LED Thermal Products

Image Part Number Description / PDF Quantity Rfq
ATSEU-109-C2-R0

ATSEU-109-C2-R0

Advanced Thermal Solutions, Inc.

STAR HEAT SINK LED

0

DUALLED-5880

DUALLED-5880

Wakefield-Vette

LED FAN HEAT SINK 58X80MM

83

19755-XXL

19755-XXL

Wakefield-Vette

ROUND HEAT SINK BRIDGELUX LED

0

SV-LED-414E

SV-LED-414E

Ohmite

DEGREASED, 14MM LG

180

803286

803286

Henkel / Bergquist

SQUARE THERM CLAD BRD LUXEON K2

0

803287

803287

Henkel / Bergquist

SQUARE THERM CLAD BRD LUXEON REB

0

19756-XL-AB

19756-XL-AB

Wakefield-Vette

ROUND HEAT SINK BRIDGELUX LED

0

803771

803771

Henkel / Bergquist

SQU THERM CLAD BRD CREE XLAMP

0

A001-010S

A001-010S

LEDdynamics, Inc.

LED ISOLATED STARS 10PC

0

803112

803112

Henkel / Bergquist

SQUARE THERMAL CLAD BRD CREE XRE

0

19755-S

19755-S

Wakefield-Vette

ROUND HEAT SINK BRIDGELUX LED

0

803282

803282

Henkel / Bergquist

SQUARE THERMAL CLAD BRD CREE XRE

0

19756-L

19756-L

Wakefield-Vette

ROUND HEAT SINK BRIDGELUX LED

0

LM310-003A99DN

LM310-003A99DN

Sunon

RECTANGULAR FANSINK BRIDGELUX RS

0

LA001-002A99DY

LA001-002A99DY

Sunon

ROUND FANSINK GE INFUSION

0

19756-M

19756-M

Wakefield-Vette

ROUND HEAT SINK BRIDGELUX LED

0

19756-XL

19756-XL

Wakefield-Vette

ROUND HEAT SINK BRIDGELUX LED

0

804087

804087

Henkel / Bergquist

STAR THERM CLAD BRD OSRAM OSLON

0

803806

803806

Henkel / Bergquist

SQU THERM CLAD BRD CREE XLAMP

0

803772

803772

Henkel / Bergquist

STAR THERM CLAD BOARD CREE XLAMP

0

LED Thermal Products

1. Overview

LED Thermal Products are specialized components designed to manage heat dissipation in light-emitting diode (LED) systems. These products ensure optimal thermal management by transferring heat away from LED junctions, maintaining performance efficiency, and extending operational lifespan. With LEDs generating significant thermal energy during operation, these thermal management solutions are critical in applications ranging from consumer electronics to industrial lighting systems. Effective thermal control prevents luminous efficacy degradation, color shift, and premature device failure.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Heat SinksPassive cooling with high surface-area structures (e.g., aluminum fins)Street lighting, high-power LED modules
Thermoelectric Coolers (TEC)Active cooling using Peltier effect for precise temperature controlAutomotive LED headlights, medical imaging devices
Thermal Interface Materials (TIM)Gap-filling pads or adhesives enhancing heat transfer between componentsLED downlights, display backlighting
Phase Change Materials (PCM)Store/release thermal energy during phase transitionsSmartphone LED flashes, aerospace systems
Heat PipesTwo-phase heat transfer using evaporative coolingIndustrial laser diodes, stadium lighting

3. Structure and Composition

Typical LED thermal products consist of: - Metal-based substrates (aluminum/copper) for heat sinks and PCBs - Thermoelectric ceramics (Bi2Te3-based) in TECs - Graphene-enhanced polymers in advanced TIMs - Capillary structures in heat pipes with water/ammonia working fluids - Phase-change alloys (paraffin wax composites) for PCM systems

4. Key Technical Specifications

ParameterImportance
Thermal Conductivity (W/m K)Measures heat transfer efficiency; higher values indicate better performance
Operating Temperature Range ( C)Defines material stability limits under thermal stress
Thermal Resistance ( C/W)Quantifies resistance to heat flow between interfaces
Material CompatibilityEnsures chemical/electrical compatibility with LED components
Dimensional Tolerance ( m)Impacts mechanical fit and thermal contact quality

5. Application Fields

  • General Lighting: Commercial LED fixtures, tunnel lighting
  • Consumer Electronics: Smartphone camera flashes, TV backlight units
  • Automotive: Adaptive driving beam (ADB) systems, LiDAR sensors
  • Industrial: UV curing systems, machine vision equipment
  • Medical: Endoscopic illumination, phototherapy devices

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
Laird Thermal SystemsHiTemp TE Series (127-stage thermoelectric coolers)
Fischer ElektronikSKIN-Top series (extruded aluminum heat sinks)
Cool InnovationsCoolGaN (GaN-on-diamond thermal substrates)
BergquistPhaseTEC TPCM (0.25W/cm thermal storage materials)
Advanced Cooling TechnologiesACT800 heat pipes (1000W thermal capacity)

7. Selection Guidelines

Key considerations: - Match thermal conductivity ( 5W/m K for TIMs) with application power density - Ensure material compatibility with LED substrate (avoid galvanic corrosion) - Balance cost vs. performance for volume production - Consider environmental factors (humidity, vibration) - Case Study: Outdoor LED displays require IP68-rated heat sinks with 200W/m K conductivity

8. Industry Trends

Emerging developments include: - Graphene-integrated TIMs reaching 20W/m K conductivity - MEMS-based micro-TECs for wearable devices - AI-optimized heat sink topologies reducing weight by 30% - Bio-based phase change materials for eco-friendly solutions - Integrated sensor-thermal systems for real-time feedback control

RFQ BOM Call Skype Email
Top