LED Indication - Discrete

Part Number	Description / PDF	Quantity
XZMDK54W-1 SunLED	LED RED CLEAR CHIP SMD	23581
XLM2ACY169W SunLED	LED YELLOW CLEAR 5MM ROUND T/H	48
XZM2DG79W SunLED	LED GREEN CLEAR 2SMD	0
XZMDKVG62W-1 SunLED	LED GREEN/RED CLEAR 4SMD	0
XZMER155W SunLED	LED RED CLEAR 2SMD	5354
XZMDK55W-3 SunLED	LED RED CLEAR CHIP SMD	150
XZM2DG53W-1 SunLED	LED GREEN CLEAR CHIP SMD	25338
XLUGY58M SunLED	LED GRN/YELLOW DIFF T-1 3/4 T/H	0
XCVG11D SunLED	3MM LC GREEN LED	0
XZM2CYK79W SunLED	LED YELLOW CLEAR 2SMD	0
XZMOK54W-4 SunLED	2.0X1.2MM ORANGE SMD 0805 LED	0
XZM2DG50W-2 SunLED	LED GREEN CLEAR 2SMD R/A	0
XZCB14X160S SunLED	LED BLUE CLEAR 2SMD	582
XZMYK55W-1 SunLED	LED YELLOW CLEAR CHIP SMD	682
XZMDKCBD56W SunLED	LED BLUE/RED CLEAR CHIP SMD R/A	39455
XZM2CYK67WT SunLED	LED YELLOW CLEAR 2SMD R/A	0
XLUGR34M SunLED	LED GREEN/RED DIFFUSED T-1 T/H	169223
XZMDKVG45WT SunLED	LED GREEN/RED CLEAR 4PLCC SMD	14
XZM2DG53W-6 SunLED	LED GREEN CLEAR 0603 SMD	3336
XZFBB55W-A2 SunLED	LED BLUE CLEAR 2SMD	0

LED Indication - Discrete

1. Overview

Discrete Light Emitting Diodes (LEDs) are single-chip optoelectronic devices that convert electrical energy into light through electroluminescence. This product category forms the foundation of modern indication systems, offering advantages including low power consumption, long lifespan, and high reliability. Their importance spans across consumer electronics, industrial equipment, automotive systems, and communication infrastructure.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
Visible LEDs	Emits light in visible spectrum (400-700nm), available in multiple colors	Indicator lamps, display backlighting, decorative lighting
Infrared LEDs	Emits 700nm-1mm wavelength radiation, invisible to human eye	Remote controls, security sensors, night vision systems
High-Brightness LEDs	Enhanced luminous intensity (>1000mcd) with advanced packaging	Automotive lighting, outdoor displays, emergency signage
UV LEDs	Ultraviolet spectrum emission (280-400nm)	Sterilization equipment, counterfeit detection, curing systems

3. Structure and Composition

Typical discrete LED construction includes:

Die: Semiconductor chip (GaN/InGaN for blue/green, AlGaInP for red)
Encapsulation: Epoxy or silicone lens for light extraction and protection
Lead Frame: Copper or iron alloy for electrical connection and heat dissipation
Phosphor Coating: Used in white LEDs for wavelength conversion
Reflective Cup: Optimizes light directionality

4. Key Technical Parameters

Parameter	Significance	Typical Range
Wavelength	Determines light color and application suitability	375nm-940nm
Luminous Intensity	Measures brightness output (mcd)	50-10,000mcd
Forward Current	Operating current rating	20-150mA
Forward Voltage	Electrical potential drop	1.8-3.6V
Viewing Angle	Light emission spread measurement	5 -120

5. Application Fields

Primary application sectors include:

Consumer Electronics: Mobile phone indicators, keyboard backlighting
Automotive: Dashboard indicators, brake light systems
Industrial: Machine status indicators, safety signage
Medical: Diagnostic equipment indicators, phototherapy devices
Telecommunications: Network equipment status lights

6. Leading Manufacturers and Products

Manufacturer	Product Series	Key Features
Cree Inc.	XLamp XP-G3	High brightness (3200mcd), 120 viewing angle
OSRAM Opto	OSTAR Projection	High-power LED for automotive lighting
Nichia Corp.	NSHU5991	UV LED (365nm) for curing applications
Everlight Electronics	LTST-C19HE8WT	Tri-color LED for RGB indication

7. Selection Recommendations

Key consideration factors:

Spectral Requirements: Match wavelength to application needs
Environmental Conditions: Temperature range (-40 C to +85 C typical)
Power Constraints: Select appropriate current/voltage ratings
Optical Design: Consider lens type and viewing angle
Reliability: Check MTTF (Mean Time to Failure) specifications

Industry Development Trends

Current technology directions include:

Miniaturization: Development of micro-LED ( LED) with dimensions <50 m
Efficiency Improvement: Targeting >300lm/W efficacy for visible LEDs
Smart Integration: Incorporating driver ICs and sensors in LED packages
Material Innovation: GaN-on-silicon substrates for cost reduction
Regulatory Compliance: RoHS/REACH compliant packaging materials