LED Indication - Discrete

Part Number	Description / PDF	Quantity
HSMY-A100-J00J1 Broadcom	LED AMBER-YELLOW CLEAR 2PLCC SMD	37584
ASMT-CB00 Broadcom	LED BLUE CLEAR CHIP SMD R/A	18
HSME-A100-M02J1 Broadcom	LED GREEN CLEAR 2PLCC SMD	30459
HSMZ-C110 Broadcom	LED RED CLEAR CHIP SMD R/A	17813
ASMM-CJ03-GL002 Broadcom	LED ORNG GAP SURFACE MOUNT PLCC2	61990
ASMD-CWG7-NX7B2 Broadcom	3014 DFN 0.1W WHITE WSURFACE NIM	110554
HLMP-6400-F0021 Broadcom	LED YELLOW DIFF YOKE LEAD SMD	1
HSMR-C191 Broadcom	LED BLUE DIFFUSED CHIP SMD	19424
HSMH-C110 Broadcom	LED RED DIFFUSED CHIP SMD R/A	49001
ASMT-RH45-AQ502 Broadcom	LED RED DIFFUSED 0603 SMD	38584
HLMP-7019 Broadcom	LED YELLOW DIFF AXIAL T/H AXIAL	0
HLMP-Q100-N0011 Broadcom	LED RED DIFFUSED GULL WING SMD	0
HSMF-C166 Broadcom	LED GRN/YELLOW DIFFUSED 0603 SMD	2157
HSMR-C265 Broadcom	LED BLUE CLEAR CHIP SMD	1
HSMF-C142 Broadcom	LED GREEN/RED SMD/RIGHT ANGLE	3794
ASMT-SBB5-NT703 Broadcom	LED BLUE CLEAR 4PLCC SMD	27180
HLMP-S501-C0000 Broadcom	LED GREEN DIFF RECT 2MMX5MM T/H	14145
HSMA-C191 Broadcom	LED AMBER DIFFUSED CHIP SMD	30143
HSMF-C116 Broadcom	LED RGB TOP MT SMD	1941
ASMD-CWG7-NX7J2 Broadcom	3014 DFN 0.1W WHITE WSURFACE NIM	114070

LED Indication - Discrete

1. Overview

Discrete Light Emitting Diodes (LEDs) are single-chip optoelectronic devices that convert electrical energy into light through electroluminescence. This product category forms the foundation of modern indication systems, offering advantages including low power consumption, long lifespan, and high reliability. Their importance spans across consumer electronics, industrial equipment, automotive systems, and communication infrastructure.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
Visible LEDs	Emits light in visible spectrum (400-700nm), available in multiple colors	Indicator lamps, display backlighting, decorative lighting
Infrared LEDs	Emits 700nm-1mm wavelength radiation, invisible to human eye	Remote controls, security sensors, night vision systems
High-Brightness LEDs	Enhanced luminous intensity (>1000mcd) with advanced packaging	Automotive lighting, outdoor displays, emergency signage
UV LEDs	Ultraviolet spectrum emission (280-400nm)	Sterilization equipment, counterfeit detection, curing systems

3. Structure and Composition

Typical discrete LED construction includes:

Die: Semiconductor chip (GaN/InGaN for blue/green, AlGaInP for red)
Encapsulation: Epoxy or silicone lens for light extraction and protection
Lead Frame: Copper or iron alloy for electrical connection and heat dissipation
Phosphor Coating: Used in white LEDs for wavelength conversion
Reflective Cup: Optimizes light directionality

4. Key Technical Parameters

Parameter	Significance	Typical Range
Wavelength	Determines light color and application suitability	375nm-940nm
Luminous Intensity	Measures brightness output (mcd)	50-10,000mcd
Forward Current	Operating current rating	20-150mA
Forward Voltage	Electrical potential drop	1.8-3.6V
Viewing Angle	Light emission spread measurement	5 -120

5. Application Fields

Primary application sectors include:

Consumer Electronics: Mobile phone indicators, keyboard backlighting
Automotive: Dashboard indicators, brake light systems
Industrial: Machine status indicators, safety signage
Medical: Diagnostic equipment indicators, phototherapy devices
Telecommunications: Network equipment status lights

6. Leading Manufacturers and Products

Manufacturer	Product Series	Key Features
Cree Inc.	XLamp XP-G3	High brightness (3200mcd), 120 viewing angle
OSRAM Opto	OSTAR Projection	High-power LED for automotive lighting
Nichia Corp.	NSHU5991	UV LED (365nm) for curing applications
Everlight Electronics	LTST-C19HE8WT	Tri-color LED for RGB indication

7. Selection Recommendations

Key consideration factors:

Spectral Requirements: Match wavelength to application needs
Environmental Conditions: Temperature range (-40 C to +85 C typical)
Power Constraints: Select appropriate current/voltage ratings
Optical Design: Consider lens type and viewing angle
Reliability: Check MTTF (Mean Time to Failure) specifications

Industry Development Trends

Current technology directions include:

Miniaturization: Development of micro-LED ( LED) with dimensions <50 m
Efficiency Improvement: Targeting >300lm/W efficacy for visible LEDs
Smart Integration: Incorporating driver ICs and sensors in LED packages
Material Innovation: GaN-on-silicon substrates for cost reduction
Regulatory Compliance: RoHS/REACH compliant packaging materials