LED Indication - Discrete

Part Number	Description / PDF	Quantity
NTE30024 NTE Electronics, Inc.	LED-SMD 0805 SUPER WHITE	564
NTE30121 NTE Electronics, Inc.	LED-5MM PURPLE	144
NTE3138 NTE Electronics, Inc.	LED-MINIATURE SUPER RED	1454
NTE30004 NTE Electronics, Inc.	LED-SMD 0805 YELLOW	2474
NTE30139 NTE Electronics, Inc.	LED-5MM SUPER BRIGHTWHITE	4691
NTE30157 NTE Electronics, Inc.	LED 10MM RGB COMMON ANODE	1572
NTE30039 NTE Electronics, Inc.	LED-5MM YELLOW	5117
NTE3144 NTE Electronics, Inc.	LED-5MM HI EFF RED	4452
NTE30010 NTE Electronics, Inc.	LED-YELLOW SUBMINIATURE	508
NTE30068 NTE Electronics, Inc.	LED-10MM LT-RED	508
NTE3012A NTE Electronics, Inc.	LED-RED DIFFUSED	1640
NTE30147 NTE Electronics, Inc.	LED-3MM GREEN DIFFUSED	5645
NTE30180-WW NTE Electronics, Inc.	LED 3W WWHITE STAR PCB	3909
NTE3015A NTE Electronics, Inc.	LED-GREEN CLEAR JEWEL	434
NTE30154 NTE Electronics, Inc.	LED 5MM RGB COMMON ANODE	11275
NTE30069 NTE Electronics, Inc.	LED-10MM DEEP-RED	1420
NTE30074 NTE Electronics, Inc.	LED-SMD 1206 SUPER RED	2334
NTE3022 NTE Electronics, Inc.	LED-5MM RED DIFFUSED	5414
NTE30141 NTE Electronics, Inc.	LED-3MM GREEN CLEAR	9205
NTE3187 NTE Electronics, Inc.	LED-BLUE CLEAR T1 3/4	344

LED Indication - Discrete

1. Overview

Discrete Light Emitting Diodes (LEDs) are single-chip optoelectronic devices that convert electrical energy into light through electroluminescence. This product category forms the foundation of modern indication systems, offering advantages including low power consumption, long lifespan, and high reliability. Their importance spans across consumer electronics, industrial equipment, automotive systems, and communication infrastructure.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
Visible LEDs	Emits light in visible spectrum (400-700nm), available in multiple colors	Indicator lamps, display backlighting, decorative lighting
Infrared LEDs	Emits 700nm-1mm wavelength radiation, invisible to human eye	Remote controls, security sensors, night vision systems
High-Brightness LEDs	Enhanced luminous intensity (>1000mcd) with advanced packaging	Automotive lighting, outdoor displays, emergency signage
UV LEDs	Ultraviolet spectrum emission (280-400nm)	Sterilization equipment, counterfeit detection, curing systems

3. Structure and Composition

Typical discrete LED construction includes:

Die: Semiconductor chip (GaN/InGaN for blue/green, AlGaInP for red)
Encapsulation: Epoxy or silicone lens for light extraction and protection
Lead Frame: Copper or iron alloy for electrical connection and heat dissipation
Phosphor Coating: Used in white LEDs for wavelength conversion
Reflective Cup: Optimizes light directionality

4. Key Technical Parameters

Parameter	Significance	Typical Range
Wavelength	Determines light color and application suitability	375nm-940nm
Luminous Intensity	Measures brightness output (mcd)	50-10,000mcd
Forward Current	Operating current rating	20-150mA
Forward Voltage	Electrical potential drop	1.8-3.6V
Viewing Angle	Light emission spread measurement	5 -120

5. Application Fields

Primary application sectors include:

Consumer Electronics: Mobile phone indicators, keyboard backlighting
Automotive: Dashboard indicators, brake light systems
Industrial: Machine status indicators, safety signage
Medical: Diagnostic equipment indicators, phototherapy devices
Telecommunications: Network equipment status lights

6. Leading Manufacturers and Products

Manufacturer	Product Series	Key Features
Cree Inc.	XLamp XP-G3	High brightness (3200mcd), 120 viewing angle
OSRAM Opto	OSTAR Projection	High-power LED for automotive lighting
Nichia Corp.	NSHU5991	UV LED (365nm) for curing applications
Everlight Electronics	LTST-C19HE8WT	Tri-color LED for RGB indication

7. Selection Recommendations

Key consideration factors:

Spectral Requirements: Match wavelength to application needs
Environmental Conditions: Temperature range (-40 C to +85 C typical)
Power Constraints: Select appropriate current/voltage ratings
Optical Design: Consider lens type and viewing angle
Reliability: Check MTTF (Mean Time to Failure) specifications

Industry Development Trends

Current technology directions include:

Miniaturization: Development of micro-LED ( LED) with dimensions <50 m
Efficiency Improvement: Targeting >300lm/W efficacy for visible LEDs
Smart Integration: Incorporating driver ICs and sensors in LED packages
Material Innovation: GaN-on-silicon substrates for cost reduction
Regulatory Compliance: RoHS/REACH compliant packaging materials