LED Indication - Discrete

Part Number	Description / PDF	Quantity
LW T6SC-S2V1-5K8L-Z OSRAM Opto Semiconductors, Inc.	LED WHITE DIFFUSED 2PLCC SMD	0
QBLP601-YG QT Brightek	LED GREEN CLEAR 0603 SMD	5
SLI-570DT3F ROHM Semiconductor	LED ORANGE CLEAR T-1 3/4 T/H	3873
XLUGY37M SunLED	LED GREEN/YELLOW DIFF T-1 T/H	0
HLMP-6600-G0011 Broadcom	LED RED DIFFUSED GULL WING SMD	13668
HSMN-C191 Broadcom	LED BLUE DIFFUSED CHIP SMD	3559
AA3528SECK Kingbright	LED ORANGE CLEAR SMD	13388
5972712607F Dialight	LED RGB DIFFUSED 1208 SMD R/A	0
IN-S126ATR Inolux	LED RED CLEAR 1206 SMD	3352
SML-310DTT86 ROHM Semiconductor	LED ORANGE CLEAR 0603 SMD	23501
MT6224-AHRG-A Marktech Optoelectronics	LED GRN/RED DIFF 5MM ROUND T/H	0
SML-LX15SRC-TR Lumex, Inc.	LED RED CLEAR SOT23 SMD	12595
CTL1206DWH1T Venkel LTD	LED 1206 DOME LENS WHITE	0
WP56BGD Kingbright	LED GRN DIFF T-1 3/4 BLINKNG T/H	0
SML-010VTT87 ROHM Semiconductor	LED RED CLEAR 3020 SMD	2983
HSMU-A100-R00J1 Broadcom	LED AMBER CLEAR 2PLCC SMD	36810
LTST-S110KGKT Lite-On, Inc.	LED GREEN CLEAR SMD R/A	19041
HSMD-C197 Broadcom	LED ORANGE DIFFUSED 0603 SMD	0
SLR-332YCT32 ROHM Semiconductor	LED YELLOW CLEAR T-1 T/H	0
XZMYR155W SunLED	LED YELLOW CLEAR 2SMD	8669

LED Indication - Discrete

1. Overview

Discrete Light Emitting Diodes (LEDs) are single-chip optoelectronic devices that convert electrical energy into light through electroluminescence. This product category forms the foundation of modern indication systems, offering advantages including low power consumption, long lifespan, and high reliability. Their importance spans across consumer electronics, industrial equipment, automotive systems, and communication infrastructure.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
Visible LEDs	Emits light in visible spectrum (400-700nm), available in multiple colors	Indicator lamps, display backlighting, decorative lighting
Infrared LEDs	Emits 700nm-1mm wavelength radiation, invisible to human eye	Remote controls, security sensors, night vision systems
High-Brightness LEDs	Enhanced luminous intensity (>1000mcd) with advanced packaging	Automotive lighting, outdoor displays, emergency signage
UV LEDs	Ultraviolet spectrum emission (280-400nm)	Sterilization equipment, counterfeit detection, curing systems

3. Structure and Composition

Typical discrete LED construction includes:

Die: Semiconductor chip (GaN/InGaN for blue/green, AlGaInP for red)
Encapsulation: Epoxy or silicone lens for light extraction and protection
Lead Frame: Copper or iron alloy for electrical connection and heat dissipation
Phosphor Coating: Used in white LEDs for wavelength conversion
Reflective Cup: Optimizes light directionality

4. Key Technical Parameters

Parameter	Significance	Typical Range
Wavelength	Determines light color and application suitability	375nm-940nm
Luminous Intensity	Measures brightness output (mcd)	50-10,000mcd
Forward Current	Operating current rating	20-150mA
Forward Voltage	Electrical potential drop	1.8-3.6V
Viewing Angle	Light emission spread measurement	5 -120

5. Application Fields

Primary application sectors include:

Consumer Electronics: Mobile phone indicators, keyboard backlighting
Automotive: Dashboard indicators, brake light systems
Industrial: Machine status indicators, safety signage
Medical: Diagnostic equipment indicators, phototherapy devices
Telecommunications: Network equipment status lights

6. Leading Manufacturers and Products

Manufacturer	Product Series	Key Features
Cree Inc.	XLamp XP-G3	High brightness (3200mcd), 120 viewing angle
OSRAM Opto	OSTAR Projection	High-power LED for automotive lighting
Nichia Corp.	NSHU5991	UV LED (365nm) for curing applications
Everlight Electronics	LTST-C19HE8WT	Tri-color LED for RGB indication

7. Selection Recommendations

Key consideration factors:

Spectral Requirements: Match wavelength to application needs
Environmental Conditions: Temperature range (-40 C to +85 C typical)
Power Constraints: Select appropriate current/voltage ratings
Optical Design: Consider lens type and viewing angle
Reliability: Check MTTF (Mean Time to Failure) specifications

Industry Development Trends

Current technology directions include:

Miniaturization: Development of micro-LED ( LED) with dimensions <50 m
Efficiency Improvement: Targeting >300lm/W efficacy for visible LEDs
Smart Integration: Incorporating driver ICs and sensors in LED packages
Material Innovation: GaN-on-silicon substrates for cost reduction
Regulatory Compliance: RoHS/REACH compliant packaging materials