio-based phase change materials for eco-friendly solutions - Integrated sensor-thermal systems for real-time feedback control