LED Indication - Discrete

Image Part Number Description / PDF Quantity Rfq
XLCBD111DTD

XLCBD111DTD

SunLED

LED 3MM BLUE TRIPLE DIFFUSED

0

XZCWD55F-A2RT

XZCWD55F-A2RT

SunLED

LED 3.2X1.6MM WHT WHT FLUOR 1206

0

XZUR55W

XZUR55W

SunLED

LED SMD RED 3.2X1.6MM

0

XLUR56D

XLUR56D

SunLED

LED RED DIFF 5MM ROUND T/H

0

XZM2CYK45W50MAV-6

XZM2CYK45W50MAV-6

SunLED

LED YELLOW CLEAR 4SMD

0

XLUY56D

XLUY56D

SunLED

LED YEL DIFF 5MM ROUND T/H

0

XZCBFDGZE88W

XZCBFDGZE88W

SunLED

LED FULL COLOR R/A 3.2X1MM

0

XZM2ACR60W

XZM2ACR60W

SunLED

3.0X1.5MM RED SMD LED

0

XLMO12D

XLMO12D

SunLED

LAMP T1-3/4 2V RADIAL

0

XZME53W-1

XZME53W-1

SunLED

LED MEGA-RED 0603 SMD

0

XZMGT53W-3

XZMGT53W-3

SunLED

LED 1.6X0.8MM GRN WTR CLEAR 0603

0

XLUG56D

XLUG56D

SunLED

LED GRN DIFF 5MM ROUND T/H

0

XZFBBM2ACRDG45SC8-A

XZFBBM2ACRDG45SC8-A

SunLED

LED RGB WATER CLEAR SMD

0

XZSG53W-1

XZSG53W-1

SunLED

LED 1.6X0.8MM GRN WTR CLEAR 0603

0

LED Indication - Discrete

1. Overview

Discrete Light Emitting Diodes (LEDs) are single-chip optoelectronic devices that convert electrical energy into light through electroluminescence. This product category forms the foundation of modern indication systems, offering advantages including low power consumption, long lifespan, and high reliability. Their importance spans across consumer electronics, industrial equipment, automotive systems, and communication infrastructure.

2. Major Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Visible LEDsEmits light in visible spectrum (400-700nm), available in multiple colorsIndicator lamps, display backlighting, decorative lighting
Infrared LEDsEmits 700nm-1mm wavelength radiation, invisible to human eyeRemote controls, security sensors, night vision systems
High-Brightness LEDsEnhanced luminous intensity (>1000mcd) with advanced packagingAutomotive lighting, outdoor displays, emergency signage
UV LEDsUltraviolet spectrum emission (280-400nm)Sterilization equipment, counterfeit detection, curing systems

3. Structure and Composition

Typical discrete LED construction includes:

  • Die: Semiconductor chip (GaN/InGaN for blue/green, AlGaInP for red)
  • Encapsulation: Epoxy or silicone lens for light extraction and protection
  • Lead Frame: Copper or iron alloy for electrical connection and heat dissipation
  • Phosphor Coating: Used in white LEDs for wavelength conversion
  • Reflective Cup: Optimizes light directionality

4. Key Technical Parameters

ParameterSignificanceTypical Range
WavelengthDetermines light color and application suitability375nm-940nm
Luminous IntensityMeasures brightness output (mcd)50-10,000mcd
Forward CurrentOperating current rating20-150mA
Forward VoltageElectrical potential drop1.8-3.6V
Viewing AngleLight emission spread measurement5 -120

5. Application Fields

Primary application sectors include:

  • Consumer Electronics: Mobile phone indicators, keyboard backlighting
  • Automotive: Dashboard indicators, brake light systems
  • Industrial: Machine status indicators, safety signage
  • Medical: Diagnostic equipment indicators, phototherapy devices
  • Telecommunications: Network equipment status lights

6. Leading Manufacturers and Products

ManufacturerProduct SeriesKey Features
Cree Inc.XLamp XP-G3High brightness (3200mcd), 120 viewing angle
OSRAM OptoOSTAR ProjectionHigh-power LED for automotive lighting
Nichia Corp.NSHU5991UV LED (365nm) for curing applications
Everlight ElectronicsLTST-C19HE8WTTri-color LED for RGB indication

7. Selection Recommendations

Key consideration factors:

  • Spectral Requirements: Match wavelength to application needs
  • Environmental Conditions: Temperature range (-40 C to +85 C typical)
  • Power Constraints: Select appropriate current/voltage ratings
  • Optical Design: Consider lens type and viewing angle
  • Reliability: Check MTTF (Mean Time to Failure) specifications

Industry Development Trends

Current technology directions include:

  • Miniaturization: Development of micro-LED ( LED) with dimensions <50 m
  • Efficiency Improvement: Targeting >300lm/W efficacy for visible LEDs
  • Smart Integration: Incorporating driver ICs and sensors in LED packages
  • Material Innovation: GaN-on-silicon substrates for cost reduction
  • Regulatory Compliance: RoHS/REACH compliant packaging materials
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