LED Indication - Discrete

Part Number	Description / PDF	Quantity
SML-010YTT87 ROHM Semiconductor	LED YELLOW CLEAR 3020 SMD	0
SMLA12BC7TT86 ROHM Semiconductor	LED BLUE CLEAR 1611 SMD R/A	2483
SML-012PTT86A ROHM Semiconductor	LED GREEN CLEAR 3020 SMD	1830
SML-Z14YTT86C ROHM Semiconductor	LED YELLOW CLEAR 3528 SMD	1422
SML-P12DTT86R ROHM Semiconductor	LED ORANGE CLEAR 1006 SMD	15636
SLR-343DUT32 ROHM Semiconductor	LED ORANGE DIFFUSED T-1 T/H	0
SLI-343YC3F ROHM Semiconductor	LED YELLOW CLEAR T-1 T/H	1427
SMLP13WBC8W1 ROHM Semiconductor	LED WHITE 1006 SMD	130541
SML-D15VWT86C ROHM Semiconductor	LED RED 1608 SMD	319
SLI-570YT3F ROHM Semiconductor	LED YELLOW CLEAR T-1 3/4 T/H	340
SML-D12U8WT86C ROHM Semiconductor	LED RED 1608 SMD	1314
SLA-560MT3F ROHM Semiconductor	LED GREEN CLEAR T-1 3/4 T/H	1
SLR-343VC3F ROHM Semiconductor	LED RED CLEAR T/H	815
SML-010MTT87 ROHM Semiconductor	LED GREEN CLEAR 3020 SMD	2500
SML-811DTT86C ROHM Semiconductor	LED ORANGE CLEAR 3412 SMD	1908
SML-D14MWT86C ROHM Semiconductor	LED YELLOW/GREEN 1608 SMD	184
SLR343BC4TT32 ROHM Semiconductor	LED BLUE CLEAR T-1 T/H	0
SML-D13WWT86C ROHM Semiconductor	MINI-MOLD CHIP LED	49
SML-Z14UTT86C ROHM Semiconductor	LED RED CLEAR 3528 SMD	1920
SML-310FTT86 ROHM Semiconductor	LED GREEN CLEAR 0603 SMD	0

LED Indication - Discrete

1. Overview

Discrete Light Emitting Diodes (LEDs) are single-chip optoelectronic devices that convert electrical energy into light through electroluminescence. This product category forms the foundation of modern indication systems, offering advantages including low power consumption, long lifespan, and high reliability. Their importance spans across consumer electronics, industrial equipment, automotive systems, and communication infrastructure.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
Visible LEDs	Emits light in visible spectrum (400-700nm), available in multiple colors	Indicator lamps, display backlighting, decorative lighting
Infrared LEDs	Emits 700nm-1mm wavelength radiation, invisible to human eye	Remote controls, security sensors, night vision systems
High-Brightness LEDs	Enhanced luminous intensity (>1000mcd) with advanced packaging	Automotive lighting, outdoor displays, emergency signage
UV LEDs	Ultraviolet spectrum emission (280-400nm)	Sterilization equipment, counterfeit detection, curing systems

3. Structure and Composition

Typical discrete LED construction includes:

Die: Semiconductor chip (GaN/InGaN for blue/green, AlGaInP for red)
Encapsulation: Epoxy or silicone lens for light extraction and protection
Lead Frame: Copper or iron alloy for electrical connection and heat dissipation
Phosphor Coating: Used in white LEDs for wavelength conversion
Reflective Cup: Optimizes light directionality

4. Key Technical Parameters

Parameter	Significance	Typical Range
Wavelength	Determines light color and application suitability	375nm-940nm
Luminous Intensity	Measures brightness output (mcd)	50-10,000mcd
Forward Current	Operating current rating	20-150mA
Forward Voltage	Electrical potential drop	1.8-3.6V
Viewing Angle	Light emission spread measurement	5 -120

5. Application Fields

Primary application sectors include:

Consumer Electronics: Mobile phone indicators, keyboard backlighting
Automotive: Dashboard indicators, brake light systems
Industrial: Machine status indicators, safety signage
Medical: Diagnostic equipment indicators, phototherapy devices
Telecommunications: Network equipment status lights

6. Leading Manufacturers and Products

Manufacturer	Product Series	Key Features
Cree Inc.	XLamp XP-G3	High brightness (3200mcd), 120 viewing angle
OSRAM Opto	OSTAR Projection	High-power LED for automotive lighting
Nichia Corp.	NSHU5991	UV LED (365nm) for curing applications
Everlight Electronics	LTST-C19HE8WT	Tri-color LED for RGB indication

7. Selection Recommendations

Key consideration factors:

Spectral Requirements: Match wavelength to application needs
Environmental Conditions: Temperature range (-40 C to +85 C typical)
Power Constraints: Select appropriate current/voltage ratings
Optical Design: Consider lens type and viewing angle
Reliability: Check MTTF (Mean Time to Failure) specifications

Industry Development Trends

Current technology directions include:

Miniaturization: Development of micro-LED ( LED) with dimensions <50 m
Efficiency Improvement: Targeting >300lm/W efficacy for visible LEDs
Smart Integration: Incorporating driver ICs and sensors in LED packages
Material Innovation: GaN-on-silicon substrates for cost reduction
Regulatory Compliance: RoHS/REACH compliant packaging materials