LED Indication - Discrete

Part Number	Description / PDF	Quantity
SLI-343M8G3F ROHM Semiconductor	LED GREEN DIFFUSED T-1 T/H	5041
CS85BW2C ChromeLED	LED WHITE CLEAR 0805 SMD	75
MV5B60 Everlight Electronics	LED BLUE CLEAR T-1 T/H	1187
QTLP610CRAGTR	SINGLE COLOR LED, RED, WATER CLE	2000
HSMM-C120 Broadcom	LED GREEN CLEAR CHIP SMD R/A	5153
APL3015SRCPRV-F01 Kingbright	LED RED CLEAR CHIP SMD	26096
HLMP-3507-EF000 Broadcom	LED GREEN DIFFUSED T-1 3/4 T/H	0
L513SRD-C American Opto Plus LED Corp.	5MM RED LED LAMP	95282
HLMP-Y402-G0000 Broadcom	LED ORANGE CLEAR T-1 T/H	51992
L403YD American Opto Plus LED Corp.	2X5X7MM YELLOW LED LAMP FLAT TOP	4929
SML-D14YWT86C ROHM Semiconductor	LED YELLOW 1608 SMD	2877
SMTL2-UPGC Califia Lighting (Bivar)	LED GREEN CLEAR 2PLCC SMD	2001
APHB1608ZGKSURKC Kingbright	LED GREEN/RED CLEAR 4SMD	34893
WP113HDT Kingbright	LED RED DIFF RECT 2MMX5MM T/H	1143
C503C-WAN-CBBDB152 Cree	LED COOL WHITE CLR 5MM RND T/H	25230
HSMA-A101-S3WJ1 Broadcom	LED AMBER CLEAR 2PLCC SMD	23545
5972301202F Dialight	LED GREEN CLEAR SMD R/A	1208200
CS126AGT2C ChromeLED	LED GREEN CLEAR 1206 SMD	30
XZM2MOK81FS SunLED	LED ORANGE CLEAR 2SMD R/A	0
SML-E12P8WT86 ROHM Semiconductor	LED GREEN DIFFUSED 0603 SMD	14465

LED Indication - Discrete

1. Overview

Discrete Light Emitting Diodes (LEDs) are single-chip optoelectronic devices that convert electrical energy into light through electroluminescence. This product category forms the foundation of modern indication systems, offering advantages including low power consumption, long lifespan, and high reliability. Their importance spans across consumer electronics, industrial equipment, automotive systems, and communication infrastructure.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
Visible LEDs	Emits light in visible spectrum (400-700nm), available in multiple colors	Indicator lamps, display backlighting, decorative lighting
Infrared LEDs	Emits 700nm-1mm wavelength radiation, invisible to human eye	Remote controls, security sensors, night vision systems
High-Brightness LEDs	Enhanced luminous intensity (>1000mcd) with advanced packaging	Automotive lighting, outdoor displays, emergency signage
UV LEDs	Ultraviolet spectrum emission (280-400nm)	Sterilization equipment, counterfeit detection, curing systems

3. Structure and Composition

Typical discrete LED construction includes:

Die: Semiconductor chip (GaN/InGaN for blue/green, AlGaInP for red)
Encapsulation: Epoxy or silicone lens for light extraction and protection
Lead Frame: Copper or iron alloy for electrical connection and heat dissipation
Phosphor Coating: Used in white LEDs for wavelength conversion
Reflective Cup: Optimizes light directionality

4. Key Technical Parameters

Parameter	Significance	Typical Range
Wavelength	Determines light color and application suitability	375nm-940nm
Luminous Intensity	Measures brightness output (mcd)	50-10,000mcd
Forward Current	Operating current rating	20-150mA
Forward Voltage	Electrical potential drop	1.8-3.6V
Viewing Angle	Light emission spread measurement	5 -120

5. Application Fields

Primary application sectors include:

Consumer Electronics: Mobile phone indicators, keyboard backlighting
Automotive: Dashboard indicators, brake light systems
Industrial: Machine status indicators, safety signage
Medical: Diagnostic equipment indicators, phototherapy devices
Telecommunications: Network equipment status lights

6. Leading Manufacturers and Products

Manufacturer	Product Series	Key Features
Cree Inc.	XLamp XP-G3	High brightness (3200mcd), 120 viewing angle
OSRAM Opto	OSTAR Projection	High-power LED for automotive lighting
Nichia Corp.	NSHU5991	UV LED (365nm) for curing applications
Everlight Electronics	LTST-C19HE8WT	Tri-color LED for RGB indication

7. Selection Recommendations

Key consideration factors:

Spectral Requirements: Match wavelength to application needs
Environmental Conditions: Temperature range (-40 C to +85 C typical)
Power Constraints: Select appropriate current/voltage ratings
Optical Design: Consider lens type and viewing angle
Reliability: Check MTTF (Mean Time to Failure) specifications

Industry Development Trends

Current technology directions include:

Miniaturization: Development of micro-LED ( LED) with dimensions <50 m
Efficiency Improvement: Targeting >300lm/W efficacy for visible LEDs
Smart Integration: Incorporating driver ICs and sensors in LED packages
Material Innovation: GaN-on-silicon substrates for cost reduction
Regulatory Compliance: RoHS/REACH compliant packaging materials