LED Lighting

LED Lighting - White

Part Number	Description / PDF	Quantity
S1W0-2222507003-00000000-00001 Seoul Semiconductor	HIGH POWER WICOP Y22	2341
S1W0-2835508003-0000003S-0P006 Seoul Semiconductor	MID POWER 3528, STW8A2PD-E1(H)	15240
S1W0-2835358003-0000003S-0P002 Seoul Semiconductor	MID POWER 3528	79843
S1WM-3030308006-0000003S-00001 Seoul Semiconductor	MID POWER 3030	17850
SZ5-M1-WW-C8-V1/V2-FA Seoul Semiconductor	LED Z5-M1 WARM WHITE 3000K 2SMD	0
SZ5-P0-WW-C8-GA Seoul Semiconductor	LED ACRICH WARM WHITE 3000K 2SMD	0
S1S0-3030309506-0000003S-00001 Seoul Semiconductor	SUNLIKE 3030 STW9C2SB-S	3768
STW8Q2PA-H-XX-EA Seoul Semiconductor	LED ACRICH NEU WHITE 4000K 4SMD	0
S1S0-3030279506-0000003S-00001 Seoul Semiconductor	SUNLIKE 3030 STW9C2SB-S	5961
STW8Q14BE-T5V5-CB Seoul Semiconductor	LED ACRICH COOL WHITE 5000K 4SMD	1846
S1W0-5630408003-0000003S-00003 Seoul Semiconductor	MID POWER 5630, 4000K	38445
S1W0-3030357006-0000003S-0S003 Seoul Semiconductor	MID POWER 3030	89988
STW8Q14BE-T0U7-FB Seoul Semiconductor	LED ACRICH WARM WHITE 3500K 4SMD	415
S1W0-3030508003-0000003S-0P005 Seoul Semiconductor	MID POWER 3030	5620
S1W0-5630409003-0000003S-00004 Seoul Semiconductor	MID POWER 5630, 4000K	5423
S1W0-2222507003-00000000-P0001 Seoul Semiconductor	HIGH POWER WICOP Y22P	157
SAWFS72A-T2/U1-GA Seoul Semiconductor	LED ACRICH WARM WHITE 3050K 2SMD	0
S1W0-3030458006-0000003S-0S003 Seoul Semiconductor	MID POWER 3030	0
STW9Q14C-T0U0-FA Seoul Semiconductor	LED ACRICH WARM WHITE 3500K 2211	7
S1W0-2835358003-0000003S-0P003 Seoul Semiconductor	MID POWER 3528	46798

LED Lighting - White

1. Overview

White Light-Emitting Diodes (LEDs) are semiconductor devices that convert electrical energy into visible white light. They represent a fundamental shift from traditional lighting technologies due to their energy efficiency, longevity, and controllability. Modern white LEDs primarily use blue-emitting chips coated with phosphor materials to produce broad-spectrum white light, enabling precise color tuning and dimming capabilities.

2. Major Types & Functional Classification

Type	Functional Features	Application Examples
Blue Chip + Yellow Phosphor	Cost-effective, CRI 70-90, correlated color temperature (CCT) 2700-6500K	General lighting, residential bulbs
RGB Tri-color	Tunable color output, high CRI (>90), complex driver requirements	Stage lighting, architectural accenting
UV Chip + RGB Phosphor	Enhanced color rendering, reduced blue light hazard	Museum lighting, medical diagnostics
Remote Phosphor	Uniform light distribution, improved thermal management	Commercial downlights, automotive headlamps

3. Structure & Components

Typical white LED construction includes:

Die: Gallium Nitride (GaN) on sapphire substrate emitting blue light (450nm)
Phosphor Layer: Cerium-doped YAG (Y₃Al₅O₁₂) converting blue to yellow wavelengths
Encapsulation: Silicon dioxide lens with secondary optical elements
Thermal Interface: Metal-core PCB (MCPCB) for heat dissipation
Driver Circuit: Constant current source with EMI filtering

4. Key Technical Parameters

Parameter	Typical Range	Importance
Luminous Flux	100-20,000 lm	Determines light output capability
Color Temperature	2700K-6500K	Affects ambiance and visual comfort
Color Rendering Index (CRI)	70-98	Measures color fidelity accuracy
Luminous Efficacy	100-200 lm/W	Energy conversion efficiency metric
Lifespan	25,000-100,000 hrs	Total cost of ownership factor
Forward Voltage	2.8-3.6 V	Driver design specification

5. Application Fields

Residential: Smart bulbs, under-cabinet lighting
Commercial: Retail accent lighting, office panel lights
Industrial: High-bay warehouse fixtures, machine vision systems
Transportation: Automotive headlights, aircraft cabin lighting
Healthcare: Surgical lighting, circadian rhythm regulation

6. Leading Manufacturers & Products

Manufacturer	Key Product Series	Technical Highlights
Signify (Philips)	Luxeon 3535L	180 lm/W efficacy, 90 CRI, automotive grade
OSRAM Opto	Ostar Lighting	Surface-mount package, 2000cd/m luminance
Cree (Wolfspeed)	XHP50.2	High-density emitter, 20A drive current capability
Seoul Semiconductor	WICOP2	Chip-level integration, 0.2W-100W scalability

7. Selection Recommendations

Key considerations:

Optical requirements: Match CRI and CCT to application needs
Thermal management: Select appropriate heatsink and package type
Electrical compatibility: Verify driver specifications and dimming protocols
Form factor: Consider footprint constraints (e.g., 2835, 5630 packages)
Regulatory compliance: Ensure ENERGY STAR, DLC, or UL certification

8. Industry Trends

Emerging developments include:

Micro-LED integration for displays and Li-Fi communication
Quantum dot phosphors expanding color gamut (NTSC >100%)
Smart lighting systems with IoT connectivity (Zigbee, Bluetooth Mesh)
Advanced thermal materials (graphene MCPCBs)
Regulatory shifts toward higher minimum efficacy standards (DOE 2023: 120 lm/W)