LED Thermal Products

Part Number	Description / PDF	Quantity
TA002-10002 Sunon	ROUND FANSINK DOWNLIGHT MODULES	0
LA004-001A99DN Sunon	ROUND FANSINK OSRAM PREVALED	0
ATSEU-077B-C2-R0 Advanced Thermal Solutions, Inc.	STAR HEAT SINK LED	0
LP0006/01-LI98-0.25 t-Global Technology	THERM PAD LUXEON LXK8-PWXX-0024	0
SA000-12055 Sunon	ROUND HEAT SINK SPOTLIGHTS	0
LMH020-HS00-0000-0000002 Cree	ROUND HEAT SINK LMH2 LED MODULE	190
LP0005/01-LI98-0.15 t-Global Technology	THERM PAD LUXEON LXK8-PWXX-0012	0
LP0001/01-TG-A486G-0.3-2A t-Global Technology	STAR THERMAL PAD LED STAR BRD	0
803127 Henkel / Bergquist	STAR THERM CLAD BRD LUXEON REBEL	0
803117 Henkel / Bergquist	SQUARE THERM CLAD BRD LUXEON REB	3147
LP0006/01-LI2000A-0.2 t-Global Technology	THERM PAD LUXEON LXK8-PQXX-0024	0
DUALLED-5850 Wakefield-Vette	LED FAN HEAT SINK 58X50MM	64
882-100AB Wakefield-Vette	ROUND HEAT SINK STAR LED BOARDS	378
ATSEU-077C-C1-R0 Advanced Thermal Solutions, Inc.	STAR HEAT SINK LED	72
803116 Henkel / Bergquist	SQUARE THERM CLAD BRD LUXEON K2	8970
19756-S-AB Wakefield-Vette	ROUND HEAT SINK BRIDGELUX LED	0
TG-CPCB2-LI98-0.15 t-Global Technology	RECT THERM CLAD BRD LUXEON LED	0
PG1W-12-60-L3BN ebm-papst Inc.	ROUND FANSINK XICATO LED MODULES	2
LP0005/01-TG-A373F-0.3-2A t-Global Technology	THERMAL PAD LXK8-PWXX-0012/0016	0
SA-LED-151E Ohmite	ROUND HEAT SINK GENERAL PURPOSE	4

LED Thermal Products

1. Overview

LED Thermal Products are specialized components designed to manage heat dissipation in light-emitting diode (LED) systems. These products ensure optimal thermal management by transferring heat away from LED junctions, maintaining performance efficiency, and extending operational lifespan. With LEDs generating significant thermal energy during operation, these thermal management solutions are critical in applications ranging from consumer electronics to industrial lighting systems. Effective thermal control prevents luminous efficacy degradation, color shift, and premature device failure.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Heat Sinks	Passive cooling with high surface-area structures (e.g., aluminum fins)	Street lighting, high-power LED modules
Thermoelectric Coolers (TEC)	Active cooling using Peltier effect for precise temperature control	Automotive LED headlights, medical imaging devices
Thermal Interface Materials (TIM)	Gap-filling pads or adhesives enhancing heat transfer between components	LED downlights, display backlighting
Phase Change Materials (PCM)	Store/release thermal energy during phase transitions	Smartphone LED flashes, aerospace systems
Heat Pipes	Two-phase heat transfer using evaporative cooling	Industrial laser diodes, stadium lighting

3. Structure and Composition

Typical LED thermal products consist of: - Metal-based substrates (aluminum/copper) for heat sinks and PCBs - Thermoelectric ceramics (Bi₂Te₃-based) in TECs - Graphene-enhanced polymers in advanced TIMs - Capillary structures in heat pipes with water/ammonia working fluids - Phase-change alloys (paraffin wax composites) for PCM systems

4. Key Technical Specifications

Parameter	Importance
Thermal Conductivity (W/m K)	Measures heat transfer efficiency; higher values indicate better performance
Operating Temperature Range ( C)	Defines material stability limits under thermal stress
Thermal Resistance ( C/W)	Quantifies resistance to heat flow between interfaces
Material Compatibility	Ensures chemical/electrical compatibility with LED components
Dimensional Tolerance ( m)	Impacts mechanical fit and thermal contact quality

5. Application Fields

General Lighting: Commercial LED fixtures, tunnel lighting
Consumer Electronics: Smartphone camera flashes, TV backlight units
Automotive: Adaptive driving beam (ADB) systems, LiDAR sensors
Industrial: UV curing systems, machine vision equipment
Medical: Endoscopic illumination, phototherapy devices

6. Leading Manufacturers and Products

Manufacturer	Representative Product
Laird Thermal Systems	HiTemp TE Series (127-stage thermoelectric coolers)
Fischer Elektronik	SKIN-Top series (extruded aluminum heat sinks)
Cool Innovations	CoolGaN (GaN-on-diamond thermal substrates)
Bergquist	PhaseTEC TPCM (0.25W/cm thermal storage materials)
Advanced Cooling Technologies	ACT800 heat pipes (1000W thermal capacity)

7. Selection Guidelines

Key considerations: - Match thermal conductivity ( 5W/m K for TIMs) with application power density - Ensure material compatibility with LED substrate (avoid galvanic corrosion) - Balance cost vs. performance for volume production - Consider environmental factors (humidity, vibration) - Case Study: Outdoor LED displays require IP68-rated heat sinks with 200W/m K conductivity

8. Industry Trends

Emerging developments include: - Graphene-integrated TIMs reaching 20W/m K conductivity - MEMS-based micro-TECs for wearable devices - AI-optimized heat sink topologies reducing weight by 30% - Bio-based phase change materials for eco-friendly solutions - Integrated sensor-thermal systems for real-time feedback control