LED Indication - Discrete

Part Number	Description / PDF	Quantity
HSMF-C255 Broadcom	CHIP,TRICLR,REV MT,RGB	5880
HLMP-EL08-XYK00 Broadcom	LED AMBER CLEAR T-1 3/4 T/H	0
HLMP-WL02 Broadcom	LED AMBER DIFFUSED T-1 3/4 T/H	20756
HSME-C230 Broadcom	LED YELLOW/GREEN CHIP SMD	0
HLMP-EL10-VY000 Broadcom	LED AMBER CLEAR T-1 3/4 T/H	0
HLMP-EH10-X10DD Broadcom	LED RED CLEAR T-1 3/4 T/H	0
HLMP-EG2U-Z10DD Broadcom	LED RED T-1 3/4 T/H	0
HLMP-HL70-XZ0DD Broadcom	LED AMBER DIFFUSED 5MM OVAL T/H	0
HLMP-R100 Broadcom	LED RED DIFFUSED RECT T/H	0
HLMT-QL00-T0021 Broadcom	LED AMBER CLEAR DOME LENS SMD	0
ASMT-UAB4-PU802 Broadcom	LED AMBER CLEAR 2PLCC SMD	0
HLMP-EL1T-Z2LDD Broadcom	LED AMBER T-1 3/4 T/H	0
AEMD-CY3N-XY002 Broadcom	LOW COST SMT ROUND DIFFUSED,WHIT	8433
HLMP-EG08-YZ000 Broadcom	LED RED CLEAR T-1 3/4 T/H	15388
ASMT-UAB4-YU802 Broadcom	LED PLCC2 T/MT SIL 120VA AMB	0
HLMP-6305-L0011 Broadcom	LED RED CLEAR GULL WING SMD	0
HLMP-Q100-N001S Broadcom	LED RED DIFFUSED AXIAL T/H	0
HLMP-6500-F0031 Broadcom	LED GREEN DIFFUSED Z-BEND SMD	13563
HLMP-C523-J0002 Broadcom	LED GREEN CLEAR T-1 3/4 T/H	28125
HLMP-EL2U-Z1KDD Broadcom	LED AMBER T-1 3/4 T/H	0

LED Indication - Discrete

1. Overview

Discrete Light Emitting Diodes (LEDs) are single-chip optoelectronic devices that convert electrical energy into light through electroluminescence. This product category forms the foundation of modern indication systems, offering advantages including low power consumption, long lifespan, and high reliability. Their importance spans across consumer electronics, industrial equipment, automotive systems, and communication infrastructure.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
Visible LEDs	Emits light in visible spectrum (400-700nm), available in multiple colors	Indicator lamps, display backlighting, decorative lighting
Infrared LEDs	Emits 700nm-1mm wavelength radiation, invisible to human eye	Remote controls, security sensors, night vision systems
High-Brightness LEDs	Enhanced luminous intensity (>1000mcd) with advanced packaging	Automotive lighting, outdoor displays, emergency signage
UV LEDs	Ultraviolet spectrum emission (280-400nm)	Sterilization equipment, counterfeit detection, curing systems

3. Structure and Composition

Typical discrete LED construction includes:

Die: Semiconductor chip (GaN/InGaN for blue/green, AlGaInP for red)
Encapsulation: Epoxy or silicone lens for light extraction and protection
Lead Frame: Copper or iron alloy for electrical connection and heat dissipation
Phosphor Coating: Used in white LEDs for wavelength conversion
Reflective Cup: Optimizes light directionality

4. Key Technical Parameters

Parameter	Significance	Typical Range
Wavelength	Determines light color and application suitability	375nm-940nm
Luminous Intensity	Measures brightness output (mcd)	50-10,000mcd
Forward Current	Operating current rating	20-150mA
Forward Voltage	Electrical potential drop	1.8-3.6V
Viewing Angle	Light emission spread measurement	5 -120

5. Application Fields

Primary application sectors include:

Consumer Electronics: Mobile phone indicators, keyboard backlighting
Automotive: Dashboard indicators, brake light systems
Industrial: Machine status indicators, safety signage
Medical: Diagnostic equipment indicators, phototherapy devices
Telecommunications: Network equipment status lights

6. Leading Manufacturers and Products

Manufacturer	Product Series	Key Features
Cree Inc.	XLamp XP-G3	High brightness (3200mcd), 120 viewing angle
OSRAM Opto	OSTAR Projection	High-power LED for automotive lighting
Nichia Corp.	NSHU5991	UV LED (365nm) for curing applications
Everlight Electronics	LTST-C19HE8WT	Tri-color LED for RGB indication

7. Selection Recommendations

Key consideration factors:

Spectral Requirements: Match wavelength to application needs
Environmental Conditions: Temperature range (-40 C to +85 C typical)
Power Constraints: Select appropriate current/voltage ratings
Optical Design: Consider lens type and viewing angle
Reliability: Check MTTF (Mean Time to Failure) specifications

Industry Development Trends

Current technology directions include:

Miniaturization: Development of micro-LED ( LED) with dimensions <50 m
Efficiency Improvement: Targeting >300lm/W efficacy for visible LEDs
Smart Integration: Incorporating driver ICs and sensors in LED packages
Material Innovation: GaN-on-silicon substrates for cost reduction
Regulatory Compliance: RoHS/REACH compliant packaging materials