LED Lighting - COBs, Engines, Modules, Strips

Image Part Number Description / PDF Quantity Rfq
LBF6214-10DLRA-68A

LBF6214-10DLRA-68A

ROHM Semiconductor

LED MOD 119.4LM/102.1LM 16.5X100

134

LBF6222-20DLRA-B

LBF6222-20DLRA-B

ROHM Semiconductor

LED MOD 118.5LM/101.4LM 16.5X128

20

LBF6224-20DLRA-8B

LBF6224-20DLRA-8B

ROHM Semiconductor

LED MOD 118.5LM/101.4LM 16.5X128

146

LBF7130-A0NRA

LBF7130-A0NRA

ROHM Semiconductor

LED MOD 2750LM 26.6X170MM

107

LBF6214-10DLRA-6B

LBF6214-10DLRA-6B

ROHM Semiconductor

LED MOD 119.4LM/102.1LM 16.5X100

124

LBF6222-20DLRA-A

LBF6222-20DLRA-A

ROHM Semiconductor

LED MOD 118.5LM/101.4LM 16.5X128

0

LBF6232-30DLRA-B

LBF6232-30DLRA-B

ROHM Semiconductor

LED MOD 176.8LM/151.2LM 16.5X128

0

LBF6224-20DLRA-68A

LBF6224-20DLRA-68A

ROHM Semiconductor

LED MOD 237LM/202.7LM 16.5X190MM

0

LBF4741-10LHAB

LBF4741-10LHAB

ROHM Semiconductor

LED CHIP ON BOARD LIGHT SOURCE

0

LBF1048-45NFBA

LBF1048-45NFBA

ROHM Semiconductor

LED CHIP ON BOARD LIGHT SOURCE

0

LBF4741-10LHAA

LBF4741-10LHAA

ROHM Semiconductor

LED CHIP ON BOARD LIGHT SOURCE

0

LBF4741-10NHAA

LBF4741-10NHAA

ROHM Semiconductor

LED CHIP ON BOARD LIGHT SOURCE

0

LBF1048-45NFBB

LBF1048-45NFBB

ROHM Semiconductor

LED CHIP ON BOARD LIGHT SOURCE

0

R-SL120N1D-W

R-SL120N1D-W

ROHM Semiconductor

LED SEAMLESS STRIP 48" W/DIMMER

0

LBF4741-10NHAB

LBF4741-10NHAB

ROHM Semiconductor

LED CHIP ON BOARD LIGHT SOURCE

0

LBT3212S-HAAH

LBT3212S-HAAH

ROHM Semiconductor

LED CHIP ON BOARD LIGHT SOURCE

0

LED Lighting - COBs, Engines, Modules, Strips

1. Overview

LED lighting technologies, including Chip-on-Board (COB), LED Engines, Modules, and Strips, represent advanced solid-state lighting solutions. These components integrate semiconductor diodes to convert electrical energy into light, offering superior energy efficiency, longevity, and design flexibility compared to traditional lighting. Their importance spans industries such as architecture, automotive, consumer electronics, and industrial automation, driven by demands for sustainable and smart lighting systems.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
COBsHigh-density LED arrays mounted directly on substrates, providing uniform light distribution and simplified thermal management.Commercial downlights, high-bay warehouse lighting, film/photography lighting.
EnginesPre-assembled units combining LEDs, drivers, and optics for plug-and-play integration.Smart home lighting systems, retrofit lamps, horticultural grow lights.
ModulesStandardized units with LED arrays and integrated circuits for modular system design.Office panel lighting, tunnel illumination, outdoor streetlights.
StripsFlexible PCB-based linear arrays for customizable length and color control.Architectural accent lighting, vehicle underglow, signage backlighting.

3. Structure and Components

Typical structures include:

  • COBs: Ceramic/aluminum substrate + multiple LED chips + phosphor coating + silicone encapsulation.
  • Engines: LED chip(s) + constant-current driver IC + primary optics + thermal interface material.
  • Modules: PCB board + SMD LEDs + secondary optics + connector terminals.
  • Strips: Flexible FPCB + RGB/W LED diodes + current-limiting resistors + adhesive backing.

All variants utilize semiconductor materials like GaN-on-SiC for blue/white emission or AlInGaP for red/yellow wavelengths.

4. Key Technical Specifications

ParameterDescriptionImportance
Luminous Flux (lm)Measure of total visible light output.Determines brightness suitability for space.
Color Rendering Index (CRI)Ability to accurately render object colors (0-100 scale).Critical for retail, healthcare, and photography.
Correlated Color Temperature (CCT)Light appearance from warm (2700K) to cool (6500K).Affects ambiance and circadian rhythm regulation.
Lifespan (L70)Operating hours until 70% lumen maintenance.Reduces long-term maintenance costs.
Thermal Resistance ( C/W)Efficiency of heat dissipation.Impacts reliability and maximum drive current.

5. Application Fields

  • Architecture: Office lighting (Modules), hotel accenting (Strips), museum displays (COBs)
  • Automotive: Headlights (COBs), interior mood lighting (Strips), dashboard indicators (Modules)
  • Consumer Electronics: Smart bulb replacements (Engines), gaming PC lighting (Strips)
  • Industrial: Machine vision systems (COBs), warehouse safety lighting (Modules)

6. Leading Manufacturers

ManufacturerRepresentative ProductKey Features
Cree (now Wolfspeed)XLamp COB Arrays3000K-5700K CCT range, 80 CRI, 1500mA max current
OsramOSTAR LED EnginesIntegrated driver, DALI compatibility, automotive-grade reliability
Philips LightingCorePro ModulesIEC 62031 compliant, 50,000-hour lifespan
Samsung LEDLPD8 StripsAddressable RGB control, IP65 rating, 24V operation

7. Selection Recommendations

Key considerations:

  • Match L70 lifespan to maintenance schedules (e.g., 50,000+ hours for hard-to-reach installations)
  • Select CRI 90 for critical color applications vs. CRI 80 for general lighting
  • Verify IP rating compatibility (IP20 for indoor vs. IP67 for outdoor Strips)
  • Evaluate thermal management needs - COBs require heatsinks, Strips need ventilation
  • Check dimming compatibility (PWM vs. constant current reduction)

Case Study: Retail store lighting selected 4000K COBs with 95 CRI for product displays, achieving 40% energy savings over halogen systems while improving color accuracy.

8. Industry Trends

Emerging developments include:

  • Micro-LED integration for sub-100 m pixel densities in displays
  • HDR lighting systems using tunable white Modules
  • LiFi-enabled Engines for data transmission through light
  • UV-C disinfection modules for healthcare applications
  • Recyclable phosphor materials to meet EU RoHS standards

Market growth is projected at 12.3% CAGR (2023-2030), driven by smart city initiatives and automotive LED adoption.

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