LED Indication - Discrete

Part Number	Description / PDF	Quantity
XLM2ACR11W SunLED	LED RED CLEAR T-1 T/H	46879
XLUG12D SunLED	LED GREEN DIFFUSED T-1 3/4 T/H	1538
XZM2DG55W-3 SunLED	LED GREEN CLEAR CHIP SMD	20675
XLMYK01D SunLED	10MM YELLOW LED	0
XZVG53W-8ST SunLED	LED GREEN CLEAR CHIP SMD	1252
XZMDKVG55W-8RT SunLED	LED GREEN/RED CLEAR CHIP SMD	9246
XLMDKVG37M SunLED	3MM BI-POLAR RED/GRN LED	947
XZMYKMDK53W-9 SunLED	1.6X0.8MM BI-COLOR YEL/RED SMD 0	70
XZDGK105S SunLED	LED GREEN CLEAR 2SMD	0
XLM2MOK11W SunLED	LED ORANGE CLEAR T-1 T/H	402
XZM2CRK55W-1 SunLED	LED RED CLEAR 2SMD	2084
XZM2CYK45WT SunLED	LED YELLOW CLEAR 2PLCC SMD	1670
XZM2CRK78W SunLED	LED RED CLEAR 2SMD	40423
XLM2DG169W SunLED	LED GREEN CLEAR 5MM ROUND T/H	66
XZMYK74W SunLED	LED YELLOW CLEAR SMD R/A	930
XLVG65D SunLED	3MM GREEN LED	1000
XLUG61D SunLED	LED GREEN DIFFUSED 1.8MM T/H	0
XLM2CRK14W SunLED	LED RED CLEAR T-1 3/4 T/H	7
XZMOK74W SunLED	LED ORANGE CLEAR 2SMD R/A	0
XZMDKDGK55W-4 SunLED	LED GREEN/RED CLEAR 2SMD	8124

LED Indication - Discrete

1. Overview

Discrete Light Emitting Diodes (LEDs) are single-chip optoelectronic devices that convert electrical energy into light through electroluminescence. This product category forms the foundation of modern indication systems, offering advantages including low power consumption, long lifespan, and high reliability. Their importance spans across consumer electronics, industrial equipment, automotive systems, and communication infrastructure.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
Visible LEDs	Emits light in visible spectrum (400-700nm), available in multiple colors	Indicator lamps, display backlighting, decorative lighting
Infrared LEDs	Emits 700nm-1mm wavelength radiation, invisible to human eye	Remote controls, security sensors, night vision systems
High-Brightness LEDs	Enhanced luminous intensity (>1000mcd) with advanced packaging	Automotive lighting, outdoor displays, emergency signage
UV LEDs	Ultraviolet spectrum emission (280-400nm)	Sterilization equipment, counterfeit detection, curing systems

3. Structure and Composition

Typical discrete LED construction includes:

Die: Semiconductor chip (GaN/InGaN for blue/green, AlGaInP for red)
Encapsulation: Epoxy or silicone lens for light extraction and protection
Lead Frame: Copper or iron alloy for electrical connection and heat dissipation
Phosphor Coating: Used in white LEDs for wavelength conversion
Reflective Cup: Optimizes light directionality

4. Key Technical Parameters

Parameter	Significance	Typical Range
Wavelength	Determines light color and application suitability	375nm-940nm
Luminous Intensity	Measures brightness output (mcd)	50-10,000mcd
Forward Current	Operating current rating	20-150mA
Forward Voltage	Electrical potential drop	1.8-3.6V
Viewing Angle	Light emission spread measurement	5 -120

5. Application Fields

Primary application sectors include:

Consumer Electronics: Mobile phone indicators, keyboard backlighting
Automotive: Dashboard indicators, brake light systems
Industrial: Machine status indicators, safety signage
Medical: Diagnostic equipment indicators, phototherapy devices
Telecommunications: Network equipment status lights

6. Leading Manufacturers and Products

Manufacturer	Product Series	Key Features
Cree Inc.	XLamp XP-G3	High brightness (3200mcd), 120 viewing angle
OSRAM Opto	OSTAR Projection	High-power LED for automotive lighting
Nichia Corp.	NSHU5991	UV LED (365nm) for curing applications
Everlight Electronics	LTST-C19HE8WT	Tri-color LED for RGB indication

7. Selection Recommendations

Key consideration factors:

Spectral Requirements: Match wavelength to application needs
Environmental Conditions: Temperature range (-40 C to +85 C typical)
Power Constraints: Select appropriate current/voltage ratings
Optical Design: Consider lens type and viewing angle
Reliability: Check MTTF (Mean Time to Failure) specifications

Industry Development Trends

Current technology directions include:

Miniaturization: Development of micro-LED ( LED) with dimensions <50 m
Efficiency Improvement: Targeting >300lm/W efficacy for visible LEDs
Smart Integration: Incorporating driver ICs and sensors in LED packages
Material Innovation: GaN-on-silicon substrates for cost reduction
Regulatory Compliance: RoHS/REACH compliant packaging materials