LED Indication - Discrete

Part Number	Description / PDF	Quantity
HSMF-A226-A00J1 Broadcom	PLCC4,TOP MT,AMBER/GREEN	8000
HLMA-QL00-S0031 Broadcom	LED AMBER CLEAR SMD	18000
HLMP-CE17-35CDD Broadcom	LED 5MM CYAN ROUND T/H	0
HLMP-P205-F0031 Broadcom	LED RED CLEAR Z-BEND SMD	0
HSMF-C188 Broadcom	CHIP,BICLR,AMB/GRN	7986
HLMP-P305-F0011 Broadcom	LED YELLOW CLEAR GULL WING SMD	0
HSMR-C280 Broadcom	LED BLUE DIFFUSED 0402 SMD	7045
HLMP-EH30-NR0DD Broadcom	LED RED CLEAR T-1 3/4 T/H	0
HLMP-EL30-SUKDD Broadcom	LED AMBER CLEAR T-1 3/4 T/H	0
HSMF-C112 Broadcom	LED RGB CHIP TOP MNT SMD	0
HSMF-C172 Broadcom	CHIPBICLRORG/YEL-GRN	10965
HLMP-P305-F0021 Broadcom	LED YELLOW CLEAR YOKE LEAD SMD	0
HLMP-6505-NP011 Broadcom	POLY,DOME,GAP,YEL GRN,GW,T/R	21000
HLMP-EG3B-WX0DV Broadcom	LED RED CLEAR T-1 3/4 T/H	0
HSMR-C380 Broadcom	CHIP,TOP MT,INGAN,BLUE	12000
AEMD-LM3L-35002 Broadcom	LC SMT OVAL GREEN 100X 45DEG	12000
HLMP-3554-E00R1 Broadcom	LED GREEN DIFFUSED T-1 3/4 T/H	0
ALMD-EL3D-WY002 Broadcom	LED AMBER ROUND CLEAR SMD	0
ASMB-LTB3-0C3F3 Broadcom	2121 PLCC4 TRICOLOR	28000
HSMQ-C350 Broadcom	LED GREEN CHIP SMD	9000

LED Indication - Discrete

1. Overview

Discrete Light Emitting Diodes (LEDs) are single-chip optoelectronic devices that convert electrical energy into light through electroluminescence. This product category forms the foundation of modern indication systems, offering advantages including low power consumption, long lifespan, and high reliability. Their importance spans across consumer electronics, industrial equipment, automotive systems, and communication infrastructure.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
Visible LEDs	Emits light in visible spectrum (400-700nm), available in multiple colors	Indicator lamps, display backlighting, decorative lighting
Infrared LEDs	Emits 700nm-1mm wavelength radiation, invisible to human eye	Remote controls, security sensors, night vision systems
High-Brightness LEDs	Enhanced luminous intensity (>1000mcd) with advanced packaging	Automotive lighting, outdoor displays, emergency signage
UV LEDs	Ultraviolet spectrum emission (280-400nm)	Sterilization equipment, counterfeit detection, curing systems

3. Structure and Composition

Typical discrete LED construction includes:

Die: Semiconductor chip (GaN/InGaN for blue/green, AlGaInP for red)
Encapsulation: Epoxy or silicone lens for light extraction and protection
Lead Frame: Copper or iron alloy for electrical connection and heat dissipation
Phosphor Coating: Used in white LEDs for wavelength conversion
Reflective Cup: Optimizes light directionality

4. Key Technical Parameters

Parameter	Significance	Typical Range
Wavelength	Determines light color and application suitability	375nm-940nm
Luminous Intensity	Measures brightness output (mcd)	50-10,000mcd
Forward Current	Operating current rating	20-150mA
Forward Voltage	Electrical potential drop	1.8-3.6V
Viewing Angle	Light emission spread measurement	5 -120

5. Application Fields

Primary application sectors include:

Consumer Electronics: Mobile phone indicators, keyboard backlighting
Automotive: Dashboard indicators, brake light systems
Industrial: Machine status indicators, safety signage
Medical: Diagnostic equipment indicators, phototherapy devices
Telecommunications: Network equipment status lights

6. Leading Manufacturers and Products

Manufacturer	Product Series	Key Features
Cree Inc.	XLamp XP-G3	High brightness (3200mcd), 120 viewing angle
OSRAM Opto	OSTAR Projection	High-power LED for automotive lighting
Nichia Corp.	NSHU5991	UV LED (365nm) for curing applications
Everlight Electronics	LTST-C19HE8WT	Tri-color LED for RGB indication

7. Selection Recommendations

Key consideration factors:

Spectral Requirements: Match wavelength to application needs
Environmental Conditions: Temperature range (-40 C to +85 C typical)
Power Constraints: Select appropriate current/voltage ratings
Optical Design: Consider lens type and viewing angle
Reliability: Check MTTF (Mean Time to Failure) specifications

Industry Development Trends

Current technology directions include:

Miniaturization: Development of micro-LED ( LED) with dimensions <50 m
Efficiency Improvement: Targeting >300lm/W efficacy for visible LEDs
Smart Integration: Incorporating driver ICs and sensors in LED packages
Material Innovation: GaN-on-silicon substrates for cost reduction
Regulatory Compliance: RoHS/REACH compliant packaging materials