LED Indication - Discrete

Part Number	Description / PDF	Quantity
HSMF-C156 Broadcom	LED GRN/YELLOW DIFFUSED CHIP SMD	27369
VLMR33T1U2-GS08 Vishay / Semiconductor - Opto Division	LED AMBER 2PLCC SMD	7470
IN-S66TBTRGB Inolux	LED RGB CLEAR 0606 SMD	187485
EALP05RDGGA1 Everlight Electronics	5MM, WATERCLEAR	123
WP7113SEC/J4 Kingbright	LED ORANGE CLEAR T-1 3/4 T/H	18831
QBLP601-Y QT Brightek	LED YELLOW CLEAR 0603 SMD	25674
SML013BDTT86 ROHM Semiconductor	LED BLUE CLEAR 3020 SMD	0
WP908A8GD Kingbright	LED GREEN DIFFUSED T-1 T/H	3671
SML-Z14U4TT86 ROHM Semiconductor	LED RED CLEAR 2PLCC SMD	1
APHHS1005ZGC Kingbright	LED GREEN CLEAR CHIP SMD	64819
WP115VEYW Kingbright	LED RED/YELLOW DIFFUSED T-1 T/H	422
WP1503GC Kingbright	LED GREEN CLEAR T-1 3/4 T/H	0
WP7113SRC/J4 Kingbright	LED RED CLEAR T-1 3/4 T/H	2136
SM0805AC Califia Lighting (Bivar)	LED AMBER CLEAR 0805 SMD	6929
LA T67D-U2AA-24-1-20-R18-Z OSRAM Opto Semiconductors, Inc.	LED AMBER CLEAR 2PLCC SMD	1831
155124YS73200A Würth Elektronik Midcom	LED YELLOW CLEAR 1206 SMD R/A	2254
HSMF-C171 Broadcom	CHIPBICLRORG/BLUE	5998
5988370100F Dialight	LED GREEN CLEAR 1208 R/A SMD	0
HSMM-C190 Broadcom	LED GREEN DIFFUSED CHIP SMD	7450
KW DSLP31.CC-GXHX-4C8E-Z444-60-R18 OSRAM Opto Semiconductors, Inc.	OSTUNE E1608 AND E3030	1000

LED Indication - Discrete

1. Overview

Discrete Light Emitting Diodes (LEDs) are single-chip optoelectronic devices that convert electrical energy into light through electroluminescence. This product category forms the foundation of modern indication systems, offering advantages including low power consumption, long lifespan, and high reliability. Their importance spans across consumer electronics, industrial equipment, automotive systems, and communication infrastructure.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
Visible LEDs	Emits light in visible spectrum (400-700nm), available in multiple colors	Indicator lamps, display backlighting, decorative lighting
Infrared LEDs	Emits 700nm-1mm wavelength radiation, invisible to human eye	Remote controls, security sensors, night vision systems
High-Brightness LEDs	Enhanced luminous intensity (>1000mcd) with advanced packaging	Automotive lighting, outdoor displays, emergency signage
UV LEDs	Ultraviolet spectrum emission (280-400nm)	Sterilization equipment, counterfeit detection, curing systems

3. Structure and Composition

Typical discrete LED construction includes:

Die: Semiconductor chip (GaN/InGaN for blue/green, AlGaInP for red)
Encapsulation: Epoxy or silicone lens for light extraction and protection
Lead Frame: Copper or iron alloy for electrical connection and heat dissipation
Phosphor Coating: Used in white LEDs for wavelength conversion
Reflective Cup: Optimizes light directionality

4. Key Technical Parameters

Parameter	Significance	Typical Range
Wavelength	Determines light color and application suitability	375nm-940nm
Luminous Intensity	Measures brightness output (mcd)	50-10,000mcd
Forward Current	Operating current rating	20-150mA
Forward Voltage	Electrical potential drop	1.8-3.6V
Viewing Angle	Light emission spread measurement	5 -120

5. Application Fields

Primary application sectors include:

Consumer Electronics: Mobile phone indicators, keyboard backlighting
Automotive: Dashboard indicators, brake light systems
Industrial: Machine status indicators, safety signage
Medical: Diagnostic equipment indicators, phototherapy devices
Telecommunications: Network equipment status lights

6. Leading Manufacturers and Products

Manufacturer	Product Series	Key Features
Cree Inc.	XLamp XP-G3	High brightness (3200mcd), 120 viewing angle
OSRAM Opto	OSTAR Projection	High-power LED for automotive lighting
Nichia Corp.	NSHU5991	UV LED (365nm) for curing applications
Everlight Electronics	LTST-C19HE8WT	Tri-color LED for RGB indication

7. Selection Recommendations

Key consideration factors:

Spectral Requirements: Match wavelength to application needs
Environmental Conditions: Temperature range (-40 C to +85 C typical)
Power Constraints: Select appropriate current/voltage ratings
Optical Design: Consider lens type and viewing angle
Reliability: Check MTTF (Mean Time to Failure) specifications

Industry Development Trends

Current technology directions include:

Miniaturization: Development of micro-LED ( LED) with dimensions <50 m
Efficiency Improvement: Targeting >300lm/W efficacy for visible LEDs
Smart Integration: Incorporating driver ICs and sensors in LED packages
Material Innovation: GaN-on-silicon substrates for cost reduction
Regulatory Compliance: RoHS/REACH compliant packaging materials